JPH0878892A - Vacuum-clamping nozzle and bonding method with bond, using the nozzle - Google Patents

Abstract

PURPOSE: To provide a vacuum-clamping nozzle having a good working efficiency, high mounting accuracy and more high reliability and bonding method using the nozzle. CONSTITUTION: A vacuum-clamping nozzle 6 having a through-hole 6a to flow an air to clamp a work is provided with a heating unit 7, at least, at a work clamping part and suction air flow accelerator (notch or hole leading to the hole 6a, at least, at the work clamping part. One work (support 1) is clamped by the nozzle 6, moved to specified place on another work (lead-out electrode 11) and positioned to contact, using one means. A bond 5 is coated on the other work, the one work is contacted with an upper part of the other work, the heating unit 7 is heated to cure the bond, using another means. Thus, both means bond the works.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a suction nozzle used for joining electric parts, electronic parts, etc., and a joining method using a joining material using the suction nozzle.

[0002]

2. Description of the Related Art A conventional joining method using a joining material using a suction nozzle used for assembling electric parts, electronic parts, etc. is shown in FIG.
Will be explained together. FIG. 6 is a perspective view showing a step of joining a support for mounting an electronic component element such as a piezoelectric element in a package for an electronic component such as a piezoelectric vibrator. The substrate 1 made of a ceramic substrate such as alumina is provided with extraction electrodes 11 and 12 for establishing electrical connection with an external terminal (not shown), and a conductive adhesive 51 is applied by a dispenser needle 3. The conductive adhesive 51 is temporarily hardened by a heater rail (not shown), the support 21 for mounting the piezoelectric vibrating plate (not shown) is sucked by the suction nozzle 4, and is moved to the position of the extraction electrode 11. Then, position, contact and temporarily fix. Then, full-scale hardening and joining is performed by a heating furnace which is the subsequent process.
The conductive pad 12 and the support 22 are made of a conductive adhesive 5
It is in the state of being joined by the joining method through 1.

[0003]

However, as described above, the manufacturing process must go through the steps of applying the bonding material and positioning and bonding, and the heating step, which is problematic in terms of workability.
In addition, the mechanism (heater rail, etc.) in the heating process also becomes large, which has been a cause of increased capital investment.
In addition, from temporary fixing to full-scale curing and joining, the objects to be joined, such as supports, may be displaced or tilted, and they may be joined in a displaced or inclined state, leading to product defects.

Therefore, an object of the present invention is to provide a highly reliable suction nozzle with high working efficiency and high mounting accuracy, and to provide a joining method using a joining material using this suction nozzle. .

[0005]

As a means therefor, in a suction nozzle having a through hole through which suction air for sucking and holding an article to be joined is provided, at least a portion for sucking and holding the article to be joined is provided with a heat generating function. . Further, in a suction nozzle having a through hole for circulating suction air for sucking and holding an object to be joined, at least a portion for sucking and holding the object to be joined has a suction air flow promoting portion (a notch portion extending to the through hole, or a hole). Sections, etc.).

[0006] A suction nozzle with a heat generating function having a through hole through which suction air for holding and holding one object to be bonded is sucked by the one object to be bonded and at a predetermined position of another object to be bonded. There is a means for moving, positioning and contacting with the above, and a bonding material applied on the other object to be bonded in advance. The objects to be joined are joined together by means of hardening the material.

One of the objects to be joined is a thin metal plate which constitutes a support for mounting the electronic component element, and the other object to be joined is an electrode pad provided on the upper portion of the ceramic plate on which the electronic component element is arranged. It is characterized by Further, one object to be bonded is a piezoelectric plate, and the other object to be bonded is a thin plate-shaped metal plate constituting a support for mounting the piezoelectric plate. Alternatively, it is characterized in that it is an electrode pad provided on the upper part of the ceramic plate on which the piezoelectric plate is arranged.

[0008]

According to the first aspect of the present invention, it is possible to have a function as a suction nozzle for sucking the objects to be bonded and a function as a welding heating element for the bonding material, so that it is not necessary to separately provide a heating mechanism. Further, it becomes possible to locally heat only the joint portion.

According to the second aspect of the present invention, a constant flow rate of air constantly flows during suction, so that the cooling efficiency of the heating element after completion of energization can be improved.

According to the third aspect of the present invention, the suction nozzle for sucking the objects to be joined is provided with a heat generating portion and serves as a suction and welding heating element. Therefore, this suction and welding heating element sucks and holds one object to be joined. , Other objects to be joined can be moved to a predetermined position or accurately positioned. Then, from the upper part of the other article to which the joining material is applied in advance, the suction and welding heating element that holds one article to be joined is pressed, and heat is generated as it is, thereby melting or hardening the joining material. Both can be joined (a brazing material such as a solder can be fused and then cooled, and a thermosetting adhesive can be hardened to be joined).
In addition, since it is a suction nozzle, air can be circulated, so that the heat generating portion can be cooled.

According to claim 4, since at least one suction nozzle has a heat generating function, the support can be positioned and the bonding material can be melted or cured as it is. Therefore, the support bonding can be easily performed without shifting or tilting. It became so.

According to claim 5, since at least one suction nozzle has a heat generating function, the piezoelectric plate can be positioned and the bonding material can be melted or cured as it is, so that the piezoelectric plate can be mounted without displacement or tilting. Can be done easily.

[0013]

Next, a first embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a sectional view showing a first embodiment of the present invention. FIG. 2 is a sectional view showing the overall system of FIG. The same parts as in the prior art are given the same numbers. The first embodiment of the present invention is a package for electronic parts, for example, a support for holding a piezoelectric plate mounted inside a surface-mounted piezoelectric vibrator and an electrode pad such as a lead electrode formed on a package substrate. Is to join and. The substrate 1 is made of a ceramic substrate such as alumina, a metal ring 13 such as Kovar is integrally provided around the substrate, and a recess 1 for accommodating a piezoelectric plate is provided inside thereof.
a is provided. Lead-out electrodes 11 and 12 for electrically connecting to the outside are also integrally formed in the recess 1a. Then, a conductive bonding material 5 such as solder is applied on the extraction electrode by a dispenser (not shown). The supports 21 and 22 for holding the piezoelectric plates have a stepped shape in order to have a buffering function, and are made of, for example, nickel silver, Cu—Ni—Zn alloy, or a metal plate made of SUS or the like. The suction nozzle 6 that suction-holds the substrate coupling portion 21a of the support has a through hole 6a in the center portion.
Is provided, is configured to allow suction air to flow, and is made of a heat insulator such as ceramic. A heating element 7 such as a resistance heating element or a lamp heater is attached to the tip portion of the suction nozzle in order to have a function as a welding heating element for the bonding material. A through hole 7a is provided in the portion so as to allow suction air to flow therethrough, and the annular pipe portion 6b of the suction nozzle 6 is provided.
The wiring 7b is provided via the. Then, the suction nozzle 6 that holds the support 21 by suction holds the conductive bonding material 5
The air which is installed on the extraction electrode 11 to which is coated, and the heating element 7 is energized to generate heat in a pressed state, thereby melting the conductive bonding material 5, stopping the energization to stop the heat generation, and sucking and holding the air. The conductive bonding material 5 can be hardened by cooling due to the flow of. As shown in FIG. 2, the negative pressure suction air flowing through the suction nozzle 6 is supplied from the vacuum pump P, and the suction force is controlled on the vacuum pump P side. Further, the heating element 7 is energized by being supplied from the power source G, and the temperature adjustment of the heating element can be controlled by the voltage of the power source G.

Next, a second embodiment of the present invention will be described with reference to the drawings. FIG. 3 is a sectional view showing a second embodiment of the present invention. The same parts as those in the first embodiment are designated by the same reference numerals. In a second embodiment of the present invention, in a package for electronic parts, for example, a support for holding a piezoelectric plate mounted inside a surface-mounted piezoelectric vibrator and a piezoelectric plate are joined together. The substrate 1 is made of a ceramic substrate such as alumina, a metal ring 13 such as Kovar is integrally provided around the substrate, and a recess 1a for accommodating the piezoelectric plate is provided inside thereof. Lead-out electrodes 11 and 12 for electrically connecting to the outside are also integrally formed in the recess 1a. Then, supports 21 and 22 for holding the piezoelectric plate are mounted on the extraction electrodes by a conductive adhesive 51 such as solder. This support 2
Reference numerals 1 and 22 have a stepped portion to have a buffering function. For example, nickel silver, Cu-Ni-Zn alloy, S
It is made of a metal plate made of a material such as US. A conductive adhesive 51 is applied to the element mounting portions 21b and 22b of the support by a dispenser (not shown). The piezoelectric plate 9 is made of, for example, an AT-cut crystal piece that causes thickness shear vibration, and excitation electrodes are formed on the front and back surfaces (not shown). The suction nozzle 61 that holds the piezoelectric plate 9 by suction is
A through hole (not shown) is provided in the central portion, which is configured to allow suction air to flow therethrough, and is made of a heat insulator such as ceramic. A heating element 71 such as a resistance heating element or a lamp heater is attached to the tip of the suction nozzle so as to have a function as a welding heating element for the bonding material. A through hole (not shown) is provided in the portion so as to allow suction air to flow therethrough, and a cutout portion 71a is provided as a suction air circulation promoting portion. Then, the suction nozzle 61 that suction-holds the piezoelectric plate 9 is installed on the element mounting portion 21b of the support coated with the conductive adhesive 51, and the heating element 71 is energized to generate heat in a pressed state, The conductive adhesive 51 can be cured.

Next, a third embodiment of the present invention will be described with reference to the drawings. FIG. 4 is a sectional view showing a third embodiment of the present invention. The same parts as those in the first and second embodiments are designated by the same reference numerals. A third embodiment of the present invention is a package for electronic parts, for example, a piezoelectric plate mounted inside a surface-mounted piezoelectric vibrator and a lead electrode provided on an upper portion of a ceramic plate on which the piezoelectric plate is arranged. It is for joining with the electrode pad. The substrate 1 is made of a ceramic substrate such as alumina, a metal ring 13 such as Kovar is integrally provided around the substrate 1, and a recess 1b for accommodating the piezoelectric plate is provided inside thereof. Recess 1
In b, extraction electrodes 14 and 15 for conducting to the outside are provided.
Are also integrally formed. Then, the conductive adhesive 51 is applied to the upper portion of the extraction electrode by a dispenser (not shown). The piezoelectric plate 9 is made of, for example, an AT-cut crystal piece that causes thickness shear vibration, and excitation electrodes are formed on the front and back surfaces (not shown). The suction nozzle 62 that suction-holds the piezoelectric plate 9 is provided with a through hole (not shown) in the central portion thereof, is configured to allow suction air to flow, and is made of a heat insulator such as ceramic. And
A heating element 72 such as a resistance heating element or a lamp heater is attached to the tip portion of the suction nozzle in order to have a function as a welding heating element for the bonding material. Is provided with a through hole (not shown) so that suction air can flow therethrough, and a hole portion 72a is provided as a suction air flow promoting portion. The suction nozzle 62 that holds the piezoelectric plate 9 by suction is installed above the extraction electrodes 14 and 15 to which the conductive adhesive 51 is applied. The adhesive 51 can be cured.

Next, a fourth embodiment of the present invention will be described with reference to the drawings. FIG. 5 is a sectional view showing a fourth embodiment of the present invention. The second embodiment of the present invention is to join metal plates such as terminal plates. The metal plates 81 and 82 that are the objects to be bonded are suction-held by the suction nozzles 61 and 62, respectively, and the surface of the metal plate 81 facing the suction nozzle 61 is coated with the conductive bonding material 5. Through holes 61a, 62a are formed in the central portions of the suction nozzles 61, 62.
Is provided, is configured to allow suction air to flow, and is made of a heat insulator such as ceramic. Further, heating elements 71, 72 such as resistance heating elements and lamp heaters are attached to the tip portions of the suction nozzles so as to have a function as a welding heating element for the bonding material. The through holes 71a and 72a are also provided in the central portions of the 71 and 72, and the suction air is circulated.
In this state, the two metal plates sucked and held are brought into contact with each other so that the suction nozzles face each other.
It is possible to cure the conductive bonding material 5 by melting the conductive bonding material 5 by energizing and generating heat, stopping the power supply to stop the heat generation, and cooling by the circulation of the air that is suction-held.

[0017]

According to the present invention, since the suction nozzle for sucking the objects to be joined is provided with the heat generating portion for melting the joining material and serves as the suction and welding heating element, this suction and welding heating element is the only object to be covered. It is possible to suck and hold a bonded object, move it to a predetermined position on another object to be bonded, or accurately position it.
The bonding material can be melted or hardened by suctioning and pressing one object to be bonded from above the other material to which the bonding material has been applied by suction, and then directly generating heat. Also, if a suction air flow promotion part is provided, a constant flow rate of air will always flow during suction, so it is possible to improve the cooling efficiency of the heating element after the end of energization, and when using a brazing material such as solder. It becomes easier to cure by cooling after melting.

Further, since at least one suction nozzle has a heat generating function, it is not necessary to separately provide a heating mechanism and the facility can be simplified. Accordingly, the bonding process by the bonding material, the positioning device, and the suction nozzle can be simplified. The device can be simplified. Further, since it is possible to locally heat only the joint portion, it is possible to easily melt or cure the joint material without adversely affecting the other components.

[Brief description of drawings]

FIG. 1 is a sectional view showing a first embodiment of the present invention.

2 is a cross-sectional view of the overall system of FIG.

FIG. 3 is a sectional view showing a second embodiment of the present invention.

FIG. 4 is a sectional view showing a third embodiment of the present invention.

FIG. 5 is a sectional view showing a fourth embodiment of the present invention.

FIG. 6 is a cross-sectional view showing a conventional example.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Substrate 11, 12, 14, 15 ... Extraction electrode 13 ... Metal ring 21,22 ... Support 3 ... Dispenser needle 4 ... Suction nozzle 5 ... Conductive bonding material 51 ... Conductive adhesive 6,61,62 ... Suction nozzle 7,71,72 ... Heating element 81,82 ... Metal plate 9 ... Piezoelectric plate

Claims (5)

[Claims] 1. A suction nozzle having a through hole through which suction air for sucking and holding an object to be joined is provided, wherein at least a portion for sucking and holding the object to be joined is provided with a heat generating function. 2. A suction nozzle having a through hole for circulating suction air for sucking and holding an object to be joined, wherein at least a portion for sucking and holding the object to be joined is provided with a suction air circulation promoting portion. Suction nozzle. 3. A suction nozzle having a heat generating function, which has a through-hole for circulating suction air for suction-holding one object to be bonded, sucks the one object to be bonded, and at the same time determines another object to be bonded. There is a means for moving to the position of, the positioning and the contact, and the bonding material applied on the other object to be bonded in advance, and after heating the one object to be bonded to the upper part, the heating portion is heated. A joining method, wherein both objects to be joined are joined together by means of melting or hardening the joining material. 4. One of the objects to be joined is a thin metal plate constituting a support for mounting electronic component elements, and the other object to be joined is an electrode provided on an upper portion of a ceramic plate on which the electronic component elements are arranged. The pad according to claim 3, which is a pad.
The joining method described. 5. One of the objects to be bonded is a piezoelectric plate, and the other object to be bonded is provided on a thin metal plate forming a support for mounting the piezoelectric plate, or on a ceramic plate on which the piezoelectric plate is arranged. The bonding method according to claim 3, wherein the bonding pad is an electrode pad.