JPH0259237B2 - - Google Patents
Info
- Publication number
- JPH0259237B2 JPH0259237B2 JP11355482A JP11355482A JPH0259237B2 JP H0259237 B2 JPH0259237 B2 JP H0259237B2 JP 11355482 A JP11355482 A JP 11355482A JP 11355482 A JP11355482 A JP 11355482A JP H0259237 B2 JPH0259237 B2 JP H0259237B2
- Authority
- JP
- Japan
- Prior art keywords
- contact piece
- contact
- thick
- thickness
- plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000463 material Substances 0.000 claims description 26
- 239000011248 coating agent Substances 0.000 claims description 7
- 238000000576 coating method Methods 0.000 claims description 7
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 5
- 229910000990 Ni alloy Inorganic materials 0.000 claims description 5
- 229910052759 nickel Inorganic materials 0.000 claims description 5
- 229910052804 chromium Inorganic materials 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 229910052738 indium Inorganic materials 0.000 claims description 4
- 229910052718 tin Inorganic materials 0.000 claims description 4
- 238000007747 plating Methods 0.000 description 14
- 229910017518 Cu Zn Inorganic materials 0.000 description 5
- 229910017752 Cu-Zn Inorganic materials 0.000 description 5
- 229910017943 Cu—Zn Inorganic materials 0.000 description 5
- TVZPLCNGKSPOJA-UHFFFAOYSA-N copper zinc Chemical compound [Cu].[Zn] TVZPLCNGKSPOJA-UHFFFAOYSA-N 0.000 description 5
- 239000010410 layer Substances 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 230000003628 erosive effect Effects 0.000 description 3
- 239000002344 surface layer Substances 0.000 description 3
- 229910002482 Cu–Ni Inorganic materials 0.000 description 2
- 229910018487 Ni—Cr Inorganic materials 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 229910000906 Bronze Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 238000007733 ion plating Methods 0.000 description 1
- 238000011536 re-plating Methods 0.000 description 1
- 229910052702 rhenium Inorganic materials 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000007751 thermal spraying Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Motor Or Generator Current Collectors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11355482A JPS595582A (ja) | 1982-06-30 | 1982-06-30 | 整流子用接触片材料 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11355482A JPS595582A (ja) | 1982-06-30 | 1982-06-30 | 整流子用接触片材料 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS595582A JPS595582A (ja) | 1984-01-12 |
| JPH0259237B2 true JPH0259237B2 (de) | 1990-12-11 |
Family
ID=14615230
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11355482A Granted JPS595582A (ja) | 1982-06-30 | 1982-06-30 | 整流子用接触片材料 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS595582A (de) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61177393A (ja) * | 1985-01-31 | 1986-08-09 | Furukawa Electric Co Ltd:The | リン青銅のＳｎ又はＳｎ合金メツキ方法 |
| WO2002057511A1 (fr) * | 2001-01-19 | 2002-07-25 | The Furukawa Electric Co., Ltd. | Materiau revetu d'un placage metallique et son procede de preparation, et pieces electriques et electroniques les utilisant |
| JP2002226982A (ja) * | 2001-01-31 | 2002-08-14 | Dowa Mining Co Ltd | 耐熱性皮膜、その製造方法および電気電子部品 |
| CN111009759B (zh) * | 2019-12-23 | 2021-08-20 | 苏州威贝斯特电子科技有限公司 | 一种端子组合物及其插座连接器用制品 |
-
1982
- 1982-06-30 JP JP11355482A patent/JPS595582A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS595582A (ja) | 1984-01-12 |
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