JPH0546279Y2 - - Google Patents
Info
- Publication number
- JPH0546279Y2 JPH0546279Y2 JP1987034447U JP3444787U JPH0546279Y2 JP H0546279 Y2 JPH0546279 Y2 JP H0546279Y2 JP 1987034447 U JP1987034447 U JP 1987034447U JP 3444787 U JP3444787 U JP 3444787U JP H0546279 Y2 JPH0546279 Y2 JP H0546279Y2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- sealed
- substrate
- hybrid
- terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229920005989 resin Polymers 0.000 claims description 37
- 239000011347 resin Substances 0.000 claims description 37
- 239000000758 substrate Substances 0.000 claims description 16
- 238000000034 method Methods 0.000 claims description 9
- 230000009974 thixotropic effect Effects 0.000 claims description 9
- 239000000919 ceramic Substances 0.000 description 8
- 238000007789 sealing Methods 0.000 description 6
- 239000012530 fluid Substances 0.000 description 4
- 229920002050 silicone resin Polymers 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910000906 Bronze Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
【考案の詳細な説明】
（産業上の利用分野）
本考案は樹脂封止ハイブリツドICの端子構造
に関するものである。[Detailed Description of the Invention] (Industrial Application Field) The present invention relates to a terminal structure for a resin-sealed hybrid IC.
（従来の技術）
従来、ハイブリツドIC（HIC）の樹脂封止構造
は、第２図に示されるように、セラミツク基板１
上に搭載部品３を載置し、セラミツク基板１の端
部を挟持する入出力用端子２を有するハイブリツ
ドICを樹脂４によつて浸漬して封止する。(Prior Art) Conventionally, the resin-sealed structure of a hybrid IC (HIC) has a ceramic substrate 1, as shown in FIG.
Mounting components 3 are placed on top, and a hybrid IC having input/output terminals 2 that sandwich the ends of the ceramic substrate 1 is immersed in resin 4 and sealed.
また、第３図に示されるように、入出力用端子
２の反対方向に向いた内部端子５がセラミツク基
板１上に載置された搭載部品３と同じ面上に設け
られ、その内部端子５には、例えば、LDE（発光
ダイオード）、受光素子などの部品６が後工程に
て半田接続されるようになつている。 Further, as shown in FIG. 3, an internal terminal 5 facing in the opposite direction to the input/output terminal 2 is provided on the same surface as the mounting component 3 placed on the ceramic substrate 1. For example, parts 6 such as an LDE (light emitting diode) and a light receiving element are connected by soldering in a later process.
（考案が解決しようとする問題点）
しかしながら、上記した従来の樹脂封止構造で
は、浸漬により樹脂封止をする場合に、入出力用
端子２か又は内部端子５のいずれかは、樹脂４の
中に浸漬されてしまうため、内部端子を設けるこ
とをやめ、入出力端子で代用する（この場合は、
引き出しパターンが長くなり電気的特性上好まし
くない）か、又は樹脂硬化後、付着樹脂を削りと
り、その付着樹脂を削りとつた箇所に部品６を接
続したり、又は内部端子の接続箇所を予めシーリ
ングテープで覆い樹脂封止後、そのテープを剥ぎ
取り、その箇所に内部端子を接続する等の方法を
採用していた。即ち、端子に樹脂が付かないよう
配慮する必要があり、その作業に非常に長時間を
要していた。(Problems to be solved by the invention) However, in the conventional resin sealing structure described above, when resin sealing is performed by dipping, either the input/output terminal 2 or the internal terminal 5 is Avoid providing internal terminals and use input/output terminals instead (in this case,
(The lead-out pattern becomes long, which is unfavorable in terms of electrical characteristics), or after the resin has hardened, the adhered resin is scraped off and the part 6 is connected to the place where the adhered resin has been scraped off, or the connection points of internal terminals are sealed in advance. After covering with tape and sealing with resin, the tape was peeled off and an internal terminal was connected to that location. That is, it is necessary to take care not to get resin on the terminals, which requires a very long time.
本考案は、上記問題点を除去し、以上述べたリ
ード端子と反対方向に設けられる内部端子に、樹
脂封止時に樹脂が付着しない構造にすることによ
り、良好な組立作業性を有する樹脂封止ハイブリ
ツドICの端子構造を提供することを目的とする。 The present invention eliminates the above problems and has a structure in which resin does not adhere to the internal terminals provided in the opposite direction to the lead terminals described above during resin sealing, thereby achieving resin sealing with good assembly workability. The purpose is to provide a terminal structure for hybrid ICs.
（問題点を解決するための手段）
本考案は、上記目的を達成するために、樹脂封
止ハイブリツドICの端子構造において、リード
端子と反対方向に内部端子を設ける場合、その内
部端子の長さを搭載部品の高さより十分長くとつ
た端子とし、前記基板の端部に形成されるチクソ
トロピツク性の樹脂からなるダム設け、デイスペ
ンスタイプの樹脂を流し込むことにより、内部端
子の半田付け部に樹脂が付着しない構造にしたも
のである。(Means for Solving the Problems) In order to achieve the above object, the present invention aims to improve the length of the internal terminal when the internal terminal is provided in the opposite direction to the lead terminal in the terminal structure of the resin-sealed hybrid IC. By making the terminals sufficiently longer than the height of the mounted components, providing a dam made of thixotropic resin at the end of the board, and pouring dispense type resin, the resin can be applied to the soldered parts of the internal terminals. It has a structure that prevents it from sticking.
（作用）
本考案によれば、上記したように構成すること
により、部品搭載面側に樹脂封止されることのな
い内部端子を設け、前記基板の端部に形成される
チクソトロピツク性（超音波によつて振動を与え
たり、あるいは端に振とうするだけで、液化し、
放置しておくと再び固化するゲルの性質）の樹脂
からなるダムを設け、片面デイスペンス方式のコ
ーテイングを行うことにより、従来に比して、そ
の組立性が良好な樹脂封止ハイブリツドICを提
供することができ、その内部端子に後工程によ
り、部品を電気的に短いパスで、容易に、しかも
確実に接続することができる。(Function) According to the present invention, by configuring as described above, internal terminals that are not sealed with resin are provided on the component mounting surface side, and thixotropic (ultrasonic) It can be liquefied by applying vibrations or just shaking it at the edge.
By providing a dam made of a resin (which has the property of a gel that hardens again if left unattended) and applying coating on one side using a single-side dispense method, we provide a resin-sealed hybrid IC that is easier to assemble than conventional products. Components can be easily and reliably connected to the internal terminals through a short electrical path in a post-process.
（実施例）
以下、本考案の実施例について図面を参照しな
がら詳細に説明する。(Example) Hereinafter, an example of the present invention will be described in detail with reference to the drawings.
第１図は本考案の内部端子を有する樹脂封止ハ
イブリツドICの断面図である。 FIG. 1 is a sectional view of a resin-sealed hybrid IC having internal terminals according to the present invention.
図中、１はセラミツク基板、２は入出力用端
子、３は搭載部品、１３は内部端子、１４はチク
ソトロピツク性の樹脂からなるダム、１５は低粘
度，流動性の充填用樹脂である。 In the figure, 1 is a ceramic substrate, 2 is an input/output terminal, 3 is a mounting component, 13 is an internal terminal, 14 is a dam made of thixotropic resin, and 15 is a low-viscosity, fluid filling resin.
そこで、充填用樹脂１５はデイスペンス方式
（後述）により、ハイブリツドICの片面に充填さ
れている。内部端子１３は充填された樹脂より十
分離れた位置、例えば、セラミツク基板１及び搭
載部品３の厚さを５〜６mm、その搭載部品３の上
部の充填用樹脂１５の厚さを１mmとすると、それ
らの合計より大きい、例えば、８mm程度の端子長
とする。また、内部端子１３の材料としては、
銅、リン青銅などの電気的導通性がよく、表面に
Niメツキ、ハンダメツキし易いものを使用する。 Therefore, the filling resin 15 is filled into one side of the hybrid IC by a dispensing method (described later). The internal terminal 13 is positioned sufficiently away from the filled resin, for example, assuming that the thickness of the ceramic substrate 1 and the mounted component 3 is 5 to 6 mm, and the thickness of the filling resin 15 above the mounted component 3 is 1 mm. The terminal length is greater than the sum of these values, for example, about 8 mm. In addition, the material for the internal terminal 13 is as follows:
Copper, phosphor bronze, etc. have good electrical conductivity, and the surface
Use Ni plating and a material that is easy to solder.
次に、本考案の内部端子を有する樹脂封止ハイ
ブリツドICの製造方法について説明する。 Next, a method for manufacturing a resin-sealed hybrid IC having internal terminals according to the present invention will be explained.
第４図はその樹脂封止ハイブリツドICの製造
工程断面図である。 FIG. 4 is a cross-sectional view of the manufacturing process of the resin-sealed hybrid IC.
(1) まず、第４図ａに示されるように、セラミツ
ク基板１の片面上に搭載部品３を載置すると共
に、そのセラミツク基板１の端部にクリツプ状
の入出力用端子２を設け、かつ、搭載部品３及
びその搭載部品の上部に充填される樹脂の高さ
より十分高くなるように導出した内部端子１３
を有するハイブリツドICを用意し、そのハイ
ブリツドICの部品搭載側（回路形成側）の基
板端面にチクソトロピツク性の樹脂、例えば、
シリコン樹脂１１をデイスペンサ１２等で一定
速度で一定量吐出する。なお、ここで入出力用
端子２はハイブリツド基板１の片側にのみ設け
るようにしても良い。また、その入出力用端子
２の引出端部は基板１と平行になるように導出
するようにしても良い。(1) First, as shown in FIG. 4a, the mounting component 3 is placed on one side of the ceramic substrate 1, and a clip-shaped input/output terminal 2 is provided at the end of the ceramic substrate 1. In addition, the internal terminal 13 is drawn out so as to be sufficiently higher than the height of the mounted component 3 and the resin filled above the mounted component.
A thixotropic resin, such as
A constant amount of silicone resin 11 is discharged at a constant speed using a dispenser 12 or the like. Note that the input/output terminals 2 may be provided only on one side of the hybrid board 1. Further, the input/output terminal 2 may be led out so that the lead-out end is parallel to the substrate 1.
(2) そして、このシリコン樹脂１１の粘度及びチ
クソトロピツク性を適切に選択して、第４図ｂ
に示されるように、シリコン樹脂１１はその特
性により、基板端面から流出することなく、か
つ、基板端面を完全に被いながらダム１４を形
成する。(2) Then, by appropriately selecting the viscosity and thixotropic properties of this silicone resin 11,
As shown in FIG. 1, due to its characteristics, the silicone resin 11 forms a dam 14 without flowing out from the end surface of the substrate and completely covering the end surface of the substrate.
(3) ダム１４を形成後、第４図ｃに示されるよう
に、このダム１４の内部に低粘度で流動性のあ
る充填用樹脂１５、例えば、シリコン樹脂をデ
イスペンサ１２等で一定量吐出する。(3) After forming the dam 14, as shown in FIG. 4c, a fixed amount of low-viscosity and fluid filling resin 15, such as silicone resin, is discharged into the dam 14 using a dispenser 12 or the like. .
(4) この場合、上記と同様に樹脂の粘度及び流動
性を適切に選択すれば、第４図ｄに示されるよ
うに、充填用樹脂１５は放置しておくだけで搭
載部品３間及び搭載部品下に流れ込み、搭載部
品及び成形回路を完全に被い封止する。また、
基板端面にはダム１４が形成されているため、
流動性充填用樹脂が基板外に流れ出すことはな
い。(4) In this case, if the viscosity and fluidity of the resin are appropriately selected in the same way as above, the filling resin 15 can be left alone between the mounted parts 3 and the mounted parts, as shown in Fig. 4d. It flows under the parts and completely covers and seals the mounted parts and molded circuits. Also,
Since the dam 14 is formed on the end surface of the substrate,
The fluid filling resin does not flow out of the substrate.
なお、上記したデイスペンス方式による樹脂封
止の方法自体は、既に同一出願人によつて、特願
昭61−071011号（特開昭62−229962号）として提
案されている。 The method of resin sealing using the above-mentioned dispense method has already been proposed by the same applicant in Japanese Patent Application No. 61-071011 (Japanese Unexamined Patent Publication No. 62-229962).
このようにして、内部端子１３が樹脂によつて
封止されることのない樹脂封止ハイブリツドIC
の端子を構成することができる。 In this way, a resin-sealed hybrid IC is created in which the internal terminals 13 are not sealed with resin.
terminals can be configured.
なお、本考案は上記実施例に限定されるもので
はなく、本考案の趣旨に基づいて種々の変形が可
能であり、これらを本考案の範囲から排除するも
のではない。 Note that the present invention is not limited to the above-mentioned embodiments, and various modifications can be made based on the spirit of the present invention, and these are not excluded from the scope of the present invention.
（考案の効果）
以上、詳細に説明したように、本考案によれ
ば、部品搭載面側に樹脂封止されることのない内
部端子を設け、基板の端部に形成されるチクソト
ロピツク性の樹脂からなるダムを形成し、片面デ
イスペンス方式のコーテイングを行うことによ
り、組立性が良好な樹脂封止ハイブリツドICを
提供することができる。(Effects of the invention) As explained above in detail, according to the invention, internal terminals that are not sealed with resin are provided on the component mounting surface side, and thixotropic resin is formed on the edge of the board. A resin-sealed hybrid IC with good assemblability can be provided by forming a dam consisting of a dam and performing single-sided dispensing coating.
従つて、従来のものに比して、その組立性が良
好な樹脂封止ハイブリツドICを提供することが
でき、後工程により、部品を内部端子に電気的に
短いパスで、しかも確実に接続することができ
る。 Therefore, it is possible to provide a resin-sealed hybrid IC that is easier to assemble than conventional ones, and allows components to be electrically connected to internal terminals in a short and reliable manner in a post-process. be able to.
第１図は本考案の内部端子を有する樹脂封止ハ
イブリツドICの断面図、第２図は従来の樹脂封
止ハイブリツドICの断面図、第３図は従来の樹
脂封止ハイブリツドICの後工程断面図、第４図
は本考案の実施例を示す内部端子を有する樹脂封
止ハイブリツドICの製造工程断面図である。
１……セラミツク基板、２……入出力用端子、
３……搭載部品、１１……チクソトロピツク性の
樹脂、１２……デイスペンサ、１３……内部端
子、１４……ダム、１５……低粘度，流動性の充
填用樹脂。
Figure 1 is a cross-sectional view of a resin-sealed hybrid IC with internal terminals according to the present invention, Figure 2 is a cross-section of a conventional resin-sealed hybrid IC, and Figure 3 is a cross-section of a conventional resin-sealed hybrid IC in post-processing. 4 are sectional views showing the manufacturing process of a resin-sealed hybrid IC having internal terminals, showing an embodiment of the present invention. 1... Ceramic board, 2... Input/output terminal,
3...Mounted parts, 11...Thixotropic resin, 12...Dispenser, 13...Internal terminal, 14...Dam, 15...Low viscosity, fluid filling resin.
Claims (1)
と、 (c) 前記基板の片面上に接続され、充填が予定
される樹脂の高さより高くなるように導出さ
れる内部端子と、 (d) 前記基板の端部に形成されるチクソトロピ
ツク性の樹脂からなるダムと、 (e) 前記基板の片面上にデイスペンス方式によ
り充填される樹脂とを具備したことを特徴と
する樹脂封止ハイブリツドICの端子構造。 (2) 前記内部端子は前記基板の主表面に対して略
直角に接続されるようにしたことを特徴とする
実用新案登録請求の範囲第１項記載の樹脂封止
ハイブリツドICの端子構造。[Claims for Utility Model Registration] (1) (a) Parts mounted on one side of the board, (b) Input/output terminals that sandwich the ends of the board, (c) On one side of the board (d) a dam made of thixotropic resin formed at an end of the substrate; (e) an internal terminal connected to the substrate and led out to be higher than the height of the resin to be filled; (d) a dam made of a thixotropic resin formed at an end of the substrate; A terminal structure of a resin-sealed hybrid IC characterized by comprising a resin filled on one side of the IC by a dispensing method. (2) The terminal structure of a resin-sealed hybrid IC according to claim 1, wherein the internal terminal is connected at a substantially right angle to the main surface of the substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987034447U JPH0546279Y2 (en) | 1987-03-11 | 1987-03-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987034447U JPH0546279Y2 (en) | 1987-03-11 | 1987-03-11 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63142854U JPS63142854U (en) | 1988-09-20 |
| JPH0546279Y2 true JPH0546279Y2 (en) | 1993-12-03 |
Family
ID=30843007
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987034447U Expired - Lifetime JPH0546279Y2 (en) | 1987-03-11 | 1987-03-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0546279Y2 (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5179265A (en) * | 1975-01-06 | 1976-07-10 | Hitachi Ltd |
-
1987
- 1987-03-11 JP JP1987034447U patent/JPH0546279Y2/ja not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5179265A (en) * | 1975-01-06 | 1976-07-10 | Hitachi Ltd |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63142854U (en) | 1988-09-20 |
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