JPH0260066B2 - - Google Patents

Info

Publication number
JPH0260066B2
JPH0260066B2 JP59064237A JP6423784A JPH0260066B2 JP H0260066 B2 JPH0260066 B2 JP H0260066B2 JP 59064237 A JP59064237 A JP 59064237A JP 6423784 A JP6423784 A JP 6423784A JP H0260066 B2 JPH0260066 B2 JP H0260066B2
Authority
JP
Japan
Prior art keywords
circuit board
conductor
support plate
probe
main body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP59064237A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60207343A (ja
Inventor
Ko Nakajima
Katsutoshi Saida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
YOKO SEISAKUSHO KK
Original Assignee
YOKO SEISAKUSHO KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by YOKO SEISAKUSHO KK filed Critical YOKO SEISAKUSHO KK
Priority to JP59064237A priority Critical patent/JPS60207343A/ja
Publication of JPS60207343A publication Critical patent/JPS60207343A/ja
Publication of JPH0260066B2 publication Critical patent/JPH0260066B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Electric Properties And Detecting Electric Faults (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP59064237A 1984-03-31 1984-03-31 回路基板等の検査装置 Granted JPS60207343A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59064237A JPS60207343A (ja) 1984-03-31 1984-03-31 回路基板等の検査装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59064237A JPS60207343A (ja) 1984-03-31 1984-03-31 回路基板等の検査装置

Publications (2)

Publication Number Publication Date
JPS60207343A JPS60207343A (ja) 1985-10-18
JPH0260066B2 true JPH0260066B2 (fr) 1990-12-14

Family

ID=13252320

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59064237A Granted JPS60207343A (ja) 1984-03-31 1984-03-31 回路基板等の検査装置

Country Status (1)

Country Link
JP (1) JPS60207343A (fr)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0815171B2 (ja) * 1987-05-27 1996-02-14 株式会社日立製作所 半導体素子検査装置
JPH0563049U (ja) * 1992-01-29 1993-08-20 日本電子材料株式会社 プローブカード接続ユニット
EP1060398B1 (fr) * 1998-03-04 2002-06-26 Teradyne, Inc. Interface a sondes coaxiales pour equipement automatique de controle
JP4466807B2 (ja) * 2001-04-24 2010-05-26 横河電機株式会社 Ｉｃテスタのポゴピンブロック
JP4689196B2 (ja) * 2003-11-05 2011-05-25 日本発條株式会社 導電性接触子ホルダ、導電性接触子ユニット
KR101954086B1 (ko) * 2017-11-07 2019-03-06 리노공업주식회사 검사 프로브 조립체 및 검사 소켓
JP7334791B2 (ja) * 2019-10-18 2023-08-29 株式会社村田製作所 検査用コネクタ及び検査用ユニット

Also Published As

Publication number Publication date
JPS60207343A (ja) 1985-10-18

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