JPH0251254B2 - - Google Patents

Info

Publication number
JPH0251254B2
JPH0251254B2 JP60278562A JP27856285A JPH0251254B2 JP H0251254 B2 JPH0251254 B2 JP H0251254B2 JP 60278562 A JP60278562 A JP 60278562A JP 27856285 A JP27856285 A JP 27856285A JP H0251254 B2 JPH0251254 B2 JP H0251254B2
Authority
JP
Japan
Prior art keywords
plating
contact
wafer
semiconductor wafer
tank body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP60278562A
Other languages
English (en)
Japanese (ja)
Other versions
JPS62136859A (ja
Inventor
Nobumasa Ishida
Kichiji Abe
Motoki Ito
Masakazu Terada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Original Assignee
NipponDenso Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NipponDenso Co Ltd filed Critical NipponDenso Co Ltd
Priority to JP60278562A priority Critical patent/JPS62136859A/ja
Publication of JPS62136859A publication Critical patent/JPS62136859A/ja
Publication of JPH0251254B2 publication Critical patent/JPH0251254B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods

Landscapes

  • Electroplating Methods And Accessories (AREA)
  • Physical Vapour Deposition (AREA)
JP60278562A 1985-12-10 1985-12-10 半導体ウエハのメツキ装置 Granted JPS62136859A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60278562A JPS62136859A (ja) 1985-12-10 1985-12-10 半導体ウエハのメツキ装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60278562A JPS62136859A (ja) 1985-12-10 1985-12-10 半導体ウエハのメツキ装置

Publications (2)

Publication Number Publication Date
JPS62136859A JPS62136859A (ja) 1987-06-19
JPH0251254B2 true JPH0251254B2 (enrdf_load_stackoverflow) 1990-11-06

Family

ID=17598991

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60278562A Granted JPS62136859A (ja) 1985-12-10 1985-12-10 半導体ウエハのメツキ装置

Country Status (1)

Country Link
JP (1) JPS62136859A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9529270B2 (en) 2013-08-13 2016-12-27 Canon Kabushiki Kaisha Lithography apparatus, and method of manufacturing article

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2668243B2 (ja) * 1988-07-01 1997-10-27 富士通株式会社 メッキ処理方法およびメッキ処理装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9529270B2 (en) 2013-08-13 2016-12-27 Canon Kabushiki Kaisha Lithography apparatus, and method of manufacturing article

Also Published As

Publication number Publication date
JPS62136859A (ja) 1987-06-19

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term