JPS61138249U - - Google Patents
Info
- Publication number
- JPS61138249U JPS61138249U JP2232585U JP2232585U JPS61138249U JP S61138249 U JPS61138249 U JP S61138249U JP 2232585 U JP2232585 U JP 2232585U JP 2232585 U JP2232585 U JP 2232585U JP S61138249 U JPS61138249 U JP S61138249U
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- sheet
- semiconductor manufacturing
- jig
- manufacturing apparatus
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000000463 material Substances 0.000 claims 1
- 238000007789 sealing Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 238000001020 plasma etching Methods 0.000 description 2
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2232585U JPS61138249U (de) | 1985-02-19 | 1985-02-19 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2232585U JPS61138249U (de) | 1985-02-19 | 1985-02-19 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS61138249U true JPS61138249U (de) | 1986-08-27 |
Family
ID=30514515
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2232585U Pending JPS61138249U (de) | 1985-02-19 | 1985-02-19 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61138249U (de) |
-
1985
- 1985-02-19 JP JP2232585U patent/JPS61138249U/ja active Pending
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