JPH04188652A - High frequency element package and manufacture thereof - Google Patents

Abstract

PURPOSE:To enable a package provided with a terminal resistor whose both ends are connected to the end of a signal line and a ground circuit respectively to be easily formed by a method wherein a base plate is made to adhere to the back of a package main body, and the bottom of a cavity is sealed up with the base plate concerned. CONSTITUTION:A high frequency element housing package 10 is provided, where a terminal resistor 60 whose one end is connected to the end of an electrode connecting signal line 20 of a high frequency element around a cavity and other end is connected to a ground circuit 40 of the package 10 is provided to the inner side face of the cavity 30 or the front end face of a step provided to the side face of a recess 12. A viahole filled with metallized conductor or provided with metallized conductor on its inner circumferential surface is provided to the package 10 of ceramic. By this setup, a required package can easily be obtained without costing much labor.

Description

Detailed Description of the Invention [Industrial Application Field] The present invention relates to a method for manufacturing a package that accommodates a high-frequency element such as a semiconductor chip operated with a high-frequency signal of 10 to 2 QGHz, etc., and a high-frequency device formed using the method. This invention relates to an element package.

1. Prior Art] A high-frequency element is housed in a cavity provided in a package body made of ceramic, and the electrodes of the element are connected to wires or TAB (Tape A, automated
2. Description of the Related Art A high-frequency element package is well known that is used by connecting to a signal line for wiring around a cavity via a conductor line (hereinafter collectively referred to as a wire or the like) on a bonding tape.

In this package, as the frequency of the high-frequency elements housed in the cavity has progressed recently. A package in which a signal line for wiring provided in the package body and a ground circuit are connected through a terminating resistor has been developed and is used in a package that houses high-frequency devices.

This package has a ceramic package body directly below the signal line. A via hole connected to the ground circuit provided in the package body is provided, and the via hole is filled with a terminating resistor whose one end is connected to the signal line and the other end is connected to the ground circuit. There is.

In this package, when a high-frequency signal is transmitted through a wire, etc. between the signal line for wiring around the cavity of the package body and the electrode of a high-frequency element housed in the cavity, the signal line connected to the wire, etc. The reflected signal of the high-frequency signal that hits the end of the signal line and returns to the signal line is rejected to the ground circuit through the terminating resistor, and the reflected signal mixes into the electrode of the high-frequency element through the wire etc. Prevented.

[Problems to be Solved by the Invention] However, in the above-mentioned high-frequency device package, the terminating resistor is provided not at the end of the signal line but over the middle part of the signal line and the ground circuit. A part of the reflected signal of the high-frequency signal that is reflected by the signal line and returns to the signal line does not reach the middle part of the signal line equipped with a terminating resistor, and leaks into the wire from the signal line part where the wire etc. are connected in the middle. , it got mixed into the electrodes of high-frequency devices.

Note that in order to prevent the reflected signal from leaking to the wire or the like as described above, the end of the signal line and the ground circuit may be connected through a terminating resistor.

However, for this purpose, it is necessary to provide a terminating resistor on the inner surface of the cavity of the package body, and it is extremely difficult to provide such a terminating resistor on the inner surface of the cavity using conventional technology. It took a lot of effort and was almost impossible.

The reason for this is that by using techniques such as screen printing, a resistor paste for forming a terminating resistor is applied in a narrow strip shape to the inside surface of the extremely narrow cavity surrounding the increasingly smaller package body, and then baked. This is because a terminating resistor had to be provided on the inner surface of the cavity.

The present invention solves this problem by easily creating a package equipped with a terminating resistor on the inner surface of a cavity, one end of which is connected to the end of the signal line, and the other end of which is connected to the ground circuit. A method for manufacturing a package for a high-frequency element (hereinafter referred to as a method for manufacturing a package) that can be formed into
A high-frequency device package (hereinafter referred to as
The purpose is to provide a package (called a package).

[Means for Solving the Problem 3] For the above purpose, the first package manufacturing method of the present invention includes a package body having a concave portion on the surface formed by laminating and integrally firing a plurality of ceramic green sheets. A signal line for wiring is provided around the bottom surface of the recess, a ground circuit is provided in the package body below the signal line, and a via that extends to the ground circuit extends between the signal line and the package body directly below the signal line. A package body having a hole is provided, and the via hole of the package body is filled with a resistor paste, or the resistor paste is applied to the inner peripheral surface of the via hole, and the resistor paste is baked. After providing a via hole filled with a resistor in the package body or a via hole with a resistor on the inner circumferential surface, a cavity is cut through the via hole vertically at the bottom of the recess inside the signal line. , a terminating resistor made of a part of the resistor, the negative end of which is connected to the signal line end and the other end of which is connected to the ground circuit, is provided on the inner surface of the cavity; The present invention is characterized in that a bottom plate is sealed to the back surface of the package body, and the bottom surface of the cavity is sealed with the bottom plate.

The second package manufacturing method of the present invention is a package body formed by laminating a plurality of low-temperature fired ceramic green sheets and having a concave portion on the surface, and a signal line for wiring is formed around the bottom of the concave portion. A low temperature fired metallized paste line for forming a ground circuit is provided on the package body forming body below the metallized paste line, and a low temperature fired metallized paste circuit for forming a ground circuit is provided on the package body forming body directly below the metallized paste line. After providing a package body forming body with a via hole filled with low temperature fired resistor paste or a via hole whose inner peripheral surface is coated with low temperature fired resistor paste, which connects the line to the metallized paste circuit, and dried, A cavity is formed in the bottom of the recess inside the metallized paste line by vertically extending the via hole, and the package body forming body, the metallized paste line, the metallized paste circuit, and the resistor paste are integrally fired at a low temperature to form a surface. A package body is provided with a recessed portion, a signal line is provided around the bottom surface of the recessed portion, and one end is connected to the signal line end portion on the inner side surface of the cavity that is transparently provided in the bottom surface of the recessed portion inside the signal line. , a part of the resistor paste whose other end is connected to the ground circuit is fired to form a package body equipped with a terminating resistor, and then a bottom plate is sealed to the back surface of the package body. It is characterized in that the bottom surface of the cavity is sealed with a bottom plate.

A third method of manufacturing a package according to the present invention is a package body formed by laminating a plurality of low-temperature fired ceramic green sheets and having a recessed portion on the surface with an inner surface shaped like a step, the inner surface of the recessed portion A low-temperature fired metallized paste line for forming a signal line for wiring is provided on the step surface of the recess, a low-temperature fired metallized paste circuit for forming a ground circuit is provided on the package body forming body below the metallized paste line, and a low-temperature fired metallized paste circuit for forming a ground circuit is provided on the bottom surface of the recess. A low-temperature fired ceramic green sheet that is a package body forming body having a transparent cavity and that constitutes a staircase surface having the metallized paste line is provided with a metallized paste line on the ceramic green sheet directly below the metallized paste line. After providing a via hole filled with low-temperature firing resistor paste or having a via hole coated with low-temperature firing resistor paste on the inner circumferential surface connected to the circuit and drying it, the ceramic green sheet surface inside the metallized paste line is coated with A package body forming body using a low-temperature firing ceramic green sheet having a through hole for forming the recess formed therethrough extending vertically through the via hole is provided, and the package body forming body, a metallized paste line, and a metallized paste circuit are provided. , a package body made by integrally firing resistor paste at low temperature and having a recess on the surface with a step-like inner surface, and a signal line for wiring is provided on the stepped surface of the inner surface of the recess, and the A terminating resistor formed by firing a part of the resistor paste, one end of which is connected to the end of the signal line and the other end of which is connected to the ground circuit below the signal line, is provided on the front end surface of the staircase surface provided with the signal line. The present invention is characterized in that a package main body is formed with a cavity transparently provided in the bottom surface of the recess, and then a bottom plate is sealed to the back surface of the package main body, and the bottom surface of the cavity is sealed with the bottom plate.

In the first, second and third package manufacturing methods of the present invention. Seal the bottom plate to the back of the package body. Before applying plating for bonding or anti-corrosion to the signal lines, ground circuits, bottom plate, and other conductor surfaces exposed around the cage, install at least a terminating resistor on the inside surface of the cavity of the cage body or the front end surface of the staircase surface. Preferably, a paste for forming an insulator is applied to the portion provided with the terminating resistor and baked, so that at least the portion provided with the terminating resistor on the inner surface of the cavity or the front end surface of the step surface is covered with the insulator.

A fourth method of manufacturing a package of the present invention is a package forming body having a recessed portion on the surface of which the inner surface has a step-like shape, which is formed by laminating a plurality of low-temperature fired ceramic green sheets, and the inner surface of the recessed portion is A low-temperature-fired metallized paste line for forming a signal line for wiring is provided on the staircase surface, a low-temperature-fired metallized paste circuit for forming a ground circuit is provided on a bag-one-pack body below the metallized paste line, and a low-temperature-fired metallized paste circuit for forming a ground circuit is provided. A low-temperature fired ceramic green sheet that is a package forming body having a bottomed cavity at the bottom of the recess and that constitutes a staircase surface having the metallized paste line is metallized on the ceramic green sheet directly below the metallized paste line. After connecting the paste line to the metallized paste circuit, a via hole filled with low-temperature fired resistor paste or a via hole coated with low-temperature fired resistor paste on the inner peripheral surface is provided and dried. A package formed body using a low-temperature fired ceramic green sheet is provided on the surface of the ceramic green sheet, and the package formed body and the metallized paste line are formed by providing a through hole for forming the concave portion vertically through the via hole. , a metallized paste circuit, and a package in which a resistor paste is integrally fired at a low temperature and has a recess on the surface with a stepped inner surface, and a signal line is provided on the stepped surface of the inner surface of the recess. A terminating resistor formed by firing a part of the resistor paste, one end of which is connected to the end of the signal line and the other end of which is connected to the ground circuit below the signal line, is provided on the front end surface of the staircase surface provided with the signal line. In addition, the package is characterized in that the package is provided with a bottomed cavity on the bottom surface of the recess.

In the fourth package manufacturing method of the present invention. Before applying plating for bonding or rust prevention to the conductor surfaces of signal lines, ground circuits, etc. exposed around the package. Preferably, a paste for forming an insulator is applied to at least a portion of the front end surface of the staircase surface of the package that is provided with a terminating resistor, and then baked, so that at least the portion of the front end surface of the staircase surface that is provided with the terminating resistor is covered with an insulator. It is said that

A first package of the present invention is a package body made of ceramic having a recessed portion on its surface, a signal line for wiring around the bottom of the recessed portion, and a ground circuit provided in the package body below the signal line. In addition, a package body is provided with a cavity formed in the bottom of the recess inside the signal line, a bottom plate is sealed to the back of the package body, and the bottom of the cavity is sealed with the bottom plate.
In the cage, a terminating resistor is provided on the inner surface of the cavity and is formed by longitudinally cutting a resistor filled in a via hole or a resistor provided on an inner peripheral surface of the via hole, one end of which is connected to the end of the signal line, It is characterized in that the other end is provided with a terminating resistor connected to the ground circuit below the signal line.

A second package of the present invention is a package body made of ceramic having a recessed portion on the surface with a stepped inner surface, and a signal line for wiring is provided on the stepped surface of the inner surface of the recessed portion, and the signal line for wiring is provided. In the package, a ground circuit is provided in the package body below the line, a package body is provided with a cavity formed in the bottom surface of the recess, a bottom plate is sealed to the back surface of the package body, and the bottom surface of the cavity is sealed with the bottom plate. , a terminating resistor formed by vertically cutting a resistor filled in a via hole or a resistor provided on an inner circumferential surface of the via hole, on the front end surface of the step surface, one end of which is connected to the end of the signal line, and the other end is characterized in that it includes a terminating resistor connected to the ground circuit below the signal line.

A third package of the present invention is a package made of ceramic having a recessed portion on the surface with a step-like inner surface, and a signal line for wiring is provided on the stepped surface of the inner surface of the recessed portion, and the signal line In a package in which a ground circuit is provided in the lower package and a bottomed cavity is provided in the bottom surface of the recess, a resistor filled in the via hole or a resistor provided on the inner circumferential surface of the via hole is longitudinally disposed on the front end surface of the step surface. The present invention is characterized by comprising a terminating resistor whose negative end is connected to the end of the signal line and whose other end is connected to the ground circuit below the signal line.

In the first, second, and third packages of the present invention, it is preferable that at least a portion of the inner surface of the cavity or the front end surface of the staircase surface provided with the terminating resistor is covered with an insulator.

This effect - In the first package manufacturing method described above, a package body is provided with a via hole extending across the signal line provided at the bottom of the recess on the surface of the package body and the package body directly below the signal line, and the via hole is filled with a via hole. Fill with resistor paste or apply resistor paste to the inner circumferential surface of the earhole and then bake. After providing a via hole filled with a resistor in the package body or an ear hole with a resistor on the inner circumferential surface, a cavity is formed in the bottom of the four parts inside the signal line by vertically cutting through the via hole. Accordingly, a terminating resistor made of a part of the resistor described above is provided on the inner surface of the cavity.

In the second package manufacturing method, a metallized paste line for forming a signal line is provided on the bottom surface of the recess of the package body forming body, and a via hole filled with resistor paste is provided in the package body forming body directly below the metallized paste line. Alternatively, after providing a via hole coated with resistor paste on the inner peripheral surface and drying it, a cavity is formed vertically through the via hole at the bottom of the recess inside the metallized paste line to form the package body. By integrally firing the body, metallized paste line, and resistor paste. A terminating resistor made by baking a portion of the resistor paste is provided on the inner surface of the cavity of the package body.

In the third and fourth package manufacturing methods described above, the metallized paste line is added to the low temperature fired ceramic green sheet constituting the step surface having the metallized paste line for forming the signal line of the buff cage body forming body or the package forming body. A via hole filled with low-temperature firing resistor paste or a via hole coated with low-temperature firing resistor paste on the inner peripheral surface is provided in the ceramic green sheet immediately below, and after drying, the ceramic green sheet surface inside the metallized paste line is , a package body forming body or a package forming body using a low-temperature firing ceramic ivy green sheet having a through hole for forming a concave portion cut through the above-mentioned ear hole is provided, and the package body forming body or package forming body is By integrally firing the body, metallized paste line, and resistor paste. A terminating resistor formed by baking a portion of the resistor paste is provided on the front end surface of the stepped surface of the package body or the inner surface of the recess of the package.

Therefore, in the first, second, third, and fourth package manufacturing methods described above, a via hole filled with a metallized conductor is provided in the package body or the package made of ceramic, or a via hole provided with a metallized conductor on the inner peripheral surface is provided. Using conventional general-purpose technology. A terminating resistor can be easily formed on the front end surface of the step surface of the package body or the inside surface of the cavity or the inside surface of the recess of the package.

Also. Before sealing the bottom plate to the back of the package body, or applying plating for bonding or rust prevention to the signal lines, ground circuits, and conductor surfaces of the bottom plate exposed around the package, apply plating to the inside surface of the cavity or the front end of the staircase surface. In the first, second, third, and fourth methods of manufacturing packages in which at least a portion provided with a terminating resistor is covered with an insulator, the bottom plate is sealed or plated. At this time, it is possible to prevent the brazing material or plating for sealing the bottom plate from adhering to the surface of the terminating resistor and reducing the resistance value of the terminating resistor.

In the first, second, and third packages, the reflected signal of the high-frequency signal reflected at the end of the signal line around the cavity does not return through the signal line, but instead passes through the inner surface of the cavity connected to the end of the signal line. Alternatively, it is immediately removed to the ground circuit of the package through the terminating resistor on the front end surface of the staircase surface on the inside surface of the recess.

Therefore, part of the reflected signal reflected at the end of the signal line is
It does not leak back through the signal line to a wire connected to a midway portion of the signal line or mix into the electrode of a high-frequency element through the wire or the like.

In addition, in the first, second, and third packages described above, in which at least the portion of the inner surface of the cavity or the front end surface of the staircase surface provided with the terminating resistor is covered with an insulator, various conductors may be placed on the surface of the terminating resistor during use. It is possible to prevent the resistance value of the terminating resistor from decreasing due to adhesion of the terminating resistor.

[Example] Next, embodiments of the present invention will be described with reference to the drawings.

1 to 4 show a preferred first embodiment of the first package of the present invention, FIG. 1 is a front sectional view thereof, FIG. 2 is a plan view thereof, and FIGS. 3 and 4 are FIG. 3 is an enlarged perspective view of the terminating resistor and its surroundings.

The embodiment shown in this figure will be described below.

In the figure, 10 is a package body made of ceramic.

This package body 10 has lead connecting terminals 24 made of tungsten metallized or the like on its peripheral surface, which are easily wetted by the brazing material (2. Lead connecting terminals 24 are plated with nickel plating or the like). , the lead 22 is connected to the lead connection terminal 24 by brazing or the like.

At the center of the surface of the package body 10, there is provided a recess 12 with a vertical inner surface, and around the bottom of the recess 12 there is formed a tungsten metallized material that extends through the inside of the cage body 10 and extends to the lead connection terminals 24. A plurality of signal lines 20 for wiring are provided in a radial manner.

A rectangular cavity 30 is transparently provided in the cage body 10 inside the signal line 20 provided on the bottom surface of the recess 12.

A ground circuit 40 made of tungsten metallized uniform force A is provided in a wide layered manner on the back side of the cage main body 10 below the signal line 20 on the bottom of the recess 12. It is coated with nickel plating or other plating that makes it easy to get wet.

A bottom plate 50 made of a highly thermally conductive metal such as a copper-tungsten alloy is sealed to the back surface of the package body 10 by brazing or the like via the plated ground circuit 40. The bottom of cavity 30 is sealed.

moreover. The signal line 20 exposed around the package cage,
The surfaces of conductors such as the ground circuit 40 and the bottom plate 50 are plated with gold or the like for bonding and rust prevention.

The above configuration is similar to the conventional package, but in the illustrated package, as shown in FIG. A terminating resistor 60 is connected to one end of the surrounding signal line 20 and the other end is connected to the ground circuit 40 on the back of the package body 10.

The terminating resistor 60 is, as shown in FIG. 3 or 4,
The resistor 62 filled in the via hole 70 or the resistor 62 provided on the inner circumferential surface of the via hole 70 is longitudinally cut approximately at the center, and has a substantially semi-cylindrical shape or a substantially semi-cylindrical shape.

The inner surface of the cavity 30 provided with the terminating resistor 60 is covered with an insulator 80 made of a glass coat or the like. This insulator 80 is... This is to prevent various conductors from adhering to the surface of the terminating resistor 60 for some reason and reducing the resistance value of the terminating resistor 60 when the package is used.

Note that, depending on the case, only the portion of the inner surface of the cavity 30 provided with the terminating resistor 60 may be covered with the insulator 80, and even if this is done, it is possible to prevent the conductor from adhering to the surface of the terminating resistor 60. It can be prevented.

The first package shown in FIGS. 1 to 4 is constructed as described above, and when used, as shown in FIG. A high frequency element 90 is mounted, and the electrode of the element is connected to the signal line 2 around the cavity 30 via a wire 92 or the like.
Connect to 0.

Along with that. The top surface of the package body 10 is covered with a cap 52 made of metal or the like, and the cap 52 is brazed to a sealing layer 42 made of tungsten metallized or the like coated with nickel plating, etc., which is easily wetted by the brazing material provided around the top surface of the package body 10, The high frequency element 90 is hermetically sealed inside the package body 10.

In this first package, the reflected signal of the high frequency signal reflected at the end of the signal line 20 around the cavity 30 is
The signal does not return through the signal line 20, but is immediately rejected to the ground circuit 40 through the terminating resistor 60 connected to the end of the signal line 20.

The first package of the first embodiment having the above-described structure can be formed by the first and second package manufacturing methods of the present invention.

First, a preferred embodiment formed using the first manufacturing method will be described.

As shown in FIGS. 5 and 6, a package body 10 is made by laminating and firing a plurality of ceramic green sheets whose main component is alumina or the like, and has a concave portion 12 whose inner surface is perpendicular to the surface thereof. A lead connection terminal 24 provided around the package body 10 is provided around the bottom surface of the recess 12.
A plurality of wiring signal lines 20 made of tungsten metallization or the like are provided in a radial manner through the inside of the package body 10, and a ground circuit 40 made of tungsten metallization or the like is widely layered on the back of the package body 10 below the signal lines 2o. In addition, the signal line 20
A package body 10 is formed in which a via hole 70 extending to the ground circuit 40 is provided over the package body 10 immediately below the via hole 70 .

This package body 10 is formed, for example, as follows.

A package body forming body having a concave portion on its surface is provided by laminating a plurality of ceramic green sheets cut into a predetermined shape. A plurality of metallized paste lines for forming signal lines for wiring are connected to metallized paste terminals for forming lead connection terminals provided around the package body forming body around the bottom of the recessed part of the package body forming body through the inside of the package body forming body. In preparation for this radial pattern, a metallized paste circuit for forming a ground circuit is provided in a wide layer on the back side of the package body forming body below the metallized paste line. At the same time, a cavity-shaped via hole is provided that extends to the metallized paste circuit at the bottom of the recess and extends to the package body forming body immediately below the metallized paste line. Then, the package body forming body, the metallized paste terminal, the metallized paste line, and the metallized paste circuit are integrally fired at a high temperature.

Next, as shown in FIGS. 5 and 6, the via hole 70 of the package body 10 is filled with a resistor paste for forming a resistor, or the inner peripheral surface of the via hole 70 is filled with a resistor paste. Apply resistor paste for formation and bake. A via hole 70 filled with a resistor 62 or a via hole 70 provided with a resistor 62 on the inner peripheral surface is provided in the package body 10. For this resistor paste, for example, QP60 series (trade name) manufactured by DuPont is used.

Here, in order to apply the resistor paste to the inner circumferential surface of the via hole 70, for example, after filling the via hole 70 with the resistor paste, fill the resistor paste from one opening of the via hole 70 to the center of the via hole 70. The resistor paste thus applied is sucked and removed to the outside of the via hole 70, leaving the resistor paste around the inside of the via hole 70.

Next, as shown by the broken line in FIG. 6, the bottom surface of the recess 12 inside the signal line 20 is processed by electrical discharge machining, laser machining, etc.
A rectangular cavity 3o is formed vertically through the via hole 70. Then, on the inner surface of the cavity 30, as shown in FIG. 7 or 8, a portion of the resistor 62 is connected at one end to the end of the signal line 20 and at the other end to the ground circuit 40. A terminating resistor 60 having a substantially semi-cylindrical or substantially semi-cylindrical shape is provided.

In this case, a cavity 30 is formed on the bottom surface of the recess 12.
In order to facilitate the transparent installation of the cavity 3o, it is preferable to provide a small hole or the like in advance in the bottom surface of the recess of the package body forming body, which corresponds to the four corners of the periphery where the cavity 3o is to be installed.

Next, at least the terminating resistor 60 on the inner surface of the cavity 30
A paste for forming an insulator, such as a glass paste, is applied to the portion provided with the terminating resistor 6 and baked, and as shown in FIG. 3 or FIG.
0 (in the figure, the entire inner surface of the cavity 30) is covered with an insulator 80. And the insulator 8
0 to prevent the conductor from adhering to the surface of the terminating resistor 60 and lowering the resistance value of the terminating resistor 60 as described above, or as described below. When the bottom plate 50 is sealed to the back of the package body 10 using a brazing material. When plating for bonding or rust prevention is applied to the conductor surfaces of the signal line 20, ground circuit 40, bottom plate 50, etc. exposed around the package, the brazing material or plating is provided on the inner surface of the cavity 30 at the termination. It is attached to the surface of the resistor 60 to prevent the resistance value of the terminating resistor 60 from decreasing.

next. The ground circuit 40 on the back of the package body 10 and the lead connection terminals 24 around the package body 10 are plated with nickel plating or the like, which is easily wetted by the brazing material, and a highly thermally conductive bottom plate 50 is attached to the ground circuit 40 by brazing, etc. The bottom surface of the cavity 30 is sealed with the bottom plate 50, and the leads 22 are connected to the lead connection terminals 24 by soldering or the like.

after that. Plating for bonding, rust prevention, etc. is applied to the conductor surfaces of the signal line 20, ground circuit 40, bottom plate 50, etc. exposed around the package.

Then, the first package of the first embodiment as shown in FIGS. 1 to 4 is obtained.

Next, a preferred embodiment formed using the second manufacturing method will be described.

As shown in Figures 9 and 10, the inner surface is perpendicular to the surface and is made by laminating multiple low-temperature fired ceramic green sheets, the main component of which is alumina-borosilicate glass, cut into a predetermined shape. A package body forming body 100 having four parts 120 is provided.

The buff cage main body forming body 100 has low-temperature firing metallized paste terminals 24 for forming lead connection terminals provided around the bottom surface of the concave portion 120.
A plurality of low-temperature firing metallized paste lines 200 for forming signal lines for wiring are provided in a radial manner through the inside of the package body forming body 100, and the concave portion 120
A low-temperature firing metallization paste circuit 400 for forming a ground circuit is provided in a wide layer on the back surface of the package body forming body 100 below the metallization paste line 200 on the bottom surface.

Next, as shown in FIG. 9, a via hole 700 connected to the metallized paste circuit 400 is provided across the metallized paste line 200 and the package body forming body 100 immediately below it, and a resistor is inserted into the via hole 700. A low-temperature firing resistor paste 620 for forming a resistor is filled or applied to the inner peripheral surface of the via hole 700, and the resistor paste 620 is dried. For this resistor paste 620, the same QP60'/Lies as described above, which can be fired at a low temperature of about 900° C., is used.

Next, as shown by the broken line in FIG. 10, a cavity 30 is formed in the bottom surface of the recess 120 inside the metallized paste line 200, extending vertically through the via hole 700.

11 or 1 on the inner surface of the cavity 30.
As shown in FIG. 2, one end is connected to the end of a metallized paste line 200 for forming a signal line, and the other end is connected to a metallized paste circuit 400 for forming a ground circuit on the back side of the package body forming body 100. A package body forming body 100 including a portion of the resistor paste 620 having a substantially semi-cylindrical shape or a substantially semi-cylindrical shape is formed.

After that, the package body forming body 100, the metallized paste terminal 240, and the metallized paste line 200 are
, resistor paste 620, metallized paste circuit 40
0 is integrally fired at a low temperature of around 900 to 100°C. Then, as shown in Figures 1 and 2 above. A cavity 30 is transparently provided inside the signal line 20 at the bottom of the recess I2 on the surface of the package body, and one end is connected to the end of the signal line 20 on the inside surface of the cavity 3o, and the other end is connected to the ground circuit 710 on the back of the package body 10. The package main body 10 is provided with a terminating resistor 60 having a substantially semi-cylindrical shape or a substantially semi-cylindrical shape, which is formed by firing a part of the above-mentioned resistor paste 620, which is connected to the resistor paste 620.

Next, in the same manner as in the first package manufacturing method described above, an insulator-forming paste is applied to at least a portion of the inner surface of the cavity 30 where the terminating resistor 60 is provided, and baked.
As shown in FIGS. 3 and 4, at least the portion of the inner surface of the cavity 30 that is provided with the terminating resistor 60 (in the figure, the entire inner surface of the cavity 3o) has a brazing material, plating, or conductor attached to its surface. Cover it with an insulator 8o to prevent it from happening.

Next d. The ground circuit 40 on the back of the package body 1o and the lead connection terminals 24 around the package body 10 are plated to be easily wetted by the brazing material, and the ground circuit 40 is
A highly thermally conductive bottom plate 50 is sealed by brazing or the like, and the bottom surface of the cavity 30 is sealed with the bottom plate 50, and the leads 22 are connected to the lead connection terminals 24 by soldering or the like.

after that. Plating for bonding, rust prevention, etc. is applied to the conductor surfaces of the signal line 20, ground circuit 40, bottom plate 50, etc. exposed around the package.

Then, the first package of the first embodiment as shown in FIGS. 1 to 4 is obtained.

Note that in this second manufacturing method, via holes 70 are formed in the package body forming body 100 before the metallized paste line 200 and the metallized paste circuit 400 are provided.
0 and filling the via hole 700 with the resistor paste 620 or applying the resistor paste 620 to the inner peripheral surface of the via hole 700. A metallized paste line 200 is provided on the bottom surface of the recess 120 on the surface of the package body forming body 100, spanning the via hole 700. A metallized paste circuit 400 is placed on the back side of the package body forming body 100 through the via hole 700.
You can also prepare by straddling the 1st
As shown in FIG. 3, both ends of the terminating resistor 60 formed by firing a part of the resistor paste 620 can be reliably and widely joined to the end of the signal line 20 and the metallized circuit 40 in a two-dimensional manner, The wire 92 for electrode connection of a high frequency element can be reliably connected near the end of the signal line 20 without exposing the end of the terminating resistor 60 widely on the surface of the end of the signal line 20. In addition, the same thing can be done by forming the first packages of the second and third embodiments described later by the second manufacturing method of the present invention, and by forming the second and third packages of the first and second embodiments by the second manufacturing method of the present invention. In order to form a ceramic green sheet using the third or fourth manufacturing method of the present invention, a via hole filled with a resistor paste or a via hole whose inner peripheral surface is coated with a resistor is formed in the ceramic green sheet constituting the stepped surface. The same can be said when setting up.

FIGS. 14 and 15 respectively show a second and third preferred embodiment of the first package of the present invention, and specifically show front sectional views thereof.

The embodiments shown in these figures will be described below.

In the first package shown in FIG. 14, the other end of the terminating resistor 60 provided on the inner surface of the cavity 30 of the note/7-key body 10 is connected to the other end of the terminating resistor 60 provided on the inner surface of the cavity 30 of the note/7-key body 10. It is connected to a ground circuit 40 made of tungsten metallization or the like provided in the middle of the package body 10 below the signal line 20 provided on the bottom surface of the recess 12 on the surface of the package body.

On the other hand, in the first package in Figure 15. The inner surface of the recess 12 on the surface of the package body 10 is formed not in a vertical shape but in a stepped shape. Around the stair surface 12a and the bottom of the recess 12. A plurality of signal lines 20 for wiring connected to lead connection terminals 24 around the package body 10 are provided.

The package body 10 below the signal line 20 on the bottom of the recess 12
The back surface is provided with a ground circuit 40 in a wide layered manner.

On the inner surface of the cavity 30, there is a terminating resistor 60 formed by vertically cutting a resistor 62 filled in the via hole 70 or a resistor 62 provided on the inner circumferential surface of the via hole 70, and one end of which is a signal line 20 on the bottom surface of the recess 12. A terminating resistor 60 is connected to one end and the other end is connected to the ground circuit 40.

Other than that, both the first package in Figures 14 and 15,
It has the same structure as the first package of the first embodiment described above, and its usage and function are also the same as the first package of the first embodiment, and the same members are given the same reference numerals. , the explanation thereof will be omitted.

The first packages shown in FIGS. 14 and 15 can be formed by the first and second package manufacturing methods of the present invention.

Preferred embodiments formed using these manufacturing methods will be described below.

To form the first package shown in FIG. 14 by the first manufacturing method of the present invention. Recess 12 on the surface of the package body 12 Signal line 20 around the bottom of the package body 10 below
The package body 10 is provided with a ground circuit 40 in the middle, and a via hole 70 extending from the end of the signal line 20 and the package body 10 immediately below the signal line 20 to connect to the ground circuit 40. It is formed in the same manner as the first package manufacturing method.

To form the first package shown in FIG. 14 by the second manufacturing method of the present invention. Package body forming body 10
Package body forming body 1 below the metallized paste line 200 for forming a signal line around the bottom of the recess 120 on the 0 surface
A resistor paste 620 is provided with a metallized paste circuit 400 for forming a ground circuit in the middle of 00 and connects the metallized paste line 200 to the metallized paste circuit 400 on the package body forming body 100 directly below the metallized paste line 200. Resistor paste 6 is placed on the via hole 700 filled with or on the inner peripheral surface.
A via hole 700 coated with No. 20 is formed in the same manner as in the manufacturing method of the second package described above.

On the other hand, to form the first package shown in FIG. 15 by the first manufacturing method of the present invention. Package body 10
The inner surface of the recess 12 on the surface is formed into a stepped shape, and the recess 12
A signal line 2 is installed around the staircase surface 12a on the inner surface and the bottom surface of the recess 12.
0 respectively, and a ground circuit 40 is widely provided in a layered manner on the back surface of the puff cage body 10 below the signal line 20, and the ground circuit 40 is provided over the signal line 20 on the bottom surface of the four parts 12 and the package body 10 immediately below it. The package body 10 having a series of ear holes 70 is formed in the same manner as the first package manufacturing method described above.

To form the first package shown in FIG. 15 by the second manufacturing method of the present invention. Package body forming body 10
The inner surface of the recess 120 on the surface of the recess 120 is formed into a step-like shape, and a metallized paste line 200 for forming a signal line is provided around the step surface 12a of the inner surface of the recess 120 and the bottom surface of the recess 120. A metallized paste circuit 400 for forming a ground circuit is provided in a wide (layered) manner on the back surface of the package body forming body 100, and the metallized paste line 200 is placed in the package body forming body lOO immediately below the metallized paste line 200 on the bottom surface of the recess 120. circuit 400
A via hole 700 filled with resistor paste 620 or a via hole 700 coated with resistor paste 620 on the inner peripheral surface is provided in the same manner as in the manufacturing method of the second package described above. .

Then, the second and third
The first t<·y cage of the example is obtained.

FIG. 16 shows the preferred first embodiment of the second) and nocage of the present invention.
An example is shown, and a front sectional view thereof is shown in detail.

The embodiment shown in this figure will be described below.

In the illustrated package, the inner surface of the recess 12 is not vertical but stepped. A signal line 20 for wiring connected to the lead connection terminal 24 is provided on the stepped surface 12a of the inner surface of the recess 12 above the bottom surface of the recess 12. At the same time, a ground circuit 40 connected to the inside of the cage body 10 is provided around the bottom surface of the recess 12 below the signal line 20.

A via hole 70 filled with a resistor 62 or a resistor 62 on the inner circumferential surface is provided on the front end surface of the step surface 12a, and a terminating resistor 60 is provided longitudinally through the via hole 70, one end of which is connected to the signal line 20. connected to one end, and the other end is connected to recess 1
It is provided with a terminating resistor 60 connected to the ground circuit 40 on the bottom surface.

The rest of the structure is the same as that of the first package of the first embodiment described above, and its usage and function are also the same as those of the first package of the first embodiment described above. A reference numeral is given and the explanation thereof will be omitted.

FIG. 17 shows a second preferred embodiment of the second package of the present invention, and specifically shows a front sectional view thereof. The embodiment shown in this figure will be described below.

In the package shown in the figure, the inner surface of the recess 12 is arranged in multiple stages (
In the figure, it is formed in the shape of two steps.

Then, on the upper step surface 12b of the inner surface of the recess 12,
A signal line 20 for wiring connected to a lead connection terminal 24 is provided. At the same time, the stair surface 12C that is one step below the signal line 20 from the stair surface 12b provided with the signal line 20. A ground circuit 40 connected to the inside of the package body 10 is provided.

On the front end surface of the upper step surface 12b equipped with the signal line 20,
A terminating resistor 60 is formed by vertically cutting a via hole 70 filled with a resistor 62 or a via hole 70 having a resistor 62 on its inner peripheral surface, one end of which is connected to the end of the signal line 20, and the other end of which is connected to the end of the signal line 20. A terminating resistor 60 is provided which is connected to the ground circuit 40 below the signal line 20.

The rest of the structure is the same as that of the first package of the first embodiment described above, and its usage and function are also the same as those of the first package of the first embodiment described above. , are given the same reference numerals and their explanations will be omitted.

The second packages of the first and second embodiments can be formed by the third package manufacturing method of the present invention.

A preferred embodiment formed using the third manufacturing method will be described below.

A package body is formed by laminating a plurality of low-temperature fired ceramic green sheets 100a, 100b, 1ooc, as shown in FIG. A body 100 is provided.

The package body forming body 100 has a step surface 120a or 120b (120a in the figure) on the inner surface of the recess 120.
) is equipped with a low-temperature fired metallized paste line 200 for forming a signal line for wiring connected to a low-temperature fired metallized paste terminal 240 for forming a lead connection terminal,
The bottom surface of the recess 120 below the metallized paste line 200 or the step surface 12 one step below the step surface 100b.
A low-temperature firing metallized paste circuit 400 for forming a ground circuit is placed on 0C (in the figure, the bottom surface of the recess 120).
Equipped with

A cavity 30 is transparently provided in the bottom surface of the recess 120 of the package body forming body 100.

The low-temperature firing ceramic green sheet 1OOb constituting the step surface 120a or 120b provided with the metallized paste line 200 of the package body forming body 100 has a metallized step surface 120a or 120b as shown in FIG. A via hole 700 filled with low temperature fired resistor paste 620 or a low temperature fired resistor paste 62 on the inner peripheral surface connects the metallized paste line 200 to the metallized paste circuit 400 on the ceramic green sheet 100b directly below the paste line 200.
After forming a via hole 700 coated with 0 and drying it, a recess 120 is formed on the surface of the ceramic green sheet 100b inside the metallized paste line 200 by cutting the via hole 700 vertically, as shown by the broken line in the figure. A low-temperature fired ceramic green sheet 10ob having through-holes 122 therethrough is used.

Then, the package body forming body 100, the metallized paste terminal 240, and the metallized paste line 200
, metallized paste circuit 400, resistor paste 62
16 or 17, the package body 10 has a recess 12 on its surface having a stepped inner surface, as shown in FIG. 16 or FIG. A signal line 20 connected to a lead connection terminal 24 is provided on the surface 12a or 12b, and one end is connected to the end of the signal line 20 on the front end surface of the step surface 12a or 12b provided with the signal line 2O. Resistor paste 620 connected to the ground circuit 40 below the signal line 20
The package main body IO is provided with a terminating resistor 60 formed by firing a part of the package main body IO, and a cavity 30 is transparently provided on the bottom surface of the recess 12.

Next, the front end surface of the step surface 12a or 12b provided with the terminating resistor 60 is covered with an insulator 80 in the same manner as in the manufacturing method of the first package described above. A bottom plate 50 is sealed to the back surface of the package main body 10, and the bottom plate 50 is used to seal the cavity 3.
0 or connect the lead 2 to the lead connection terminal 24.
Connect 2, etc.

Then, the second packages of the first and second embodiments of the present invention as shown in FIGS. 16 and 17 are obtained.

FIGS. 20 and 21 respectively show first and second preferred embodiments of the third package of the present invention, and specifically show front sectional views thereof. The embodiments shown in these figures will be described below.

In the package shown in the figure, instead of the package body IO made of ceramic in the second package of the first and second embodiments described above, the package body IO is made of ceramic similar to that shown in FIGS. 20 and 21. Naru package IOA
A bottomed cavity 30 is provided on the bottom surface of the recess 12.
A package IOA is used. This eliminates the need to seal the bottom surface of the cavity 30 with a bottom plate.

The rest of the structure is the same as that of the second package of the first and second embodiments described above, and its usage and operation are also the same as those of the second package of the first and second embodiments described above. The same members are given the same reference numerals and their explanations will be omitted.

The third package of the first and second embodiments can be formed by the fourth manufacturing method of the present invention.

A preferred embodiment formed by the fourth manufacturing method will be described below.

Instead of the package body forming body 100 used when forming the second package of the above-mentioned first and second embodiments by the above-mentioned third manufacturing method, a substantially similar package body forming body 100 as shown in FIG. , low temperature fired ceramic green sheet 1
00a, 100b.

A package is formed using a package forming body 100A which is formed by laminating a plurality of layers 100c and 1oad, and has a bottomed cavity 30 provided on the bottom surface of its four parts 120.

The other steps were the same as the method for manufacturing the third package described above, as shown in FIGS. 22 and 23. Low temperature firing metallized paste line 20 of package forming body 100A
A metallizing paste line 200 is placed on the ceramic green sheet 100b immediately below the metallizing paste line 200 on the step surface 1.20a or 120b. After providing a via hole 700 filled with low-temperature fired resistor paste 620 or a via hole 700 with low-temperature fired resistor paste 620 applied to the inner circumferential surface connected to the paste circuit 400 and drying, the inside of the metallized base line 200 is formed. Ceramic green sheet! 00b
A low-temperature fired ceramic green sheet 100 having a through hole 122 for forming a recess 120 extending longitudinally through a via hole 700 as shown by the broken line in FIG. 23 on the surface.
For example, using b. Form a package IOA.

In addition, in that case. Package IOA cavity 30
Needless to say, it is not necessary to seal the bottom surface with a bottom plate.

Further, the first packages of the first, second, and third embodiments described above may be formed by the first and second manufacturing methods of the present invention,
When the second and third packages of the first and second embodiments described above are formed by the third and fourth manufacturing methods of the present invention, the signal line 20 and ground circuit 4 of these packages are
0 etc. is formed by firing a metallized paste such as gold base at a low temperature. It is possible to eliminate the process of applying bonding or anti-corrosion plating to the conductor surfaces of the signal line 20, ground circuit 40, etc. exposed around the package body 10, and to
0 on the back surface of the package body 10 and is made by firing the gold paste described above, without using a brazing material,
When sealing is performed directly by thermocompression bonding, the step of covering at least the portion of the inner surface of the cavity 30 or the front end surface of the step surfaces 120a and 12Oa provided with the terminating resistor 60 with the insulator 80 may be omitted.

At the same time, in the first, second, third, and fourth packages, if there is no risk of conductor adhering to the surface of the terminating resistor 60, the inner surface of the cavity 30 or the step surface 12
At least the portion of the front end surfaces of 0a and 120b provided with the terminating resistor 60 does not need to be covered with the insulator 80.

Moreover, the present invention... Signal line 2 exposed around the package
0 and the ground circuit 40, etc., and without connecting the leads 22 to the lead connection terminals 24, the ends of those signal lines 20 and the ground circuit 40, etc. are mounted on the package. Connect directly to wiring circuits (not shown) on the printed circuit board or the ends (not shown) of signal lines, ground circuits, etc. of other adjacent packages using gold ribbons, etc. It can also be used in a leadless type package, which is used by being pressed into contact with the contacts (not shown) of a connector provided in the device.

"Effects of the invention; As explained above, the first, second, third, and fourth effects of the present invention
According to the manufacturing method of the package. A terminating resistor is provided on the front end surface of the step surface on the inside surface of the cavity or the inside surface of the recess of the package, and one end is connected to the signal line end for connecting the electrodes of the high-frequency elements around the cavity, and the other end is connected to the ground circuit of the package. In addition, the package for accommodating the high frequency element is provided with a package body made of ceramic, a via hole filled with a metallized conductor in the package, or a via hole with a metallized conductor on the inner peripheral surface.
It can be easily formed using conventional general-purpose techniques without much effort.

Further, according to the first, second, and third packages of the present invention, the terminal for connecting the electrodes of the high-frequency elements around the cavity can be connected through the terminating resistor provided on the front end surface of the step surface on the inner side 11ffi of the cavity or the inner surface of the recess of the package. The reflected signal of the high-frequency signal reflected at the end of the signal line can be immediately removed from the end of the signal line to the ground circuit of the package without returning the signal line. It is possible to reliably prevent the contaminants from being mixed into the electrodes of the high-frequency element housed in the cavity by going back along the line and passing through a wire or the like connected to the midway part of the signal line.

[Brief explanation of the drawing]

FIG. 1 shows the first package of the first high-frequency device package of the present invention.
2 is a plan view of the package shown in FIG. 1, FIGS. 3 and 4 are enlarged perspective views of the package shown in FIG. 1 around the terminating resistor, and FIGS. Figure and 7th
8 and 8 are a front cross-sectional view, an enlarged perspective view of the vicinity of the ear hole, a front sectional view and an enlarged perspective view of the vicinity of the earhole, respectively, and FIGS. 9 and 10, respectively. FIG. 11 and FIG. 12 are the second embodiment of the present invention, respectively.
A front cross-sectional view, a plan view thereof, and an enlarged perspective view of the vicinity of the via hole showing an intermediate process of the method for manufacturing a package for a high-frequency device according to the second method of the present invention, and FIG. FIGS. 14 and 15 are front sectional views showing the second and third embodiments of the first high-frequency device package of the present invention, respectively; 16 and 17 are front sectional views showing the first and second embodiments of the second high-frequency device package of the present invention, respectively, and FIG.
Fig. 19 and Fig. 19 are a front sectional view of a package body forming body and a ceramic green sheet constituting the step surface of the package body forming body, respectively, showing the manufacturing method of the second high-frequency device package according to the first embodiment of the present invention. Plan view, 2nd
0 and 21 are front sectional views showing the first and second embodiments of the third high-frequency device package of the present invention, respectively, and FIGS. 22 and 23 are respectively the first embodiment of the present invention. FIG. 7 is a front cross-sectional view of a package forming body and a plan view of a ceramic green sheet forming a stepped surface of the package forming body, showing the third method of manufacturing a high-frequency element package. 10 ・Package body, 10A...Package, 1
00a, 100b Ceraminoku Green-1, 10
0C, 100d...Ceramic green sheet, 12
．． 120... recess, 122... through hole, +20a, 12
0b, 120C-=stair surface, 20... signal line, 24
・Lead connection terminal, 30...Cavity, 40...
・Ground circuit, 50...Bottom plate, 60...Terminal resistor,
62...Resistor, 70...Via hole, 80...
Insulator, 100-- Package body forming body, 100A... Package forming body, 200... Metallized paste line, 240... Metallized paste terminal, 620... Resistor paste, 700... Via hole , 400...metalized paste circuit. Patent applicant Shinko Electric Industry Co., Ltd.

Claims (10)

[Claims] 1. The package body is made by laminating and firing multiple ceramic green sheets and has a recess on the surface.A signal line for wiring is provided around the bottom of the recess, and a ground circuit is installed in the package body below the signal line. and a package body having a via hole extending from the signal line and the package body immediately below the signal line to the ground circuit, and filling the via hole of the package body with a resistor paste or filling the via hole with a resistor paste. After applying a resistor paste to the inner circumferential surface of the hole and baking it, a via hole filled with a resistor or a via hole with a resistor on the inner circumferential surface is provided in the package body.
A cavity is formed in the bottom surface of the recess inside the signal line by vertically extending the via hole, and on the inner surface of the cavity,
A terminating resistor made of a part of the resistor is connected at one end to the end of the signal line and the other end is connected to the ground circuit, and then a bottom plate is sealed to the back surface of the package body. A method for manufacturing a package for a high-frequency element, characterized in that the bottom surface of the cavity is sealed with. 2. A package body formed by laminating a plurality of low-temperature-fired ceramic green sheets and having a recess on the surface, and a low-temperature-fired metallized paste line for forming a signal line for wiring is provided around the bottom of the recess, and the metallization A low-temperature firing metallization paste circuit for forming a ground circuit is provided on the package body forming body below the paste line, and the metallizing paste line is connected to the metallizing paste circuit on the package body forming body immediately below the metallizing paste line. After forming a package body formed by providing a via hole filled with resistor paste or a via hole whose inner peripheral surface is coated with low-temperature firing resistor paste and dried, the via hole is placed on the bottom of the recess inside the metallized paste line. A cavity is made transparent through the hole, and the package body forming body, metallized paste line, metallized paste circuit,
A package body made by integrally firing resistor paste at a low temperature and provided with a recess on the surface, a signal line is provided around the bottom of the recess, and an inner surface of the cavity is provided through the bottom of the recess inside the signal line. A package body including a terminating resistor is formed by firing a part of the resistor paste whose one end is connected to the end of the signal line and the other end is connected to the ground circuit, and then the package body is A method of manufacturing a package for a high-frequency element, comprising: sealing a bottom plate to the back surface of the main body, and sealing the bottom surface of the cavity with the bottom plate. 3. A package body formed by laminating a plurality of low-temperature fired ceramic green sheets and having a concave portion on the surface with a step-like inner surface, the step surface of the inner surface of the concave portion having a concave portion for forming a signal line for wiring. A package body formed body comprising a low temperature fired metallized paste line, a low temperature fired metallized paste circuit for forming a ground circuit on the package body formed body below the metallized paste line, and a cavity transparently provided in the bottom surface of the recessed part, and filling a low temperature fired ceramic green sheet constituting the staircase surface with the metallized paste line with a low temperature fired resistor paste that connects the metallized paste line to the metallized paste circuit in the ceramic green sheet directly below the metallized paste line. After forming a via hole or a via hole coated with a low temperature fired resistor paste on the inner peripheral surface and drying it, the via hole is longitudinally cut on the surface of the ceramic green sheet inside the metallized paste line to form a recess. A package body forming body is made of a low-temperature fired ceramic green sheet with through-holes formed therein, and the package body forming body, the metallized paste line, the metallized paste circuit, and the resistor paste are integrally fired at a low temperature, and the surface A package body is provided with a recessed portion having a stepped inner surface, a signal line for wiring is provided on the stepped surface of the inner surface of the recessed portion, and one end is provided on the front end surface of the stepped surface where the signal line is provided. is connected to an end of the signal line, and the other end is connected to the ground circuit below the signal line. A terminating resistor is provided by firing a part of the resistor paste, and a cavity is formed through the bottom of the recess. After that, a bottom plate is sealed to the back of the package body,
A method for manufacturing a package for a high frequency element, characterized in that the bottom plate of the cavity is sealed. 4. Before sealing the bottom plate to the back of the package body, or applying plating for bonding or rust prevention to the signal lines, ground circuits, and conductor surfaces of the bottom plate exposed around the package, the inner surface of the cavity of the package body or A paste for forming an insulator is applied to at least a portion of the front end face of the stairway that is provided with a terminating resistor and is fired, so that at least the portion of the front end face of the stairway or the front end face of the stairway that is provided with the terminating resistor is covered with an insulator. A method for manufacturing a package for a high frequency element according to item 1, 2 or 3. 5. A package forming body made by laminating a plurality of low-temperature fired ceramic green sheets and having a concave portion on the surface with a step-like inner surface, and a low-temperature plate for forming a signal line for wiring on the stepped surface of the inner surface of the concave portion. A package forming body comprising a fired metallized paste line, a low temperature fired metallized paste circuit for forming a ground circuit in the package forming body below the metallized paste line, and a bottomed cavity provided on the bottom surface of the recess, and , connecting a metallized paste line to the metallized paste circuit on a low-temperature fired ceramic green sheet constituting a staircase surface having the metallized paste line, and a ceramic green sheet directly below the metallized paste line;
After providing a via hole filled with low-temperature firing resistor paste or a via hole whose inner peripheral surface is coated with low-temperature firing resistor paste and drying, the via hole is longitudinally formed on the surface of the ceramic green sheet inside the metallized paste line. Then, a package formed body using a low-temperature fired ceramic green sheet with the through holes for forming the recesses is provided, and the package formed body, the metallized paste line, the metalized paste circuit, and the resistor paste are heated at a low temperature. A package that is integrally fired and has a recessed portion on its surface with a stepped inner surface, a signal line is provided on the stepped surface of the inner surface of the recessed portion, and a front end surface of the stepped surface provided with the signal line, One end is connected to the end of the signal line,
forming a package including a terminating resistor formed by firing a part of the resistor paste, the other end of which is connected to the ground circuit below the signal line, and a cavity with a bottom at the bottom of the recess; A method for manufacturing a package for a high frequency element, characterized by: 6. Before applying bonding or anti-corrosion plating to the conductor surfaces of signal lines, ground circuits, etc. exposed around the package, apply paste for forming an insulator to at least the part of the front end of the step surface of the package that is equipped with a terminating resistor. 6. The method of manufacturing a package for a high frequency device according to claim 5, wherein at least a portion of the front end surface of the step surface provided with a terminating resistor is covered with an insulator. 7. A package body made of ceramic and having a recessed portion on its surface, comprising a signal line for wiring around the bottom surface of the recessed portion, a ground circuit provided in the package body below the signal line, and a bottom surface of the recessed portion inside the signal line. In the package, a package body is provided with a cavity transparent therein, a bottom plate is sealed to the back surface of the package body, and the bottom surface of the cavity is sealed with the bottom plate. A terminating resistor formed by longitudinally cutting a resistor provided on the inner peripheral surface of the via hole, one end of which is connected to the end of the signal line, and the other end of which is connected to the ground circuit below the signal line. A high-frequency element package characterized by the following features: 8. The package body is made of ceramic and has a recessed part on the surface with a stepped inner surface, and a signal line for wiring is provided on the stepped surface of the inner surface of the recessed part, and a ground circuit is connected to the package body below the signal line. In the package, a package body is provided with a cavity transparently formed in the bottom surface of the recessed part, a bottom plate is sealed to the back surface of the package body, and the bottom surface of the cavity is sealed with the bottom plate,
A terminating resistor is provided on the front end surface of the staircase surface, and is formed by longitudinally cutting a resistor filled in a via hole or a resistor provided on the inner peripheral surface of the via hole, one end of which is connected to the end of the signal line, and the other end of which is connected to the end of the signal line. A package for a high frequency element, comprising a terminating resistor connected to the ground circuit below the signal line. 9. A package made of ceramic having a concave portion on its surface with a stepped inner surface, a signal line for wiring on the stepped surface of the inner surface of the concave portion, and a ground circuit provided in the package below the signal line. , in a package in which a bottomed cavity is provided on the bottom surface of the recess, a terminating resistor formed by longitudinally cutting a resistor filled in a via hole or a resistor provided on an inner circumferential surface of the via hole, on the front end surface of the step surface; A package for a high frequency element, comprising a terminating resistor having one end connected to the end of the signal line and the other end connected to the ground circuit below the signal line. 10. Claim 7, wherein at least a portion of the inner surface of the cavity or the front end surface of the staircase surface provided with the terminating resistor is covered with an insulator.
9. The high-frequency element package according to 8 or 9.