JPH0251470B2 - - Google Patents

Info

Publication number
JPH0251470B2
JPH0251470B2 JP58187856A JP18785683A JPH0251470B2 JP H0251470 B2 JPH0251470 B2 JP H0251470B2 JP 58187856 A JP58187856 A JP 58187856A JP 18785683 A JP18785683 A JP 18785683A JP H0251470 B2 JPH0251470 B2 JP H0251470B2
Authority
JP
Japan
Prior art keywords
parts
resin
epoxy resin
weight
nitrogen
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58187856A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6079080A (ja
Inventor
Eiichi Yamashita
Hidetomo Imashiro
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Mektron KK
Original Assignee
Nippon Mektron KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mektron KK filed Critical Nippon Mektron KK
Priority to JP18785683A priority Critical patent/JPS6079080A/ja
Publication of JPS6079080A publication Critical patent/JPS6079080A/ja
Publication of JPH0251470B2 publication Critical patent/JPH0251470B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP18785683A 1983-10-07 1983-10-07 接着剤組成物 Granted JPS6079080A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18785683A JPS6079080A (ja) 1983-10-07 1983-10-07 接着剤組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18785683A JPS6079080A (ja) 1983-10-07 1983-10-07 接着剤組成物

Publications (2)

Publication Number Publication Date
JPS6079080A JPS6079080A (ja) 1985-05-04
JPH0251470B2 true JPH0251470B2 (enrdf_load_html_response) 1990-11-07

Family

ID=16213406

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18785683A Granted JPS6079080A (ja) 1983-10-07 1983-10-07 接着剤組成物

Country Status (1)

Country Link
JP (1) JPS6079080A (enrdf_load_html_response)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61126187A (ja) * 1984-11-22 1986-06-13 Hitachi Chem Co Ltd 銅張積層板用接着剤
JPS6340578A (ja) * 1986-08-07 1988-02-20 川崎重工業株式会社 回流プ−ルの流速制御装置
JP2005307160A (ja) * 2004-03-24 2005-11-04 Dainippon Ink & Chem Inc 接着用樹脂組成物

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5887121A (ja) * 1981-11-20 1983-05-24 Hitachi Ltd エポキシ樹脂組成物

Also Published As

Publication number Publication date
JPS6079080A (ja) 1985-05-04

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