JPH0263308B2 - - Google Patents
Info
- Publication number
- JPH0263308B2 JPH0263308B2 JP58097027A JP9702783A JPH0263308B2 JP H0263308 B2 JPH0263308 B2 JP H0263308B2 JP 58097027 A JP58097027 A JP 58097027A JP 9702783 A JP9702783 A JP 9702783A JP H0263308 B2 JPH0263308 B2 JP H0263308B2
- Authority
- JP
- Japan
- Prior art keywords
- copper
- metal
- container
- alloy
- essentially
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H10W95/00—
-
- H10W76/134—
-
- H10W76/60—
-
- H10W72/5524—
-
- H10W72/884—
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Joining Of Glass To Other Materials (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US40564082A | 1982-08-05 | 1982-08-05 | |
| US405640 | 1982-08-05 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5933851A JPS5933851A (ja) | 1984-02-23 |
| JPH0263308B2 true JPH0263308B2 (enExample) | 1990-12-27 |
Family
ID=23604557
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58097027A Granted JPS5933851A (ja) | 1982-08-05 | 1983-06-02 | 気密封止半導体容器 |
Country Status (4)
| Country | Link |
|---|---|
| EP (1) | EP0100817B1 (enExample) |
| JP (1) | JPS5933851A (enExample) |
| CA (1) | CA1201211A (enExample) |
| DE (1) | DE3379562D1 (enExample) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0164794B1 (en) * | 1984-06-14 | 1990-07-25 | Advanced Micro Devices, Inc. | Multi-layer heat sinking integrated circuit package |
| DE3587085T2 (de) * | 1984-09-19 | 1993-09-16 | Olin Corp | Hermetisch verschlossenes halbleitergehaeuse. |
| US4939316A (en) * | 1988-10-05 | 1990-07-03 | Olin Corporation | Aluminum alloy semiconductor packages |
| FR2642257B1 (fr) * | 1989-01-20 | 1996-05-24 | Dassault Electronique | Procede de scellement verre-aluminium, notamment pour traversee electrique de boitier de circuit hybride, objet composite et composition de verre correspondants |
| FR2648275A1 (fr) * | 1989-06-09 | 1990-12-14 | Thomson Csf | Procede et dispositif d'encapsulation de modules hyperfrequence |
| EP0485627B1 (en) * | 1990-05-31 | 2004-10-20 | Kabushiki Kaisha Toshiba | Lead frame and semiconductor package using it |
| DE102008025202B4 (de) | 2008-05-27 | 2014-11-06 | Epcos Ag | Hermetisch geschlossenes Gehäuse für elektronische Bauelemente und Herstellungsverfahren |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR1284534A (fr) * | 1959-05-06 | 1962-02-16 | Texas Instruments Inc | Fabrication de dispositifs semi-conducteurs |
| US3381080A (en) * | 1962-07-02 | 1968-04-30 | Westinghouse Electric Corp | Hermetically sealed semiconductor device |
| US3340602A (en) * | 1965-02-01 | 1967-09-12 | Philco Ford Corp | Process for sealing |
| US3546363A (en) * | 1967-01-11 | 1970-12-08 | Olin Corp | Composite glass-to-metal seal |
| GB1369627A (en) * | 1970-12-18 | 1974-10-09 | Hitachi Ltd | Method for manufacturing a printed ceramic substrate |
| DE3010076A1 (de) * | 1980-03-15 | 1981-09-24 | W.C. Heraeus Gmbh, 6450 Hanau | Halbzeug fuer die herstellung von metalldeckeln zum verschliessen von gehaeusen aus keramischem werkstoff |
-
1983
- 1983-04-26 CA CA000426743A patent/CA1201211A/en not_active Expired
- 1983-04-27 DE DE8383104133T patent/DE3379562D1/de not_active Expired
- 1983-04-27 EP EP83104133A patent/EP0100817B1/en not_active Expired
- 1983-06-02 JP JP58097027A patent/JPS5933851A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| DE3379562D1 (en) | 1989-05-11 |
| CA1201211A (en) | 1986-02-25 |
| EP0100817A3 (en) | 1986-01-22 |
| EP0100817B1 (en) | 1989-04-05 |
| EP0100817A2 (en) | 1984-02-22 |
| JPS5933851A (ja) | 1984-02-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4656499A (en) | Hermetically sealed semiconductor casing | |
| US4784974A (en) | Method of making a hermetically sealed semiconductor casing | |
| US4577056A (en) | Hermetically sealed metal package | |
| US5001546A (en) | Clad metal lead frame substrates | |
| US4727633A (en) | Method of securing metallic members together | |
| US4542259A (en) | High density packages | |
| US4558346A (en) | Highly reliable hermetically sealed package for a semiconductor device | |
| JPS5873904A (ja) | 銀充填ガラス | |
| JPH0263308B2 (enExample) | ||
| US6011305A (en) | Semiconductor device having metal alloy for electrodes | |
| JPH0817870A (ja) | 半導体装置 | |
| JPS5936425B2 (ja) | 中間層を有するリ−ドフレ−ム構造 | |
| JPS6232622B2 (enExample) | ||
| EP0869548A1 (en) | Resin-sealed wireless bonded semiconductor device | |
| JPH0196952A (ja) | 気密封止チツプキヤリア | |
| JPS5961054A (ja) | 半導体装置 | |
| JPS6129139A (ja) | 半導体装置 | |
| JPH02253627A (ja) | 半導体装置 | |
| JPH0525182B2 (enExample) | ||
| JPS6292354A (ja) | ハイブリツドic | |
| JPS6175548A (ja) | 半導体装置 | |
| GB2152074A (en) | Low temperature Au-Ge-Si brazing alloy | |
| JPH01106454A (ja) | 樹脂封止型半導体装置 | |
| JP2007123465A (ja) | 電子部品収納用パッケージおよび電子装置およびその製造方法 | |
| JPH11330108A (ja) | 電子部品の接合方法及び接合材 |