JPH0256811B2 - - Google Patents

Info

Publication number
JPH0256811B2
JPH0256811B2 JP8453284A JP8453284A JPH0256811B2 JP H0256811 B2 JPH0256811 B2 JP H0256811B2 JP 8453284 A JP8453284 A JP 8453284A JP 8453284 A JP8453284 A JP 8453284A JP H0256811 B2 JPH0256811 B2 JP H0256811B2
Authority
JP
Japan
Prior art keywords
powdered resin
sip type
sip
terminal
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP8453284A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60227427A (ja
Inventor
Takayoshi Kokubu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP8453284A priority Critical patent/JPS60227427A/ja
Publication of JPS60227427A publication Critical patent/JPS60227427A/ja
Publication of JPH0256811B2 publication Critical patent/JPH0256811B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP8453284A 1984-04-26 1984-04-26 Ｓｉｐ形部品のパツケ−ジング方法 Granted JPS60227427A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8453284A JPS60227427A (ja) 1984-04-26 1984-04-26 Ｓｉｐ形部品のパツケ−ジング方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8453284A JPS60227427A (ja) 1984-04-26 1984-04-26 Ｓｉｐ形部品のパツケ−ジング方法

Publications (2)

Publication Number Publication Date
JPS60227427A JPS60227427A (ja) 1985-11-12
JPH0256811B2 true JPH0256811B2 (enrdf_load_stackoverflow) 1990-12-03

Family

ID=13833247

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8453284A Granted JPS60227427A (ja) 1984-04-26 1984-04-26 Ｓｉｐ形部品のパツケ−ジング方法

Country Status (1)

Country Link
JP (1) JPS60227427A (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0720916Y2 (ja) * 1986-04-23 1995-05-15 ローム株式会社 電子部品の合成樹脂粉体塗装装置
KR101959481B1 (ko) * 2017-05-10 2019-07-04 주식회사대일코팅씨오 자동차용 에어백 와이어하니스커넥터 보호캡 성형금형 및 이로부터 성형되는 보호캡
CN111863363B (zh) * 2020-06-03 2023-02-17 中科立民新材料（扬州）有限公司 一种高温热敏电阻的封装方法及其封装的电阻和应用

Also Published As

Publication number Publication date
JPS60227427A (ja) 1985-11-12

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