JPH0262773U - - Google Patents
Info
- Publication number
- JPH0262773U JPH0262773U JP14153788U JP14153788U JPH0262773U JP H0262773 U JPH0262773 U JP H0262773U JP 14153788 U JP14153788 U JP 14153788U JP 14153788 U JP14153788 U JP 14153788U JP H0262773 U JPH0262773 U JP H0262773U
- Authority
- JP
- Japan
- Prior art keywords
- resistance layer
- conductor lands
- arrangement direction
- wiring board
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 5
- 238000005476 soldering Methods 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 3
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は、本考案に係るプリント配線板の一実
施例を示す要部平面図、第２図は、第１図のプリ
ント配線板の要部側面断面図、第３図は、第１図
のプリント配線板と従来例を比較した説明図、第
４図は、従来のプリント配線板を示す要部平面図
、第５図は、第４図のプリント配線板の要部側面
断面図、第６図は、他の従来のプリント配線板を
示す要部平面図、第７図は、第６図のプリント配
線板の要部側面断面図である。
１１……絶縁基板、１２……導体ランド、１３
……電子部品、１４……リード端子、１５……貫
通孔、１６……第１はんだ付け抵抗層、１７……
第２はんだ付け抵抗層、１６ａ，１６ｂ，１７ａ
，１７ｂ……先細り突起部、１６ｃ，１６ｄ，１
７ｃ，１７ｄ……切り欠き部。
FIG. 1 is a plan view of essential parts showing an embodiment of the printed wiring board according to the present invention, FIG. 2 is a side sectional view of essential parts of the printed wiring board of FIG. 1, and FIG. FIG. 4 is a plan view of the main parts of the conventional printed wiring board, FIG. 5 is a side sectional view of the main parts of the printed wiring board of FIG. 4, and FIG. FIG. 6 is a plan view of the main parts of another conventional printed wiring board, and FIG. 7 is a side sectional view of the main parts of the printed wiring board of FIG. 11...Insulating substrate, 12...Conductor land, 13
...Electronic component, 14... Lead terminal, 15... Through hole, 16... First soldering resistance layer, 17...
Second soldering resistance layer, 16a, 16b, 17a
, 17b...Tapered protrusion, 16c, 16d, 1
7c, 17d...notch portion.
Claims (1)
列方向に沿つて形成された絶縁基板と、前記絶縁
基板の下面の前記貫通孔の回りにそれぞれ形成さ
れた複数の導体ランドと、先細り突起部が前記導
体ランドの配列方向と直交方向にそれぞれ伸びる
ように、略半円形状の切り欠き部が前記導体ラン
ドの配列方向に沿つて対称に、かつ前記導体ラン
ド上に乗り上げるように形成されたはんだ付け抵
抗層とを有するプリント配線板。 (2) 前記はんだ付け抵抗層がシルク印刷により
形成されていることを特徴とする請求項(1)記載
のプリント配線板。[Claims for Utility Model Registration] (1) An insulated substrate in which a plurality of through holes are formed along the arrangement direction of lead terminals of an electronic component, and each of which is formed around the through holes on the lower surface of the insulated substrate. The approximately semicircular notch portions are arranged symmetrically along the arrangement direction of the conductor lands so that the plurality of conductor lands and the tapered protrusions extend in a direction orthogonal to the arrangement direction of the conductor lands, and the plurality of conductor lands. A printed wiring board having a soldering resistance layer formed to ride on the soldering resistance layer. (2) The printed wiring board according to claim (1), wherein the soldering resistance layer is formed by silk printing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14153788U JPH0262773U (en) | 1988-10-28 | 1988-10-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14153788U JPH0262773U (en) | 1988-10-28 | 1988-10-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0262773U true JPH0262773U (en) | 1990-05-10 |
Family
ID=31406688
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14153788U Pending JPH0262773U (en) | 1988-10-28 | 1988-10-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0262773U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3386281A4 (en) * | 2016-04-06 | 2019-03-06 | Mitsubishi Heavy Industries Thermal Systems, Ltd. | Wiring substrate, electronic-component-attached wiring substrate, and method for manufacturing electronic-component-attached wiring substrate |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61140193A (en) * | 1984-12-13 | 1986-06-27 | 松下電器産業株式会社 | Printed wiring board |
| JPS6226074B2 (en) * | 1979-05-17 | 1987-06-06 | Tokyo Shibaura Electric Co |
-
1988
- 1988-10-28 JP JP14153788U patent/JPH0262773U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6226074B2 (en) * | 1979-05-17 | 1987-06-06 | Tokyo Shibaura Electric Co | |
| JPS61140193A (en) * | 1984-12-13 | 1986-06-27 | 松下電器産業株式会社 | Printed wiring board |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3386281A4 (en) * | 2016-04-06 | 2019-03-06 | Mitsubishi Heavy Industries Thermal Systems, Ltd. | Wiring substrate, electronic-component-attached wiring substrate, and method for manufacturing electronic-component-attached wiring substrate |