JPH0334240U - - Google Patents

Info

Publication number
JPH0334240U
JPH0334240U JP1989095585U JP9558589U JPH0334240U JP H0334240 U JPH0334240 U JP H0334240U JP 1989095585 U JP1989095585 U JP 1989095585U JP 9558589 U JP9558589 U JP 9558589U JP H0334240 U JPH0334240 U JP H0334240U
Authority
JP
Japan
Prior art keywords
lead
board
board wiring
solder
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1989095585U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989095585U priority Critical patent/JPH0334240U/ja
Publication of JPH0334240U publication Critical patent/JPH0334240U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の第１の実施例の断面図、第２
図ａ，ｂは第１図の基板の平面図及び底面図、第
３図は本考案の第２の実施例の断面図、第４図は
従来の半導体装置の一例の断面図である。 １……半導体チツプ、２……バンプ、３……基
板、４，１４，２４ａ……リード部、５……封止
樹脂、７……接合部、８……スルーホール、９…
…基板配線、１０……ハンダ部、１１……突起、
１２……挿入孔、１５……絶縁性又は導電性樹脂
、２４ｂ……アイランド部、２５……導電性ワイ
ヤ。 FIG. 1 is a sectional view of the first embodiment of the present invention;
Figures a and b are a plan view and a bottom view of the substrate in Figure 1, Figure 3 is a sectional view of a second embodiment of the present invention, and Figure 4 is a sectional view of an example of a conventional semiconductor device. DESCRIPTION OF SYMBOLS 1... Semiconductor chip, 2... Bump, 3... Substrate, 4, 14, 24a... Lead part, 5... Sealing resin, 7... Joint part, 8... Through hole, 9...
... Board wiring, 10 ... Solder part, 11 ... Protrusion,
12... Insertion hole, 15... Insulating or conductive resin, 24b... Island portion, 25... Conductive wire.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] リードフレームのリード部と、一面に該リード
部と接合するはんだ部と他面にスルーホールを介
して前記はんだ部と接続する基板配線と該基板配
線に接続する接合部とを備えた基板と、該基板の
前記接合部に接合するバンプが形成された半導体
チツプとを有することを特徴とする半導体装置。 A board comprising a lead part of a lead frame, a solder part joined to the lead part on one side, a board wiring connected to the solder part via a through hole, and a joint part connected to the board wiring, on the other side; A semiconductor device comprising: a semiconductor chip on which a bump is formed to be bonded to the bonding portion of the substrate.
JP1989095585U 1989-08-14 1989-08-14 Pending JPH0334240U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989095585U JPH0334240U (en) 1989-08-14 1989-08-14

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989095585U JPH0334240U (en) 1989-08-14 1989-08-14

Publications (1)

Publication Number Publication Date
JPH0334240U true JPH0334240U (en) 1991-04-04

Family

ID=31644843

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989095585U Pending JPH0334240U (en) 1989-08-14 1989-08-14

Country Status (1)

Country Link
JP (1) JPH0334240U (en)

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