JP2003046356A - Method for manufacturing piezoelectric vibrator - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing a piezoelectric vibrator that can enhance the support and fixing strength of a vibration element chip housed in a downsized piezoelectric vibrator package. SOLUTION: The method for manufacturing the piezoelectric vibrator that uses an adhesive agent to apply cantilever support to the vibrating element chip so as to adhere the chip onto a package substrate includes a step of placing an adhesion member, a step of placing the adhesive member and the vibrating element chip, and a step of sucking the vibration element chip at least before fixing the chip by the adhesive member to float a tip of the vibrating element chip opposite to the fixed part thereof.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a crystal unit in which a piezoelectric element plate is stably mounted and held substantially parallel to a container substrate.

[0002]

2. Description of the Related Art With the recent trend of high functionality, high accuracy, miniaturization, and weight reduction of electronic equipment, similar problems have been demanded for electronic parts mounted on these electronic equipment. Also, in relation to the container shape, the mounting of components is changed from the conventional lead shape to the terminal shape of semiconductor component packages (DIP, ZIP, QFP, etc.), and further to the surface mounting shape with metallized electrodes on the substrate surface. Is being developed.

On the other hand, the holding structure of the vibrating element plate housed in the piezoelectric component container is also changed from the supporting structure of the metal piece (metal support).
As the outer shape of the container becomes smaller, the support structure has been changed to be directly mounted on the substrate. For the direct mounting on the container substrate, a conductive adhesive, solder, or a flip chip method similar to that for semiconductor integrated parts is being introduced. Regarding the support of the vibrating element plate, in order to satisfy the mechanical drop impact, both ends of the vibrating element plate in the longitudinal direction are held, and the thermal expansion change between the vibrating element plate and the substrate (mounting and holding section) is changed. In order to cope with the above, a structure for holding one side (cantilever) in the longitudinal direction of the vibrating element plate is also adopted.

[0004]

As described in the prior art, recently, since the piezoelectric components are rapidly changing to miniaturization, the shape of the piezoelectric component and the mounting structure are changed, and the outer shape of the piezoelectric component is changed. Since the size tends to be miniaturized and extremely miniaturized, the vibration element plate to be housed in the container must be naturally reduced as the outer shape of the container becomes smaller.

However, even if the outer shape of the vibrating element plate becomes small, the vibrating element plate needs to be thick or thin to obtain various oscillation frequencies (from low frequency to high frequency). However, there is a problem in that it is difficult to secure a sufficient holding portion area for holding the vibrating element plate, and it becomes difficult to firmly hold the vibrating element plate in the piezoelectric component container.

[0006]

In order to solve the above-mentioned problems, the present invention provides a method for manufacturing a piezoelectric vibrator in which a vibrating element plate is cantilevered by using an adhesive on a container substrate, and an adhesive member is installed. And a step of placing the adhesive member and the vibrating element plate, at least sucking the vibrating element plate before fixing the vibrating element plate with the adhesive member, and fixing a tip portion of the vibrating element plate opposite to the fixing portion. A method of manufacturing a piezoelectric vibrator, comprising a step of floating.

Therefore, by using the above-described method for manufacturing a piezoelectric vibrator, the vibrating element plate is stably mounted and held substantially parallel to the container substrate, so that the mechanical drop impact in the conventional cantilever holding can be prevented. By holding the vibrating element plate that holds the vibrating element plate substantially parallel to the holding substrate, a sufficient adhesive strength of the adhesive member that holds the vibrating element plate and conducts is achieved. be able to.

In the present invention, in order to secure the holding posture of the vibrating element plate, an adhesive member is installed on the container substrate, and the vibrating element plate is installed on the adhesive member, at least before the adhesive member is fixed. It is characterized in that it includes a step of sucking the vibrating element plate by suction and floating the tip end opposite to the fixed portion, without changing the bonded state by mounting the vibrating element plate on the container substrate. Although the structure is cantilevered by fixing, the vibration element plate is mounted and held substantially parallel to the container substrate so that the vibration element plate does not come into contact with the container substrate. By holding the vibrating element plate that holds the vibrating element plate substantially parallel to the holding substrate when a mechanical drop impact is applied while holding it, the vibrating element plate is held and conducts. Fully demonstrate the adhesive strength of adhesive members It can be. Furthermore, since it is possible to secure a sufficient gap between the vibrating element plate and the container substrate, by eliminating the pedestal portion between the vibrating element plate and the container substrate, the overall height of the container can be reduced and the cost of the container can be reduced. Can be reduced.

[0009]

BACKGROUND OF THE INVENTION In Japanese Unexamined Patent Publication No. 8-330886, a device piece is arranged on a surface of a flat plate base made of ceramics while being inclined, and the lower end of the device piece is metalized on the base via a conductive adhesive. There is disclosure of the invention characterized in that it is fixed to the wiring. However, the above-mentioned publication describes that the holding posture of the device piece is secured by devising the method of adhering the device piece and reinforcing the adhering portion or V-shape.

According to the present invention, in recent years, with the rapid change in size of piezoelectric components, along with changes in the shape and mounting structure of the piezoelectric components, the external dimensions of the piezoelectric components are also miniaturized, and the external shape of the container is miniaturized. In order to improve the holding strength of the vibrating element plate due to the reduced size and volume of the vessel (mounting area of the vibrating element plate), a piezoelectric element plate is obliquely mounted and held in the container. Disclosed is to dispose the vibrating element plate in parallel or obliquely with respect to the container substrate by improving the manufacturing method without requiring reinforcement or a V-shaped groove in the shape of the holding portion of the vibrating element plate.

[0011]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the accompanying drawings. In addition, in each figure, the same reference numerals denote the same objects. In FIG. 1, the vibrating element plate 2 mounted on the container substrate 1 is supported by cantilever support before the lid of the piezoelectric vibrator is covered and before the adhesive member 3 is fixed. Although the electrode is not shown, it shows a state in which the container substrate 1 and the vibrating element plate 2 are mounted while being held in a posture substantially parallel to the longitudinal direction of the vibrating element plate 2.

In the state shown in FIG. 1, the initial state in which the adhesive member 3 is installed and the vibrating element plate is mounted (the vibrating element plate and the substrate are almost In order to maintain the parallel element (fixed in parallel), at least before the fixing of the adhesive member, the vibrating element plate 2 is sucked by suction to the vibrating element plate 2 and the tip end opposite to the fixing portion is floated. Is aimed at. The suction here is realized by using the vibrating element plate 2 and the suction head mounted thereon.

FIG. 2 shows a flow chart of the method for manufacturing the piezoelectric vibrator of the present invention. Note that the flow of FIG. 2 will be described focusing on the step of holding the vibrating element plate 2 with an adhesive member 3 (for example, a conductive adhesive, solder, bump, etc.), which is a feature of the present invention, and then fixing the adhesive member 3. To do. The process flow of the method of manufacturing the piezoelectric vibrator in which the vibrating element plate 2 is cantilevered on the container substrate 1 using the adhesive according to the present invention is (1)
The adhesive member 3 is installed on the container substrate, (2) the vibrating element plate is installed on the adhesive member 3, and (3) at least the adhesive member 3
The method for manufacturing a piezoelectric vibrator is characterized by including the step of sucking the vibrating element plate by suction before adhering, and floating the tip end opposite to the adhering part.

In the case where the vibrating element plate is sucked and floated by suction only when the vibrating element plate is mounted on the adhesive member 3 by the step of sucking and floating the vibrating element plate at least before fixing the adhesive member 3 in FIG. And the case where the vibrating element plate is floated by suction until the fixing of the adhesive member 3 is completed.

The present invention is characterized by including at least the step of sucking and floating the vibrating element plate by suction before adhering the adhesive member 3. The vibrating element plate 2 is attached to the container substrate 1.
It is held substantially parallel to, and exhibits the holding strength of the adhesive member 3 to the vibrating element plate 2. Although the vibrating element plate 2 is mounted on the flat container substrate 1 in the present embodiment, the shape of mounting and storing the vibrating element plate 2 is not limited to the flat substrate, and may be a commonly used container form. It goes without saying that the present invention can be applied.

On the other hand, in order to reliably perform the manufacturing method of the present invention, the vibrating element plate 2 above which the adhering member 3 is arranged is different from the side view showing the adhering form of the vibrating element plate 2 of FIG. 1 shown in FIG. FIG. 3 is a side view showing a holding portion 4 arranged to prevent the entire vibrating element plate 2 from floating when the vibrating element plate 2 is floated by suction. In the practice of the present invention, since the main purpose is to float the vibrating element plate by suction by suction, solder, adhesive, bumps are assumed as the material of the adhesive member, but the material is not limited to this, and the adhesive member The arrangement is not limited either. Further, although the suction direction is shown from the upper side in the drawing, it is needless to say that the same effect can be obtained even if the suction direction by suction is downward.

[0017]

As described above, according to the manufacturing method of the present invention, it is possible to secure the holding strength between the container substrate and the vibrating element plate even if the container is small and has a low profile.
Even when the external dimensions of the piezoelectric vibrator are reduced, it is possible to maintain sufficient mechanical strength and drop strength, and to improve the changes in the characteristics of the vibrator itself due to these. Therefore, even if the container itself is inexpensive, the vibrating element plate can be firmly fixed, and thus the cost of the piezoelectric vibrator itself can be reduced.

[Brief description of drawings]

FIG. 1 is a side view showing a bonded form of a vibrating element plate of the present invention.

FIG. 2 is a flow chart of a manufacturing method of the present invention.

FIG. 3 is a side view showing a bonded form of a vibrating element plate according to another embodiment of the present invention.

[Explanation of symbols]

1 container substrate 2 Vibration plate 3 Adhesive members 4 Hold down part

Claims (2)

[Claims] 1. A method of manufacturing a piezoelectric vibrator in which a vibrating element plate is cantilevered using an adhesive agent on a container substrate, the step of installing an adhering member, and placing the adhering member and the vibrating element plate. Manufacture of a piezoelectric vibrator comprising a step and a step of at least sucking the vibrating element plate before fixing the vibrating element plate with an adhesive member and floating a tip portion of the vibrating element plate opposite to the fixing portion. Method. 2. The method of manufacturing a piezoelectric vibrator according to claim 1, wherein a pressing portion is arranged above the adhesive member for fixing the vibrating element plate.