JPH02107015A - Mounting part construction for crystal resonator - Google Patents
Mounting part construction for crystal resonatorInfo
- Publication number
- JPH02107015A JPH02107015A JP25994988A JP25994988A JPH02107015A JP H02107015 A JPH02107015 A JP H02107015A JP 25994988 A JP25994988 A JP 25994988A JP 25994988 A JP25994988 A JP 25994988A JP H02107015 A JPH02107015 A JP H02107015A
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- case
- projecting part
- conductive adhesives
- crystal resonator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000013078 crystal Substances 0.000 title claims abstract description 7
- 238000010276 construction Methods 0.000 title 1
- 239000011810 insulating material Substances 0.000 claims abstract description 4
- 239000000853 adhesive Substances 0.000 abstract description 17
- 230000001070 adhesive effect Effects 0.000 abstract description 17
- 230000002950 deficient Effects 0.000 abstract description 3
- 230000006866 deterioration Effects 0.000 abstract description 3
- 239000000919 ceramic Substances 0.000 abstract description 2
- 230000015572 biosynthetic process Effects 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 2
- 238000004070 electrodeposition Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000005219 brazing Methods 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
Landscapes
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、小型電子機器に使われる水晶振動子ユニット
の、特に面実装に適した薄型の絶縁材よりなるケースに
ついて、このケース内に振動片をマウントする際の好ま
しい構造を提供するものである。[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a case made of a thin insulating material suitable for surface mounting of a crystal resonator unit used in a small electronic device. This provides a preferred structure for mounting the pieces.
本発明は、薄板状の振動片をケース内にマウントするに
際し、双方の対接するTL極同士を導電接着剤で貼り付
は固着する。この固着のための位置、つまりケースの底
面の電極の位置に凸部を設け、そこに導電接着剤を滴下
して塗布し、機械的固着と電気的接続を得るものであり
、これによって振動片とマウント位置のズレ、それに導
電接着剤の最によって発生する水晶振動子の内部型Aへ
間のショートや振動もれによる性能低下の要因を防くも
のである。In the present invention, when mounting a thin plate-shaped vibrating piece in a case, both opposing TL poles are attached and fixed with a conductive adhesive. A convex part is provided at the position for this fixation, that is, at the electrode position on the bottom of the case, and a conductive adhesive is applied by dropping it there to obtain mechanical fixation and electrical connection. This prevents performance deterioration due to misalignment of the mount position, short circuit between the internal mold A of the crystal oscillator, and vibration leakage caused by the conductive adhesive.
従来のマウント構造は第2図a、bに示すようにケース
4の底面4′の上にAuメツキを施した電極3があり、
その位置の上に振動片1の電極部がくるように双方を面
接するため、従来から導電接着剤2を施していた。その
際、その滴下して塗布する位置は、電極位置を目安とし
た目視で行っていた。従ってその位置はまちまちで、し
かも導電接着剤の量も一定でない、そのような条件で振
動片をマウントした従来において、第2図すの状態から
振動片1を圧接すると第2図aのように導電接着剤2は
平面方向に流敗し、その結果、電極のショートや支持の
アンバランスによる振動エネルギーのもれが生じ不良品
や性能の劣化が発生し問題であった。The conventional mount structure has an electrode 3 plated with Au on the bottom surface 4' of the case 4, as shown in FIGS. 2a and 2b.
Conventionally, a conductive adhesive 2 has been applied to both sides so that the electrode portion of the vibrating element 1 is placed above that position. At that time, the position at which the drop was applied was determined visually using the electrode position as a guide. Therefore, in the conventional method in which the vibrating element is mounted under such conditions that the position is different and the amount of conductive adhesive is not constant, when the vibrating element 1 is pressed from the state shown in Fig. 2, the result is as shown in Fig. 2 a. The conductive adhesive 2 flows in the plane direction, and as a result, vibration energy leaks due to electrode shorts and unbalanced support, resulting in defective products and performance deterioration, which is a problem.
本発明はこのような問題に対し、振動片の電極が対接す
べきケースの電極の位置を明確に、かつ設計的に定めら
れた位置とし、さらに滴下して塗布する導電接着剤の性
情の条件をも改善するものである。The present invention solves these problems by clearly setting the position of the electrode of the case where the electrode of the vibrating element should come into contact with the case, and by changing the properties of the conductive adhesive that is applied by dropping. It also improves conditions.
振動片の電極をマウントするべきケースの底面の位置に
凸部を設け、その凸部に導電接着剤を滴下して塗布し、
マウント位置を一定にするものである。A convex part is provided on the bottom of the case where the electrode of the vibrating piece is to be mounted, and conductive adhesive is applied by dropping it onto the convex part.
This is to keep the mounting position constant.
第1図a、bは本発明によるマウント部の構造を示すも
ので、セラミ、り等の絶縁材よりなるケース4の底面部
4′には凸部5が形成されている。FIGS. 1a and 1b show the structure of a mount according to the present invention, in which a convex portion 5 is formed on the bottom surface 4' of a case 4 made of an insulating material such as ceramic or porcelain.
この凸部の位置は、振動片1の基部にある電極1′が第
1図aに示すようにケースの底面4′に面接した位置で
あり、この凸部5は振cJ片lとの電気的接続も兼ねて
いる。従って、この凸部の数は少なくとも振動片の必要
とする接続端子数を備えるごとになる。The position of this convex portion is the position where the electrode 1' at the base of the vibrating piece 1 faces the bottom surface 4' of the case as shown in FIG. It also serves as a physical connection. Therefore, the number of convex portions is equal to at least the number of connection terminals required by the vibrating element.
この凸部5は、ケースを製造する工程で、金型等による
成形で作られるものであり、従ってその寸法や位置の精
度は振動片の設計と同様に管理できる。またケース底面
の電極3は、第3図に示すように凸部5を形成した上に
被着した電梅膜である。The convex portion 5 is formed by molding using a mold or the like in the process of manufacturing the case, and therefore, the accuracy of its dimensions and position can be controlled in the same way as the design of the vibrating element. Further, the electrode 3 on the bottom of the case is an electrically conductive membrane adhered onto a convex portion 5 as shown in FIG.
このように構成されたケース4の中に振動片1を収容し
て固定するには、第3図に示すように凸部5に導電接着
剤2を滴下して塗布する。このとき滴下のための微少ノ
ズルまたは性情針などの注滴工具はその先端が凸部5の
上に接触される。そしてその性情する量は、第3図に示
すように電極の表面よりわずかに盛り上がる程度とする
。しかる後に、第1図aに示すように振動片の電極1′
が」二記の導電接着剤2と一致する位置に弱い力で加圧
し接着する。このときの姿勢と位置がケース4と振動片
1に定められた条件を確保するものである。この状態は
導電接着剤2の粘性によって維持され、このまま加熱し
て硬化させ、振動片の基部を支持するとともに電気的接
続を、この固定によって行−っている。、これまでの実
施例は、接合媒体として導電接着剤を仕様した場合であ
るが、半田ボールまたは半田ペースト等、ろう材による
接合の場合も同様に凸部を利用できる。In order to accommodate and fix the vibrating element 1 in the case 4 configured as described above, the conductive adhesive 2 is applied dropwise to the convex portion 5 as shown in FIG. At this time, the tip of a dripping tool such as a minute nozzle or a sex needle is brought into contact with the top of the convex portion 5. As shown in FIG. 3, the amount is such that it rises slightly above the surface of the electrode. After that, as shown in FIG. 1a, the electrode 1' of the vibrating element is
Apply pressure with a weak force to the position corresponding to the conductive adhesive 2 described in Section 2 to adhere. The posture and position at this time ensure the conditions specified for the case 4 and the vibrating element 1. This state is maintained by the viscosity of the conductive adhesive 2, which is then heated and cured to support the base of the vibrating element and to establish electrical connection through this fixation. Although the embodiments described so far are cases in which a conductive adhesive is used as the bonding medium, the convex portion can be similarly utilized in the case of bonding using a brazing material such as a solder ball or solder paste.
本発明は詳述したような構造により、以下のような効果
を有する。すなわら、
(11凸部は設計的に定められた位置を示すものでその
後の工程の位置の基準となり作業性がよい。The present invention has the following effects due to the structure as described in detail. In other words, (11) The convex portion indicates a position determined by design, and serves as a reference for the position of the subsequent process, resulting in good workability.
(2) 導電接着剤を凸部に性情するに際し、その面
が工具のガイドとなり正確な位置に、かつ短時間にでき
る。(2) When applying the conductive adhesive to the convex portion, the surface serves as a guide for the tool, allowing it to be positioned accurately and in a short time.
(3)上述のようなマウント構造により、電極間のショ
ートによる不良品や支持構造の不均一による性能低下が
防止でき、高品質の薄型の水晶振vJ子ユニットが得ら
れる。(3) With the above-described mounting structure, it is possible to prevent defective products due to short-circuits between electrodes and performance degradation due to non-uniformity of the support structure, and a high-quality, thin crystal vJ unit can be obtained.
第1図+a1. fblは本発明のマウントを示す図面
、(alはその平面図、fblは+81図のA−A’断
面図、第2図(al、 (blは従来からのマウントを
示す図面、ialは平面図、(b)は+81図の八−Δ
′の断面図、第3図は本発明の要部を拡大した断面図で
ある。
1・・・振動子片 2・・・導電接着剤3・・・−
電極 4・・・ケース5 ・
・凸部
以上
出願人 セイコー電子部品株式会社
代理人 弁理士 林 敬 之 助・1+f
許
庁
区
巳
殿
1゜
事件の表示
昭和63年
特許願
第259949号
発明の名称
水晶振動子のマウント部の構造
補正をする打
’ISnとの関係Figure 1+a1. fbl is a drawing showing the mount of the present invention; , (b) is +81 figure 8-Δ
', and FIG. 3 is an enlarged cross-sectional view of essential parts of the present invention. 1... Vibrator piece 2... Conductive adhesive 3...-
Electrode 4...Case 5 ・Convex part and above Applicant: Seiko Electronic Components Co., Ltd. Agent Patent attorney: Keisuke Hayashi・1+f Indication of the case of Miden 1°, Kyocho-ku, 1988 Patent Application No. 259949 Title of the invention Relationship with ISn that corrects the structure of the crystal oscillator mount
Claims (1)
位置に電気的接続を兼ねてマウントする構造であって、
振動片の電極部と、前記所定の位置とが面接してマウン
トされるものにおいて、前記所定の位置が電極部である
と共に、前記所定位置のケースの底面が凸部を形成して
いることを特徴とする水晶振動子のマウント部の構造。It has a structure in which a thin plate-shaped vibrating piece is mounted at a predetermined position on the bottom of a case made of an insulating material for electrical connection,
In the case where the electrode part of the vibrating element and the predetermined position are mounted face-to-face, the predetermined position is the electrode part, and the bottom surface of the case at the predetermined position forms a convex part. The structure of the crystal oscillator mount is a distinctive feature.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP25994988A JPH02107015A (en) | 1988-10-15 | 1988-10-15 | Mounting part construction for crystal resonator |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP25994988A JPH02107015A (en) | 1988-10-15 | 1988-10-15 | Mounting part construction for crystal resonator |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH02107015A true JPH02107015A (en) | 1990-04-19 |
Family
ID=17341158
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP25994988A Pending JPH02107015A (en) | 1988-10-15 | 1988-10-15 | Mounting part construction for crystal resonator |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH02107015A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007274352A (en) * | 2006-03-31 | 2007-10-18 | Kyocera Kinseki Corp | Support structure of crystal oscillating piece |
JP2011188308A (en) * | 2010-03-09 | 2011-09-22 | Nippon Dempa Kogyo Co Ltd | Piezoelectric resonator, and method of manufacturing the same |
JP2012039237A (en) * | 2010-08-04 | 2012-02-23 | Kge-Kun Kwoak | Manufacturing method for surface adhesive type micro electro mechanical system oscillator and structure of the same |
-
1988
- 1988-10-15 JP JP25994988A patent/JPH02107015A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007274352A (en) * | 2006-03-31 | 2007-10-18 | Kyocera Kinseki Corp | Support structure of crystal oscillating piece |
JP2011188308A (en) * | 2010-03-09 | 2011-09-22 | Nippon Dempa Kogyo Co Ltd | Piezoelectric resonator, and method of manufacturing the same |
US8604675B2 (en) | 2010-03-09 | 2013-12-10 | Nihon Dempa Kogyo Co., Ltd. | Piezoelectric resonator and method of manufacturing piezoelectric resonator |
JP2012039237A (en) * | 2010-08-04 | 2012-02-23 | Kge-Kun Kwoak | Manufacturing method for surface adhesive type micro electro mechanical system oscillator and structure of the same |
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