JPH0258777B2 - - Google Patents
Info
- Publication number
- JPH0258777B2 JPH0258777B2 JP11277982A JP11277982A JPH0258777B2 JP H0258777 B2 JPH0258777 B2 JP H0258777B2 JP 11277982 A JP11277982 A JP 11277982A JP 11277982 A JP11277982 A JP 11277982A JP H0258777 B2 JPH0258777 B2 JP H0258777B2
- Authority
- JP
- Japan
- Prior art keywords
- pattern
- wafer
- patterns
- inspection
- mask
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000007689 inspection Methods 0.000 claims description 13
- 238000000034 method Methods 0.000 claims description 11
- 239000004065 semiconductor Substances 0.000 claims description 3
- 235000012431 wafers Nutrition 0.000 description 29
- 238000004519 manufacturing process Methods 0.000 description 11
- 238000005530 etching Methods 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57112779A JPS594019A (ja) | 1982-06-30 | 1982-06-30 | パタ−ン比較検査方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57112779A JPS594019A (ja) | 1982-06-30 | 1982-06-30 | パタ−ン比較検査方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS594019A JPS594019A (ja) | 1984-01-10 |
JPH0258777B2 true JPH0258777B2 (ko) | 1990-12-10 |
Family
ID=14595279
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP57112779A Granted JPS594019A (ja) | 1982-06-30 | 1982-06-30 | パタ−ン比較検査方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS594019A (ko) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR0172558B1 (ko) * | 1995-03-22 | 1999-03-20 | 김주용 | 노광 마스크의 제조방법 |
DE10142316A1 (de) | 2001-08-30 | 2003-04-17 | Advanced Micro Devices Inc | Halbleiterstruktur und Verfahren zur Bestimmung kritischer Dimensionen und Überlagerungsfehler |
DE10224164B4 (de) | 2002-05-31 | 2007-05-10 | Advanced Micro Devices, Inc., Sunnyvale | Eine zweidimensionale Struktur zum Bestimmen einer Überlagerungsgenauigkeit mittels Streuungsmessung |
CN1501174A (zh) | 2002-10-28 | 2004-06-02 | Asml | 检测掩模缺陷的方法,计算机程序和基准衬底 |
-
1982
- 1982-06-30 JP JP57112779A patent/JPS594019A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS594019A (ja) | 1984-01-10 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP0061536B1 (en) | Method of manufacturing a semiconductor device having improved alignment marks and alignment marks for said method | |
US8003984B1 (en) | Reticle for wafer test structure areas | |
JPH0258777B2 (ko) | ||
JP2663623B2 (ja) | レジストパターンの形成方法 | |
JPS58196445A (ja) | マスク検査方法 | |
JP2836391B2 (ja) | 半導体集積回路作製用マスク及びその検査方法 | |
JP2970043B2 (ja) | レチクルのパターン検査方法 | |
KR100255087B1 (ko) | 더미셀이 형성된 스테퍼용 레티클 | |
KR0168353B1 (ko) | 넌패턴 웨이퍼의 검사방법 | |
JPH07181686A (ja) | レジストパターンの形成方法 | |
US5545498A (en) | Method of producing semiconductor device and photomask therefor | |
JPS5919318A (ja) | 転写パタ−ンの位置ずれ検査方法および転写パタ−ンマスク | |
JPH06181169A (ja) | 露光装置、及び、半導体装置の製造方法 | |
JPH05175093A (ja) | ウエハ内位置表示を付したチップの製造方法 | |
JPH0414812A (ja) | パターン形成方法 | |
KR100611071B1 (ko) | 반도체 공정에서 마크 형성 방법 | |
JPH0757996A (ja) | 露光装置、及び、半導体装置の製造方法 | |
JPS59124127A (ja) | 電子線露光パタ−ンの評価方法 | |
JPS6331132A (ja) | パタ−ン描画精度検査方法 | |
JPH03180017A (ja) | 半導体装置の製造方法 | |
JPH0690142B2 (ja) | マスク検査方法 | |
JPH0214749B2 (ko) | ||
JPS63943B2 (ko) | ||
JPS6213027A (ja) | フォトマスクの欠陥検査方法 | |
JPH01276639A (ja) | パターン検査方法 |