DE3379562D1 - A hermetically sealed casing of an electrical device and process of manufacturing - Google Patents

A hermetically sealed casing of an electrical device and process of manufacturing

Info

Publication number
DE3379562D1
DE3379562D1 DE8383104133T DE3379562T DE3379562D1 DE 3379562 D1 DE3379562 D1 DE 3379562D1 DE 8383104133 T DE8383104133 T DE 8383104133T DE 3379562 T DE3379562 T DE 3379562T DE 3379562 D1 DE3379562 D1 DE 3379562D1
Authority
DE
Germany
Prior art keywords
manufacturing
electrical device
hermetically sealed
sealed casing
casing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8383104133T
Other languages
German (de)
English (en)
Inventor
Sheldon H Butt
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Olin Corp
Original Assignee
Olin Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Olin Corp filed Critical Olin Corp
Application granted granted Critical
Publication of DE3379562D1 publication Critical patent/DE3379562D1/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W95/00—Packaging processes not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H10W76/134—Containers comprising a conductive base serving as an interconnection having other interconnections parallel to the conductive base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/60—Seals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
DE8383104133T 1982-08-05 1983-04-27 A hermetically sealed casing of an electrical device and process of manufacturing Expired DE3379562D1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US40564082A 1982-08-05 1982-08-05

Publications (1)

Publication Number Publication Date
DE3379562D1 true DE3379562D1 (en) 1989-05-11

Family

ID=23604557

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8383104133T Expired DE3379562D1 (en) 1982-08-05 1983-04-27 A hermetically sealed casing of an electrical device and process of manufacturing

Country Status (4)

Country Link
EP (1) EP0100817B1 (enExample)
JP (1) JPS5933851A (enExample)
CA (1) CA1201211A (enExample)
DE (1) DE3379562D1 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3578830D1 (de) * 1984-06-14 1990-08-30 Advanced Micro Devices Inc Mehrschicht-waermesenkpackung fuer integrierte schaltung.
EP0178481B1 (en) * 1984-09-19 1993-02-10 Olin Corporation Hermetically sealed semiconductor package
US4939316A (en) * 1988-10-05 1990-07-03 Olin Corporation Aluminum alloy semiconductor packages
FR2642257B1 (fr) * 1989-01-20 1996-05-24 Dassault Electronique Procede de scellement verre-aluminium, notamment pour traversee electrique de boitier de circuit hybride, objet composite et composition de verre correspondants
FR2648275A1 (fr) * 1989-06-09 1990-12-14 Thomson Csf Procede et dispositif d'encapsulation de modules hyperfrequence
JP3431139B2 (ja) * 1990-05-31 2003-07-28 株式会社東芝 リードフレームとその製造方法および半導体パッケージ
DE102008025202B4 (de) 2008-05-27 2014-11-06 Epcos Ag Hermetisch geschlossenes Gehäuse für elektronische Bauelemente und Herstellungsverfahren

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1284534A (fr) * 1959-05-06 1962-02-16 Texas Instruments Inc Fabrication de dispositifs semi-conducteurs
US3381080A (en) * 1962-07-02 1968-04-30 Westinghouse Electric Corp Hermetically sealed semiconductor device
US3340602A (en) * 1965-02-01 1967-09-12 Philco Ford Corp Process for sealing
US3546363A (en) * 1967-01-11 1970-12-08 Olin Corp Composite glass-to-metal seal
GB1369627A (en) * 1970-12-18 1974-10-09 Hitachi Ltd Method for manufacturing a printed ceramic substrate
DE3010076A1 (de) * 1980-03-15 1981-09-24 W.C. Heraeus Gmbh, 6450 Hanau Halbzeug fuer die herstellung von metalldeckeln zum verschliessen von gehaeusen aus keramischem werkstoff

Also Published As

Publication number Publication date
CA1201211A (en) 1986-02-25
JPS5933851A (ja) 1984-02-23
JPH0263308B2 (enExample) 1990-12-27
EP0100817A3 (en) 1986-01-22
EP0100817A2 (en) 1984-02-22
EP0100817B1 (en) 1989-04-05

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee