JPS60227427A - Ｓｉｐ形部品のパツケ−ジング方法 - Google Patents
Ｓｉｐ形部品のパツケ−ジング方法Info
- Publication number
- JPS60227427A JPS60227427A JP8453284A JP8453284A JPS60227427A JP S60227427 A JPS60227427 A JP S60227427A JP 8453284 A JP8453284 A JP 8453284A JP 8453284 A JP8453284 A JP 8453284A JP S60227427 A JPS60227427 A JP S60227427A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- terminal
- parts
- sip
- tip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8453284A JPS60227427A (ja) | 1984-04-26 | 1984-04-26 | Ｓｉｐ形部品のパツケ−ジング方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8453284A JPS60227427A (ja) | 1984-04-26 | 1984-04-26 | Ｓｉｐ形部品のパツケ−ジング方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60227427A true JPS60227427A (ja) | 1985-11-12 |
| JPH0256811B2 JPH0256811B2 (enrdf_load_stackoverflow) | 1990-12-03 |
Family
ID=13833247
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8453284A Granted JPS60227427A (ja) | 1984-04-26 | 1984-04-26 | Ｓｉｐ形部品のパツケ−ジング方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60227427A (enrdf_load_stackoverflow) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62174677U (enrdf_load_stackoverflow) * | 1986-04-23 | 1987-11-06 | ||
| KR20180123895A (ko) * | 2017-05-10 | 2018-11-20 | 주식회사대일코팅씨오 | 자동차용 에어백 와이어하니스커넥터 보호캡 성형금형 및 이로부터 성형되는 보호캡 |
| CN111863363A (zh) * | 2020-06-03 | 2020-10-30 | 中科立民新材料（扬州）有限公司 | 一种高温热敏电阻的封装方法及其封装的电阻和应用 |
-
1984
- 1984-04-26 JP JP8453284A patent/JPS60227427A/ja active Granted
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62174677U (enrdf_load_stackoverflow) * | 1986-04-23 | 1987-11-06 | ||
| KR20180123895A (ko) * | 2017-05-10 | 2018-11-20 | 주식회사대일코팅씨오 | 자동차용 에어백 와이어하니스커넥터 보호캡 성형금형 및 이로부터 성형되는 보호캡 |
| CN111863363A (zh) * | 2020-06-03 | 2020-10-30 | 中科立民新材料（扬州）有限公司 | 一种高温热敏电阻的封装方法及其封装的电阻和应用 |
| CN111863363B (zh) * | 2020-06-03 | 2023-02-17 | 中科立民新材料（扬州）有限公司 | 一种高温热敏电阻的封装方法及其封装的电阻和应用 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0256811B2 (enrdf_load_stackoverflow) | 1990-12-03 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100277021B1 (ko) | 미소 금속볼의 배열방법 | |
| JPH01315166A (ja) | プラスチック封入材を用いた集積回路パッケージ | |
| CN108461459A (zh) | 一种负极对接双向整流二极管及其制造工艺 | |
| JPS60227427A (ja) | Ｓｉｐ形部品のパツケ−ジング方法 | |
| JPH02277753A (ja) | はんだメッキ方法およびその装置 | |
| JP6204832B2 (ja) | めっき装置およびめっき方法 | |
| JPH0526765Y2 (enrdf_load_stackoverflow) | ||
| ATE4578T1 (de) | Einrichtung zum beaufschlagen der anschluesse von integrierten bausteinen mit lot. | |
| JPS5851951A (ja) | フラックス塗布方法およびその塗布装置 | |
| JPS60127736A (ja) | 混成集積回路のパツケ−ジング方法 | |
| JP4682412B2 (ja) | 電子部品の振動めっき方法 | |
| JPS5826546Y2 (ja) | 印刷回路板メツキ用補助陰極 | |
| JPH01100993A (ja) | 混成集積回路の製造方法 | |
| JPH07193097A (ja) | フラツクス塗布方法及びその装置 | |
| JPH0666038U (ja) | 半導体の面実装パッケージ | |
| JPH0669085A (ja) | 電解コンデンサ用リード線端子の化成用容器 | |
| JPH0347334Y2 (enrdf_load_stackoverflow) | ||
| JP2000332043A (ja) | 導電性ボール搭載装置における導電性ボールの供給装置 | |
| JPH02156695A (ja) | プリント基板のディップ方法 | |
| JPS62111437A (ja) | 回路基板のパツケ−ジング方法 | |
| JPH0417105B2 (enrdf_load_stackoverflow) | ||
| JPH0126058Y2 (enrdf_load_stackoverflow) | ||
| JPH07114313B2 (ja) | Ｄｉｐ型混成集積回路の製造方法 | |
| JP2001168239A (ja) | ボールグリッドアレイ半導体装置及びその実装方法 | |
| JPS6223136A (ja) | 半導体装置 |