JPH0259627B2 - - Google Patents

Info

Publication number
JPH0259627B2
JPH0259627B2 JP58132579A JP13257983A JPH0259627B2 JP H0259627 B2 JPH0259627 B2 JP H0259627B2 JP 58132579 A JP58132579 A JP 58132579A JP 13257983 A JP13257983 A JP 13257983A JP H0259627 B2 JPH0259627 B2 JP H0259627B2
Authority
JP
Japan
Prior art keywords
lead
metal wire
thin metal
bonding
semiconductor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58132579A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6024027A (ja
Inventor
Takao Myoshi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kansai Nippon Electric Co Ltd
Original Assignee
Kansai Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kansai Nippon Electric Co Ltd filed Critical Kansai Nippon Electric Co Ltd
Priority to JP58132579A priority Critical patent/JPS6024027A/ja
Publication of JPS6024027A publication Critical patent/JPS6024027A/ja
Publication of JPH0259627B2 publication Critical patent/JPH0259627B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/075—
    • H10W72/01571—
    • H10W72/07511—
    • H10W72/07533—
    • H10W72/536—

Landscapes

  • Wire Bonding (AREA)
JP58132579A 1983-07-19 1983-07-19 半導体装置の製造方法 Granted JPS6024027A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58132579A JPS6024027A (ja) 1983-07-19 1983-07-19 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58132579A JPS6024027A (ja) 1983-07-19 1983-07-19 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS6024027A JPS6024027A (ja) 1985-02-06
JPH0259627B2 true JPH0259627B2 (cg-RX-API-DMAC10.html) 1990-12-13

Family

ID=15084622

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58132579A Granted JPS6024027A (ja) 1983-07-19 1983-07-19 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS6024027A (cg-RX-API-DMAC10.html)

Also Published As

Publication number Publication date
JPS6024027A (ja) 1985-02-06

Similar Documents

Publication Publication Date Title
JPS5948546B2 (ja) リ−ドフレ−ム用金属ストリップ及びその製造方法
JPS6189643A (ja) 半導体装置及びその製造方法
US4767049A (en) Special surfaces for wire bonding
JPH0514425B2 (cg-RX-API-DMAC10.html)
JPH11176552A (ja) 端子と導体の接続方法
JPH1074879A (ja) 半導体装置用リードフレーム
JPH01257356A (ja) 半導体用リードフレーム
JPH0259627B2 (cg-RX-API-DMAC10.html)
JPH0141028B2 (cg-RX-API-DMAC10.html)
JPH0228260B2 (cg-RX-API-DMAC10.html)
JPS6242037B2 (cg-RX-API-DMAC10.html)
JPS63169056A (ja) リ−ドフレ−ム材料
JPS6218744A (ja) リ−ドフレ−ム
JPS61285743A (ja) 電気的装置
JPS62287634A (ja) 半導体素子結線用細線
JPH0674496B2 (ja) リードフレーム材料の製造方法
KR910007506B1 (ko) 반도체장치의 제조방법
JPS60144943A (ja) 半導体装置の製造方法
JPH09116064A (ja) リードフレーム材
JPS5944836A (ja) ワイヤ−ボンデイング方法
JPS60253107A (ja) 耐熱性Ａｇ被覆導体
JPH01115151A (ja) 半導体装置用リードフレーム
JPH055378B2 (cg-RX-API-DMAC10.html)
JPS5978551A (ja) 樹脂封止型半導体装置
JPS59144160A (ja) プラスチツク封止型ｉｃ