JPH0254229U - - Google Patents
Info
- Publication number
- JPH0254229U JPH0254229U JP13302588U JP13302588U JPH0254229U JP H0254229 U JPH0254229 U JP H0254229U JP 13302588 U JP13302588 U JP 13302588U JP 13302588 U JP13302588 U JP 13302588U JP H0254229 U JPH0254229 U JP H0254229U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- fixing ring
- substrate fixing
- cathode electrode
- etching apparatus
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 11
- 238000005530 etching Methods 0.000 claims description 4
- 238000001020 plasma etching Methods 0.000 claims description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims 1
- 239000000919 ceramic Substances 0.000 claims 1
- 239000012495 reaction gas Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
Landscapes
- ing And Chemical Polishing (AREA)
- Drying Of Semiconductors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13302588U JPH0254229U (de) | 1988-10-11 | 1988-10-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13302588U JPH0254229U (de) | 1988-10-11 | 1988-10-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0254229U true JPH0254229U (de) | 1990-04-19 |
Family
ID=31390525
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13302588U Pending JPH0254229U (de) | 1988-10-11 | 1988-10-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0254229U (de) |
-
1988
- 1988-10-11 JP JP13302588U patent/JPH0254229U/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS5684476A (en) | Etching method of gas plasma | |
| JPH0254229U (de) | ||
| JPH0666301B2 (ja) | プラズマエツチング方法 | |
| JPS6247131A (ja) | 反応性イオンエツチング装置 | |
| JPH0254228U (de) | ||
| JPS6255564U (de) | ||
| JPH0469465U (de) | ||
| JPS6413119U (de) | ||
| JPH0211327U (de) | ||
| JPS6257387U (de) | ||
| JPH0374663U (de) | ||
| JPS6073233U (ja) | ドライエツチング装置 | |
| JPS61138249U (de) | ||
| JPS60169257U (ja) | プラズマｃｖｄ装置 | |
| JPH0231126U (de) | ||
| JPH0451473Y2 (de) | ||
| JPS60179033U (ja) | 放電電極 | |
| JPS58151666U (ja) | プラズマ・エツチング装置 | |
| JPS6211181U (de) | ||
| JPS6096832U (ja) | 静電チヤツク | |
| JPS6127334U (ja) | ドライエツチング装置 | |
| JPS59141570U (ja) | プラズマエツチング装置 | |
| JP2693882B2 (ja) | 反応性イオンエッチング装置 | |
| JPS63178913U (de) | ||
| JPS6182958U (de) |