JPH0259871B2 - - Google Patents

Info

Publication number
JPH0259871B2
JPH0259871B2 JP3699987A JP3699987A JPH0259871B2 JP H0259871 B2 JPH0259871 B2 JP H0259871B2 JP 3699987 A JP3699987 A JP 3699987A JP 3699987 A JP3699987 A JP 3699987A JP H0259871 B2 JPH0259871 B2 JP H0259871B2
Authority
JP
Japan
Prior art keywords
plating
mol
plating solution
ammonia
compound
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP3699987A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6324072A (ja
Inventor
Masaki Haga
Seiki Tsuji
Hidemi Nawafune
Shozo Mizumoto
Mamoru Uchida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ishihara Chemical Co Ltd
Original Assignee
Ishihara Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ishihara Chemical Co Ltd filed Critical Ishihara Chemical Co Ltd
Publication of JPS6324072A publication Critical patent/JPS6324072A/ja
Publication of JPH0259871B2 publication Critical patent/JPH0259871B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/48—Coating with alloys
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • C23C18/44—Coating with noble metals using reducing agents
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
JP3699987A 1986-03-04 1987-02-19 無電解パラジウム−ニツケル合金メツキ液 Granted JPS6324072A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP4672786 1986-03-04
JP61-46727 1986-03-04

Publications (2)

Publication Number Publication Date
JPS6324072A JPS6324072A (ja) 1988-02-01
JPH0259871B2 true JPH0259871B2 (enExample) 1990-12-13

Family

ID=12755369

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3699987A Granted JPS6324072A (ja) 1986-03-04 1987-02-19 無電解パラジウム−ニツケル合金メツキ液

Country Status (1)

Country Link
JP (1) JPS6324072A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015064529A1 (ja) * 2013-10-28 2015-05-07 東洋鋼鈑株式会社 合金めっき被覆材料、および合金めっき被覆材料の製造方法

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4557570B2 (ja) * 2004-03-01 2010-10-06 成之 上宮 水素分離用薄膜の製造方法
DE102006020988B4 (de) * 2006-05-04 2012-08-30 Nanogate Ag Edelmetallhaltiges Nickelbad, dessen Verwendung zur Herstellung einer edelmetallhaltigen Nickelschicht, edelmetallhaltige Nickelschicht sowie deren Verwendung
JP5525762B2 (ja) * 2008-07-01 2014-06-18 上村工業株式会社 無電解めっき液及びそれを用いた無電解めっき方法、並びに配線基板の製造方法
DE102008036211A1 (de) 2008-08-02 2010-02-04 Nanogate Ag Verfahren für die Abscheidung von Nickel und Edelmetall aus demselben Bad
WO2014010663A1 (ja) * 2012-07-13 2014-01-16 東洋鋼鈑株式会社 燃料電池用セパレータ、燃料電池セル、燃料電池スタック、および燃料電池用セパレータの製造方法
TWI713737B (zh) * 2016-05-04 2020-12-21 德商德國艾托特克公司 沉積金屬或金屬合金至基板表面及包含基板表面活化之方法
JP6934396B2 (ja) * 2017-11-06 2021-09-15 上村工業株式会社 無電解ニッケル−リン−コバルトめっき浴及び無電解ニッケル−リン−コバルトめっき皮膜

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015064529A1 (ja) * 2013-10-28 2015-05-07 東洋鋼鈑株式会社 合金めっき被覆材料、および合金めっき被覆材料の製造方法
US10000038B2 (en) 2013-10-28 2018-06-19 Toyo Kohan Co., Ltd. Alloy plate coated material and method of producing alloy plate coated material
US10525670B2 (en) 2013-10-28 2020-01-07 Toyo Kohan Co., Ltd. Alloy plate coated material and method of producing alloy plate coated material

Also Published As

Publication number Publication date
JPS6324072A (ja) 1988-02-01

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