JPH0256451U - - Google Patents

Info

Publication number
JPH0256451U
JPH0256451U JP1988134485U JP13448588U JPH0256451U JP H0256451 U JPH0256451 U JP H0256451U JP 1988134485 U JP1988134485 U JP 1988134485U JP 13448588 U JP13448588 U JP 13448588U JP H0256451 U JPH0256451 U JP H0256451U
Authority
JP
Japan
Prior art keywords
support plate
semiconductor element
length
external terminal
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1988134485U
Other languages
English (en)
Other versions
JPH0644110Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988134485U priority Critical patent/JPH0644110Y2/ja
Publication of JPH0256451U publication Critical patent/JPH0256451U/ja
Application granted granted Critical
Publication of JPH0644110Y2 publication Critical patent/JPH0644110Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Description

【図面の簡単な説明】
第１図は本考案の半導体装置を電力用ハイブリ
ツドＩＣに応用した場合の支持板の斜視図、第２
図、第３図及び第４図はそれぞれ電力用ハイブリ
ツドＩＣの正面図、平面図及び底面図、第５図は
この電力用ハイブリツドＩＣを自動車用デイスト
リビユータに取付けた状態を示す平面図、第６図
はこの断面図、第７図は従来の電力用ハイブリツ
ドＩＣの平面図、第８図はこの取付け状態を示す
側面図、第９図は湾曲した支持体にこの電力用ハ
イブリツドＩＣを取付ける場合の側面図を示す。 ２１……支持板、２１ａ……第１の端部、２１
ｂ……第２の端部、２１ｃ……第３の端部、２１
ｄ……第４の端部、３……半導体素子、３ａ……
第１の端部、３ｂ……第２の端部、４……回路基
板、２２……外部端子、２９……外囲体、２４…
…取付け部、２６，２７……接線、２８……孔、
Ｌ１……支持板の長さ、Ｌ２……取付け部の長さ
。

Claims (1)

  1. 【実用新案登録請求の範囲】 放熱板を兼ねる支持板と、該支持板の一方の主
    面に固着された半導体素子及び回路基板と、該半
    導体素子又は回路基板と電気的に接続された外部
    端子と、前記支持板に固定されかつ前記外部端子
    の一部を被覆する外囲体とを有する電子部品にお
    いて、 前記支持板は前記外部端子側に位置する第１の
    端部と、該第１の端部に対向する第２の端部と、
    前記第１の端部と第２の端部との間に形成された
    第３の端部及び第４の端部とを有し、前記半導体
    素子は前記支持板の第１の端部側及び前記支持板
    の第２の端部側にそれぞれ第１の端部と第２の端
    部とを有し、前記半導体素子及び回路基板は前記
    支持板の前記第１の端部側から前記支持板上に順
    次配置されており、前記支持板の第３の端部及び
    第４の端部にはそれぞれ前記支持板と一体に取付
    け部が形成されており、該取付け部は互いに平行
    してそれぞれが前記第３の端部及び第４の端部に
    交叉する前記半導体素子の第１の端部側の接線と
    第２の端部側の接線との間に配置された部分を有
    し、前記取付け部の長さは前記支持板の長さより
    も小さく、前記取付け部の平均的な板厚は前記支
    持板の平均的な板厚よりも大きく、前記取付け部
    に形成された取付け用ビス挿入用の孔は前記支持
    板の延在する方向に延びて形成されていることを
    特徴とする半導体装置。
JP1988134485U 1988-10-17 1988-10-17 半導体装置 Expired - Lifetime JPH0644110Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988134485U JPH0644110Y2 (ja) 1988-10-17 1988-10-17 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988134485U JPH0644110Y2 (ja) 1988-10-17 1988-10-17 半導体装置

Publications (2)

Publication Number Publication Date
JPH0256451U true JPH0256451U (ja) 1990-04-24
JPH0644110Y2 JPH0644110Y2 (ja) 1994-11-14

Family

ID=31393283

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988134485U Expired - Lifetime JPH0644110Y2 (ja) 1988-10-17 1988-10-17 半導体装置

Country Status (1)

Country Link
JP (1) JPH0644110Y2 (ja)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5831424U (ja) * 1981-08-25 1983-03-01 カルソニックカンセイ株式会社 たわみ軸の潤滑油上り防止装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5831424U (ja) * 1981-08-25 1983-03-01 カルソニックカンセイ株式会社 たわみ軸の潤滑油上り防止装置

Also Published As

Publication number Publication date
JPH0644110Y2 (ja) 1994-11-14

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