JPS6127334U - dry etching equipment - Google Patents
dry etching equipmentInfo
- Publication number
- JPS6127334U JPS6127334U JP11231184U JP11231184U JPS6127334U JP S6127334 U JPS6127334 U JP S6127334U JP 11231184 U JP11231184 U JP 11231184U JP 11231184 U JP11231184 U JP 11231184U JP S6127334 U JPS6127334 U JP S6127334U
- Authority
- JP
- Japan
- Prior art keywords
- dry etching
- etching equipment
- electrodes
- high frequency
- etched
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【図面の簡単な説明】
第１図および第２図はそれぞれ本考案の実施例を示す断
面図であり、第３図は従来のドライエッチング装置の断
面図である。
１，８．１２・・・半導体ウエハー、２，９．１７・・
・下部電極、３，１０．１５・・・絶縁材、４，７，１
４・・・上部電極、５，１１，１６・・・真空チェンレ
く、６，１３・・・メッシュ板。BRIEF DESCRIPTION OF THE DRAWINGS FIGS. 1 and 2 are sectional views showing an embodiment of the present invention, and FIG. 3 is a sectional view of a conventional dry etching apparatus. 1,8.12...Semiconductor wafer, 2,9.17...
・Lower electrode, 3, 10.15...Insulating material, 4, 7, 1
4... Upper electrode, 5, 11, 16... Vacuum chain, 6, 13... Mesh plate.
Claims (1)
電極を有し、上記電極間に反応ガスを導入し、高周波を
印加せしめその反応ガスによって上記電極間に裁置され
た被エッチング材をエッチングするドライエッチング装
置において、前記反応ガスの導入部と排気部を上記電極
に形成したことを特徴とするドライエッチング装置。A vacuum chamber has opposed electrodes capable of applying high frequency power, a reactive gas is introduced between the electrodes, high frequency is applied, and the material to be etched placed between the electrodes is etched by the reactive gas. What is claimed is: 1. A dry etching apparatus characterized in that an introduction part and an exhaust part for the reaction gas are formed in the electrode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11231184U JPS6127334U (en) | 1984-07-24 | 1984-07-24 | dry etching equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11231184U JPS6127334U (en) | 1984-07-24 | 1984-07-24 | dry etching equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6127334U true JPS6127334U (en) | 1986-02-18 |
Family
ID=30671373
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11231184U Pending JPS6127334U (en) | 1984-07-24 | 1984-07-24 | dry etching equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6127334U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62157138U (en) * | 1986-03-27 | 1987-10-06 |
-
1984
- 1984-07-24 JP JP11231184U patent/JPS6127334U/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62157138U (en) * | 1986-03-27 | 1987-10-06 |
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