DE3379562D1 - A hermetically sealed casing of an electrical device and process of manufacturing - Google Patents
A hermetically sealed casing of an electrical device and process of manufacturingInfo
- Publication number
- DE3379562D1 DE3379562D1 DE8383104133T DE3379562T DE3379562D1 DE 3379562 D1 DE3379562 D1 DE 3379562D1 DE 8383104133 T DE8383104133 T DE 8383104133T DE 3379562 T DE3379562 T DE 3379562T DE 3379562 D1 DE3379562 D1 DE 3379562D1
- Authority
- DE
- Germany
- Prior art keywords
- manufacturing
- electrical device
- hermetically sealed
- sealed casing
- casing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H10W95/00—
-
- H10W76/134—
-
- H10W76/60—
-
- H10W72/5524—
-
- H10W72/884—
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US40564082A | 1982-08-05 | 1982-08-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE3379562D1 true DE3379562D1 (en) | 1989-05-11 |
Family
ID=23604557
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE8383104133T Expired DE3379562D1 (en) | 1982-08-05 | 1983-04-27 | A hermetically sealed casing of an electrical device and process of manufacturing |
Country Status (4)
| Country | Link |
|---|---|
| EP (1) | EP0100817B1 (enExample) |
| JP (1) | JPS5933851A (enExample) |
| CA (1) | CA1201211A (enExample) |
| DE (1) | DE3379562D1 (enExample) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0164794B1 (en) * | 1984-06-14 | 1990-07-25 | Advanced Micro Devices, Inc. | Multi-layer heat sinking integrated circuit package |
| DE3587085T2 (de) * | 1984-09-19 | 1993-09-16 | Olin Corp | Hermetisch verschlossenes halbleitergehaeuse. |
| US4939316A (en) * | 1988-10-05 | 1990-07-03 | Olin Corporation | Aluminum alloy semiconductor packages |
| FR2642257B1 (fr) * | 1989-01-20 | 1996-05-24 | Dassault Electronique | Procede de scellement verre-aluminium, notamment pour traversee electrique de boitier de circuit hybride, objet composite et composition de verre correspondants |
| FR2648275A1 (fr) * | 1989-06-09 | 1990-12-14 | Thomson Csf | Procede et dispositif d'encapsulation de modules hyperfrequence |
| EP0485627B1 (en) * | 1990-05-31 | 2004-10-20 | Kabushiki Kaisha Toshiba | Lead frame and semiconductor package using it |
| DE102008025202B4 (de) | 2008-05-27 | 2014-11-06 | Epcos Ag | Hermetisch geschlossenes Gehäuse für elektronische Bauelemente und Herstellungsverfahren |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR1284534A (fr) * | 1959-05-06 | 1962-02-16 | Texas Instruments Inc | Fabrication de dispositifs semi-conducteurs |
| US3381080A (en) * | 1962-07-02 | 1968-04-30 | Westinghouse Electric Corp | Hermetically sealed semiconductor device |
| US3340602A (en) * | 1965-02-01 | 1967-09-12 | Philco Ford Corp | Process for sealing |
| US3546363A (en) * | 1967-01-11 | 1970-12-08 | Olin Corp | Composite glass-to-metal seal |
| GB1369627A (en) * | 1970-12-18 | 1974-10-09 | Hitachi Ltd | Method for manufacturing a printed ceramic substrate |
| DE3010076A1 (de) * | 1980-03-15 | 1981-09-24 | W.C. Heraeus Gmbh, 6450 Hanau | Halbzeug fuer die herstellung von metalldeckeln zum verschliessen von gehaeusen aus keramischem werkstoff |
-
1983
- 1983-04-26 CA CA000426743A patent/CA1201211A/en not_active Expired
- 1983-04-27 DE DE8383104133T patent/DE3379562D1/de not_active Expired
- 1983-04-27 EP EP83104133A patent/EP0100817B1/en not_active Expired
- 1983-06-02 JP JP58097027A patent/JPS5933851A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| CA1201211A (en) | 1986-02-25 |
| EP0100817A3 (en) | 1986-01-22 |
| JPH0263308B2 (enExample) | 1990-12-27 |
| EP0100817B1 (en) | 1989-04-05 |
| EP0100817A2 (en) | 1984-02-22 |
| JPS5933851A (ja) | 1984-02-23 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8364 | No opposition during term of opposition | ||
| 8339 | Ceased/non-payment of the annual fee |