JPH0252339U - - Google Patents
Info
- Publication number
- JPH0252339U JPH0252339U JP12837688U JP12837688U JPH0252339U JP H0252339 U JPH0252339 U JP H0252339U JP 12837688 U JP12837688 U JP 12837688U JP 12837688 U JP12837688 U JP 12837688U JP H0252339 U JPH0252339 U JP H0252339U
- Authority
- JP
- Japan
- Prior art keywords
- side bump
- chip
- bonded
- substrate
- wiring pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
- H01L2224/113—Manufacturing methods by local deposition of the material of the bump connector
- H01L2224/1133—Manufacturing methods by local deposition of the material of the bump connector in solid form
- H01L2224/1134—Stud bumping, i.e. using a wire-bonding apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
- H01L2224/13001—Core members of the bump connector
- H01L2224/13075—Plural core members
- H01L2224/1308—Plural core members being stacked
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
Description
第１図は本考案による配線基板の一実施例を示
す側面図、第２図及び第３図は従来の配線基板を
示す側面図である。
１……絶縁基板、２……配線パターン、３……
チツプ部品、４，１０……接合部材、６……バン
プ、１１，１２……チツプ側、基板側バンプ、１
３……接合膜。
FIG. 1 is a side view showing an embodiment of a wiring board according to the present invention, and FIGS. 2 and 3 are side views showing a conventional wiring board. 1... Insulating board, 2... Wiring pattern, 3...
Chip parts, 4, 10... Joining member, 6... Bump, 11, 12... Chip side, board side bump, 1
3... Bonding film.
Claims (1)
、 配線パターンに接合する基板側バンプと、 上記チツプ側バンプ及び基板側バンプ間を接合
する異方性導電膜でなる接合膜と を有する接合部材によつて上記チツプ部品を上記
配線パターンに接合することを特徴とする配線基
板。[Scope of Claim for Utility Model Registration] A bond consisting of a chip-side bump that is bonded to an electrode of a chip component, a substrate-side bump that is bonded to a wiring pattern, and an anisotropic conductive film that bonds between the chip-side bump and the substrate-side bump. A wiring board characterized in that the chip component is joined to the wiring pattern by a joining member having a film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12837688U JPH0252339U (en) | 1988-09-30 | 1988-09-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12837688U JPH0252339U (en) | 1988-09-30 | 1988-09-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0252339U true JPH0252339U (en) | 1990-04-16 |
Family
ID=31381660
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12837688U Pending JPH0252339U (en) | 1988-09-30 | 1988-09-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0252339U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1998033217A1 (en) * | 1997-01-24 | 1998-07-30 | Rohm Co., Ltd. | Semiconductor device and method for manufacturing thereof |
| JP2007294916A (en) * | 2006-03-31 | 2007-11-08 | Brother Ind Ltd | Connecting structure, method of forming bump and the like |
-
1988
- 1988-09-30 JP JP12837688U patent/JPH0252339U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1998033217A1 (en) * | 1997-01-24 | 1998-07-30 | Rohm Co., Ltd. | Semiconductor device and method for manufacturing thereof |
| JP2007294916A (en) * | 2006-03-31 | 2007-11-08 | Brother Ind Ltd | Connecting structure, method of forming bump and the like |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS5827935U (en) | Hybrid integrated circuit device | |
| JPH0252339U (en) | ||
| JPH0284368U (en) | ||
| JPS6237939U (en) | ||
| JPH0236476U (en) | ||
| JPH01125544U (en) | ||
| JPS6153934U (en) | ||
| JPS6413144U (en) | ||
| JPH01133734U (en) | ||
| JPH0334240U (en) | ||
| JPH0265339U (en) | ||
| JPH0422244U (en) | ||
| JPS6245837U (en) | ||
| JPH0211342U (en) | ||
| JPH02114934U (en) | ||
| JPH0343738U (en) | ||
| JPS62149870U (en) | ||
| JPS63157934U (en) | ||
| JPS61153373U (en) | ||
| JPH0254234U (en) | ||
| JPS6263936U (en) | ||
| JPS61182048U (en) | ||
| JPS6234431U (en) | ||
| JPH0286133U (en) | ||
| JPS6063970U (en) | Chip component mounting structure |