JPS61138249U - - Google Patents
Info
- Publication number
- JPS61138249U JPS61138249U JP2232585U JP2232585U JPS61138249U JP S61138249 U JPS61138249 U JP S61138249U JP 2232585 U JP2232585 U JP 2232585U JP 2232585 U JP2232585 U JP 2232585U JP S61138249 U JPS61138249 U JP S61138249U
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- sheet
- semiconductor manufacturing
- jig
- manufacturing apparatus
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000000463 material Substances 0.000 claims 1
- 238000007789 sealing Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 238000001020 plasma etching Methods 0.000 description 2
Landscapes
- Drying Of Semiconductors (AREA)
Description
第１図はこの考案の一実施例による半導体製造
装置（プラズマエツチング装置）を示す構成図、
第２図は従来の平行平板形プラズマエツチング装
置を示す構成図である。
１……ウエハ、２……電極ステージ、３……シ
ート、４……治具、５……ＲＦ電源、６……サー
キユレータ。
FIG. 1 is a configuration diagram showing a semiconductor manufacturing apparatus (plasma etching apparatus) according to an embodiment of this invention;
FIG. 2 is a block diagram showing a conventional parallel plate type plasma etching apparatus. 1... Wafer, 2... Electrode stage, 3... Sheet, 4... Jig, 5... RF power supply, 6... Circulator.
Claims (1)
べきステージの上に固定されその上にウエハが載
置される高い熱伝導性を有するウエハと同一形状
の又はこれより小さいシートと、該シート上に載
置したウエハを上記シートを密閉した状態でシー
トに押さえつける治具とを備えたことを特徴とす
る半導体製造装置。 (2) 上記治具は、エツチヤントを消費する材料
からなることを特徴とする実用新案登録請求の範
囲第１項記載の半導体製造装置。[Scope of Claim for Utility Model Registration] (1) In semiconductor manufacturing equipment, a wafer having the same shape as or having a shape similar to that of a wafer with high thermal conductivity that is fixed on a stage on which the wafer is placed and on which the wafer is placed. 1. A semiconductor manufacturing apparatus comprising: a small sheet; and a jig for pressing a wafer placed on the sheet against the sheet while sealing the sheet. (2) The semiconductor manufacturing apparatus according to claim 1, wherein the jig is made of a material that consumes an etchant.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2232585U JPS61138249U (en) | 1985-02-19 | 1985-02-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2232585U JPS61138249U (en) | 1985-02-19 | 1985-02-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61138249U true JPS61138249U (en) | 1986-08-27 |
Family
ID=30514515
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2232585U Pending JPS61138249U (en) | 1985-02-19 | 1985-02-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61138249U (en) |
-
1985
- 1985-02-19 JP JP2232585U patent/JPS61138249U/ja active Pending
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