JPH0251905A - Manufacture of piezoelectric resonator - Google Patents
Manufacture of piezoelectric resonatorInfo
- Publication number
- JPH0251905A JPH0251905A JP20210488A JP20210488A JPH0251905A JP H0251905 A JPH0251905 A JP H0251905A JP 20210488 A JP20210488 A JP 20210488A JP 20210488 A JP20210488 A JP 20210488A JP H0251905 A JPH0251905 A JP H0251905A
- Authority
- JP
- Japan
- Prior art keywords
- wax
- piezoelectric
- electrode
- vibrating
- vibration
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 6
- 239000000463 material Substances 0.000 claims abstract description 16
- 239000000758 substrate Substances 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 5
- 238000007599 discharging Methods 0.000 claims 1
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 12
- 239000003990 capacitor Substances 0.000 description 7
- 239000003822 epoxy resin Substances 0.000 description 6
- 229910052742 iron Inorganic materials 0.000 description 6
- 229920000647 polyepoxide Polymers 0.000 description 6
- 238000005476 soldering Methods 0.000 description 5
- 239000002184 metal Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 238000007796 conventional method Methods 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 238000009863 impact test Methods 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
Landscapes
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、圧電振動エレメントと重ねるようにしてコン
デンサ等の付加部品エレメントを一体に取り付けられた
低背型の圧電共振子の製造工程において、振動電極の部
分に振動空間を形成するための空間形成用材料を塗布す
るための方法に関する。[Detailed Description of the Invention] [Field of Industrial Application] The present invention is directed to the manufacturing process of a low-profile piezoelectric resonator in which an additional component element such as a capacitor is integrally attached so as to overlap with a piezoelectric vibrating element. The present invention relates to a method for applying a space-forming material for forming a vibration space on a vibrating electrode.
圧電振動エレメント3とコンデンサ等の付加部品エレメ
ント4からなる低背型の圧電共振子にあっては、部品高
さを小さくするため、圧電振動エレメント3と付加部品
エレメント4とを対向させるようにして重ねた状態で一
体化されている。In a low-profile piezoelectric resonator consisting of a piezoelectric vibrating element 3 and an additional component element 4 such as a capacitor, the piezoelectric vibrating element 3 and the additional component element 4 are arranged to face each other in order to reduce the height of the component. They are integrated in a stacked state.
このように、低背型圧電共振子にあっては、圧電振動エ
レメント3に対向させて平行に付加部品エレメント4が
取り付けられており、振動電極2の一部が付加部品エレ
メント4により覆われているので、圧電振動エレメント
3にワックス6を塗布する際に付加部品エレメント4が
邪魔になり、ワックス6の塗布が困難である。In this way, in the low-profile piezoelectric resonator, the additional component element 4 is attached in parallel to the piezoelectric vibrating element 3, and a portion of the vibrating electrode 2 is covered by the additional component element 4. Therefore, when applying the wax 6 to the piezoelectric vibrating element 3, the additional component element 4 gets in the way, making it difficult to apply the wax 6.
このため、従来の低背型圧電共振子の製造工程において
は、第5図に示すように板状のコテ20を寝かせるよう
にして天面19側から圧電振動エレメント3の表面に近
づけ、コテ20の先端部に付着させたワックス6(空間
形成用材料)を振動電極2の上に点滴することにより圧
電振動エレメント3にワックス6を塗布している。そし
て、第7図に示すように、振動電極2を覆うようにして
圧電振動エレメント3にワックス6を塗布した後、この
圧電共振子をワックス吸収性のあるエポキシ樹脂中に浸
漬し、エポキシ樹脂製の外装部15を形成している。こ
の外装成形時に、熱で溶融したワックス6はワックス吸
収性エポキシ樹脂に吸収されるので、初めにワックス6
が塗布されていた箇所は第8図に示すように中空の振動
空間17となり、振動電極2の振動負荷を軽減している
。For this reason, in the conventional manufacturing process of a low-profile piezoelectric resonator, as shown in FIG. The wax 6 (space forming material) attached to the tip of the piezoelectric vibrating element 3 is applied by dripping it onto the vibrating electrode 2. Then, as shown in FIG. 7, wax 6 is applied to the piezoelectric vibrating element 3 so as to cover the vibrating electrode 2, and then this piezoelectric resonator is immersed in an epoxy resin with wax-absorbing properties. An exterior portion 15 is formed. During this exterior molding, the wax 6 melted by heat is absorbed into the wax-absorbing epoxy resin, so the wax 6 is first
The area where was applied becomes a hollow vibration space 17 as shown in FIG. 8, which reduces the vibration load on the vibrating electrode 2.
従来の低背型圧電共振子の製造工程においては、上記の
ように板状のコテ20を寝かせるようにして天面19側
から圧電振動エレメント3と付加部品エレメント4との
間の間隙部分に挿入し、コテ20の先端部に付着させた
ワックス6を振動を極2の部分に点滴していたので、ワ
ックス6を振動電極2の部分だけに正確に塗布すること
が困難であった。特に、ワックス6のついたコテ20を
天面19側から近づけているのでコテ20を振動電極2
に近づける際にワックス6が天面19に付着し易く、ま
た定量のワックス6をコテ20に付着させることが難し
いので、ワックス6が多過ぎると第6図に破線で囲んで
示すようにワックス6が拡がり易く(ワックス6が少な
いと振動電極2がワックス6から露出する。)、この結
果第7図に示すように圧電振動エレメント3の天面19
にもワックス6が付着することが多かった。従って、こ
の後ワックス吸収性エポキシ樹脂を用いて外装部15を
成形した場合、外装部15内には第8図に示すように振
動電極2の部分だけでなく天面19の部分にも空間18
が生じていた。In the conventional manufacturing process of a low-profile piezoelectric resonator, as described above, the plate-shaped iron 20 is laid down and inserted into the gap between the piezoelectric vibrating element 3 and the additional component element 4 from the top surface 19 side. However, since the wax 6 attached to the tip of the iron 20 was dripped onto the electrode 2 using vibration, it was difficult to accurately apply the wax 6 only to the vibrating electrode 2. In particular, since the soldering iron 20 with wax 6 is brought close to the top surface 19 side, the soldering iron 20 is placed close to the vibrating electrode 20.
The wax 6 tends to adhere to the top surface 19 when approaching the soldering iron 20, and it is difficult to apply a certain amount of wax 6 to the iron 20. Therefore, if there is too much wax 6, the wax 6 tends to adhere to the top surface 19 as shown by the broken line in FIG. spreads easily (if there is less wax 6, the vibrating electrode 2 is exposed from the wax 6), and as a result, as shown in FIG.
Wax 6 also often adhered to the surface. Therefore, when the exterior part 15 is subsequently molded using wax-absorbing epoxy resin, there is a space 18 in the exterior part 15 not only at the vibrating electrode 2 but also at the top surface 19, as shown in FIG.
was occurring.
この結果、圧電振動エレメント3の天面19の一部が外
装部によって掴まれていないことになり、この部分で振
動がダンピングされず、振動電極2間から漏れた振動が
天面19で端面反射を起こして定在波を生じ、スプリア
ス振動を発生させていた。また、天面19に空間18を
生じるので、外装部15の上端部に衝撃が加わると外装
部15が破損する恐れがあり、天面衝撃テストを行うと
耐久性の面で問題があった。As a result, a part of the top surface 19 of the piezoelectric vibrating element 3 is not gripped by the exterior part, and vibrations are not damped in this part, and vibrations leaking from between the vibrating electrodes 2 are reflected at the top surface 19 at the end surface. This caused standing waves and spurious vibrations. Furthermore, since the space 18 is created in the top surface 19, there is a risk that the exterior portion 15 will be damaged if an impact is applied to the upper end of the exterior portion 15, and there was a problem in terms of durability when performing a top surface impact test.
しかして、本発明の目的とするところは、圧電共振子に
おいて、ワックスを振動電極の部分だけに正確に塗布す
ることができるようにすることにある。特に、ワックス
の天面付着をなくすことを目的とする。SUMMARY OF THE INVENTION It is therefore an object of the present invention to enable wax to be applied accurately only to the vibrating electrodes of a piezoelectric resonator. In particular, the purpose is to eliminate wax adhesion to the top surface.
このため、本発明の圧電共振子の製造方法は、圧電基板
の表面に振動電極を設けて圧電振動エレメントを形成し
、前記表面と対向させて圧電振動エレメントに付加部品
エレメントを取着した後、デイスペンサーから吐出させ
たワックスのような空間形成用材料を前記振動電極に塗
布することを特徴としている。For this reason, the method for manufacturing a piezoelectric resonator of the present invention includes: forming a piezoelectric vibrating element by providing a vibrating electrode on the surface of a piezoelectric substrate; attaching an additional component element to the piezoelectric vibrating element so as to face the surface; It is characterized in that a space-forming material such as wax discharged from a dispenser is applied to the vibrating electrode.
本発明にあっては、デイスペンサーを用いて振動電極に
ワックスのような空間形成用材料を塗布しているので、
デイスペンサーの先端を振動電極に近づけた後にデイス
ペンサーの先端から空間形成用材料を吐出させることが
でき、デイスペンサーを振動電極に近づける際に空間形
成材料が振動電極以外の部分に付着することがない、し
かも、デイスペンサーからは定量の空間形成用材料を吐
出させることができるので、空間形成用材料が多過ぎて
振動電極以外の部分(特に、天面など)に拡がったり、
空間形成用材料が少な過ぎて振動電極が空間形成用材料
から露出したりすることがない。In the present invention, since a space forming material such as wax is applied to the vibrating electrode using a dispenser,
The space-forming material can be discharged from the tip of the dispenser after the tip of the dispenser is brought close to the vibrating electrode, and the space-forming material does not adhere to parts other than the vibrating electrode when the dispenser is brought close to the vibrating electrode. Moreover, since a fixed amount of space-forming material can be discharged from the dispenser, too much space-forming material may spread to areas other than the vibrating electrode (especially the top surface, etc.).
There is no possibility that the space-forming material is too small and the vibrating electrode is exposed from the space-forming material.
よって、従来方法のように外装部の天面内に空間が形成
されることを防止でき、従来のような端面反射の問題や
外装部の天面強度の問題も解決される。Therefore, it is possible to prevent a space from being formed in the top surface of the exterior part as in the conventional method, and also solve the problem of end face reflection and the problem of strength of the top surface of the exterior part, as in the conventional method.
以下、本発明の一実施例を添付図に基づいて詳述する。 Hereinafter, one embodiment of the present invention will be described in detail based on the accompanying drawings.
圧電振動エレメント3は、圧電セラミックス等の圧電基
板1の表裏両面にスパッタリング等の薄膜形成技術によ
り金属薄膜の振動電極2と2本の引き出しリード線7と
端子電極8とを形成されたものである0表裏の振動電極
2は圧電基板1の中央部において対向しており、この振
動電極2間の部分でエネルギー閉じ込め型の機械的振動
を行うものである、端子室ri8は、圧電基板1の表裏
で反対方向の側縁に配置されており、振動電極2と端子
を極8とは引き出しリード線7によって接続されている
。また、圧電振動エレメント3の両側部は、導電性金属
板を溝形に折り曲げたスペース用金具9に掴まれており
、両スペース用金具9は半田などによって各々の端子電
極8に電気的に接続されている。また、スペース用金具
9がらはそれぞれリード端子10が延出されている。The piezoelectric vibrating element 3 has a vibrating electrode 2 made of a metal thin film, two lead wires 7, and a terminal electrode 8 formed on both the front and back sides of a piezoelectric substrate 1 made of piezoelectric ceramics or the like using a thin film forming technique such as sputtering. The front and back vibrating electrodes 2 face each other at the center of the piezoelectric substrate 1, and the terminal chamber ri8, which performs energy trapping type mechanical vibration in the area between the vibrating electrodes 2, is located between the front and back sides of the piezoelectric substrate 1. The vibrating electrode 2 and the terminal are connected to the pole 8 by a lead wire 7. Further, both sides of the piezoelectric vibrating element 3 are held by space fittings 9 which are formed by bending a conductive metal plate into a groove shape, and both space fittings 9 are electrically connected to each terminal electrode 8 by soldering or the like. has been done. Furthermore, lead terminals 10 are extended from each of the space fittings 9.
図示の付加部品エレメント4は、コンデンサエレメント
であって、誘電体セラミックスの基板11の表裏両面に
金属薄膜のコンデンサ極板12を形成し、コンデンサ極
板12がら両側へ金属薄膜のリード線13を引き出した
ものである。但し、付加部品エレメント4は、コンデン
サエレメントに限るものではない、この付加部品エレメ
ント4は、第1図に示すように両端部をスペース用金具
9の上に載置して圧電振動エレメント3と平行に配置さ
れており、両端部を半田や銀ペースト等によってスペー
ス用金具9に固定されており、付加部品エレメント4と
圧電振動エレメント3との間には間隙が形成されている
。また、付加部品エレメント4の両端部の半田付は等に
より付加部品エレメント4と圧電振動エレメント3とは
、所定の回路を構成するように電気的に接続されている
。The illustrated additional component element 4 is a capacitor element, in which thin metal film capacitor plates 12 are formed on both the front and back surfaces of a dielectric ceramic substrate 11, and metal thin film lead wires 13 are drawn out from the capacitor plate 12 on both sides. It is something that However, the additional component element 4 is not limited to a capacitor element. This additional component element 4 is placed parallel to the piezoelectric vibrating element 3 with both ends placed on the space fittings 9 as shown in FIG. The piezoelectric vibrating element 3 is arranged at both ends thereof and fixed to the space fitting 9 by solder, silver paste, etc., and a gap is formed between the additional component element 4 and the piezoelectric vibrating element 3. Furthermore, the additional component element 4 and the piezoelectric vibrating element 3 are electrically connected by soldering or the like at both ends of the additional component element 4 so as to constitute a predetermined circuit.
さらに、図示例では、付加部品エレメント4のコンデン
サ極板12にリード端子14が半田付けされている。Furthermore, in the illustrated example, lead terminals 14 are soldered to the capacitor plate 12 of the additional component element 4.
こうして、圧電振動エレメント3に付加部品エレメント
4が取り付けられた後、第1図に想像線で示すように、
振動電極2の箇所へデイスペンサー5の細くなった先端
を近づけ、デイスペンサー5の先端から定量の溶融した
ワックス6を吐出させ、第2図に示すように振動電極2
の部分にワックス6を点滴することにより振動型&2を
ワックス6で被覆する。ワックス6は、デイスペンサー
5を振動電極2に近づけた後に一定量だけデイスペンサ
ー5から吐出されるので、振動電極2以外の部分に付着
する恐れがなく、例えば第3図に破線で囲んだ部分にだ
け正確に塗布される。また、反対側の振動電極2も第2
図に想像線で示したようにデイスペンサー5によってワ
ンクス6を塗布される。こうして、再振動電極2は固化
したワックス6によって覆われる。After the additional component element 4 is attached to the piezoelectric vibrating element 3 in this way, as shown by the imaginary line in FIG.
The tapered tip of the dispenser 5 is brought close to the vibrating electrode 2, a fixed amount of melted wax 6 is discharged from the tip of the dispenser 5, and the vibrating electrode 2 is moved as shown in FIG.
The vibrating mold &2 is coated with wax 6 by dripping wax 6 onto the area. Since the wax 6 is discharged from the dispenser 5 in a fixed amount after the dispenser 5 is brought close to the vibrating electrode 2, there is no risk of the wax 6 adhering to parts other than the vibrating electrode 2, such as the part surrounded by the broken line in Fig. 3. be applied accurately. Also, the vibrating electrode 2 on the opposite side is also connected to the second
Wax 6 is applied by dispenser 5 as shown by imaginary lines in the figure. In this way, the re-vibration electrode 2 is covered with the solidified wax 6.
次いで、上記のようにして製造された圧電共振子16を
ワックス吸収性のあるエポキシ樹脂中に浸漬し、この後
エポキシ樹脂を熱硬化させて外装部15を形成する。ワ
ックス6は空間形成用材料であって、再び溶融したワッ
クス6は、エポキシ樹脂中に吸収され、ワックス6が吸
収された跡には第4図に示すように振動空間17が形成
される。振動電極2はこの振動空間17内でダンピング
を受けることなく振動するものであり、一方圧型振動エ
レメント3の外周部全体は外装部15によって保持され
ているので、端面反射は抑制されている。また、圧電振
動エレメント3の外周部には空間が生じていないので、
耐衝撃性にも優れている。Next, the piezoelectric resonator 16 manufactured as described above is immersed in a wax-absorbing epoxy resin, and then the epoxy resin is thermally cured to form the exterior portion 15. The wax 6 is a space forming material, and the remelted wax 6 is absorbed into the epoxy resin, and a vibration space 17 is formed in the area where the wax 6 has been absorbed, as shown in FIG. The vibrating electrode 2 vibrates within this vibration space 17 without being damped, and since the entire outer periphery of the one-pressure type vibrating element 3 is held by the exterior part 15, end face reflection is suppressed. In addition, since there is no space around the outer circumference of the piezoelectric vibrating element 3,
It also has excellent impact resistance.
本発明によれば、圧電振動エレメントの振動電極の部分
にだけ正確に空間形成用材料な塗布することができる。According to the present invention, the space forming material can be accurately applied only to the vibrating electrode portion of the piezoelectric vibrating element.
この結果、従来例のように、圧電共振子の外装部内の天
端部分に空間が生じることがなく、振動の端面反射が生
じないのでスプリアス振動を抑制することができ、また
外装部の天面衝撃テストの耐久性も向上する。As a result, unlike the conventional example, there is no space at the top end of the piezoelectric resonator's exterior, and vibration reflections from the end face do not occur, making it possible to suppress spurious vibrations. Durability in impact tests is also improved.
第1図は本発明の一実施例を示す斜視図、第2図及び第
3図は同上の方法によるワックスの付着箇所を示す概略
断面図及び平面図、第4図は同上の外装モールド後の圧
電共振子の断面図、第5図は従来例の斜視図、第6図及
び第7図は従来の方法によるワックスの付着箇所を示す
平面図及び概略断面図、第8図は同上の外装モールド後
の圧電共振子の断面図である。
1・・・圧電基板 2・・・振動電極3・・・圧
電振動エレメント
4・・・付加部品エレメント
5・・・デイスペンサーFIG. 1 is a perspective view showing one embodiment of the present invention, FIGS. 2 and 3 are a schematic cross-sectional view and a plan view showing the wax attachment location according to the above method, and FIG. A cross-sectional view of a piezoelectric resonator, FIG. 5 is a perspective view of a conventional example, FIGS. 6 and 7 are a plan view and a schematic cross-sectional view showing the locations where wax is applied by the conventional method, and FIG. 8 is an exterior mold of the same as above. FIG. 7 is a cross-sectional view of the subsequent piezoelectric resonator. 1... Piezoelectric substrate 2... Vibrating electrode 3... Piezoelectric vibrating element 4... Additional component element 5... Dispenser
Claims (1)
ントを形成し、前記表面と対向させて圧電振動エレメン
トに付加部品エレメントを取着した後、ディスペンサー
から吐出させたワックスのような空間形成用材料を前記
振動電極に付着させることを特徴とする圧電共振子の製
造方法。1) A piezoelectric vibrating element is formed by providing a vibrating electrode on the surface of a piezoelectric substrate, and an additional component element is attached to the piezoelectric vibrating element so as to face the surface, and then a wax-like space is formed by discharging it from a dispenser. A method for manufacturing a piezoelectric resonator, characterized in that a material is attached to the vibrating electrode.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20210488A JPH0251905A (en) | 1988-08-13 | 1988-08-13 | Manufacture of piezoelectric resonator |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20210488A JPH0251905A (en) | 1988-08-13 | 1988-08-13 | Manufacture of piezoelectric resonator |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0251905A true JPH0251905A (en) | 1990-02-21 |
Family
ID=16452029
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP20210488A Pending JPH0251905A (en) | 1988-08-13 | 1988-08-13 | Manufacture of piezoelectric resonator |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0251905A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007077382A (en) * | 2005-08-18 | 2007-03-29 | Hitachi Chem Co Ltd | Adhesive material composition and circuit terminal connected structure and method for connecting circuit terminal |
JP2007227668A (en) * | 2006-02-23 | 2007-09-06 | Tdk Corp | Composite electronic component |
-
1988
- 1988-08-13 JP JP20210488A patent/JPH0251905A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007077382A (en) * | 2005-08-18 | 2007-03-29 | Hitachi Chem Co Ltd | Adhesive material composition and circuit terminal connected structure and method for connecting circuit terminal |
JP2007227668A (en) * | 2006-02-23 | 2007-09-06 | Tdk Corp | Composite electronic component |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPH0251905A (en) | Manufacture of piezoelectric resonator | |
JPS59110217A (en) | Piezoelectric oscillating parts in chip shape and its manufacture | |
JPS60241244A (en) | Semiconductor device, manufacture thereof, and implement to manufacture therefor | |
JPS58147141A (en) | Electronic parts | |
JPH09283363A (en) | Chip part and its manufacturing method | |
JP2000049019A (en) | Coil device | |
JP3478052B2 (en) | Surface mount type inductor | |
JP2501668Y2 (en) | Surface mount electrical components | |
JP2518191B2 (en) | Electronic component manufacturing method | |
JPH01187901A (en) | Chip type electronic component | |
JPS6239907A (en) | Piezo-oscillator | |
JPH0546279Y2 (en) | ||
JPH02107015A (en) | Mounting part construction for crystal resonator | |
JPH0122260Y2 (en) | ||
JPH08330295A (en) | Manufacture of semiconductor device | |
JPH0198252A (en) | Package for semiconductor | |
JPH01135218A (en) | Structure of mounting part for crystal resonator | |
JPH0658620U (en) | Piezoelectric parts | |
JPS587705Y2 (en) | surface acoustic wave device | |
JPS58106731A (en) | Method of producing fuse | |
JPH0613219U (en) | Electronic parts | |
JPH0340440A (en) | Resin-sealed hybrid integrated circuit and manufacture thereof | |
JPH08153651A (en) | Manufacture of chip-type electronic part | |
JPS62249431A (en) | Manufacture of semiconductor device | |
JPH0682860U (en) | Surface mount electronic components |