JPH0250066B2 - - Google Patents
Info
- Publication number
- JPH0250066B2 JPH0250066B2 JP58045600A JP4560083A JPH0250066B2 JP H0250066 B2 JPH0250066 B2 JP H0250066B2 JP 58045600 A JP58045600 A JP 58045600A JP 4560083 A JP4560083 A JP 4560083A JP H0250066 B2 JPH0250066 B2 JP H0250066B2
- Authority
- JP
- Japan
- Prior art keywords
- glass
- metal
- amorphous silicon
- bonding
- silicon film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910052751 metal Inorganic materials 0.000 claims description 40
- 239000002184 metal Substances 0.000 claims description 40
- 239000011521 glass Substances 0.000 claims description 34
- 229910021417 amorphous silicon Inorganic materials 0.000 claims description 21
- 238000000034 method Methods 0.000 claims description 18
- 239000007769 metal material Substances 0.000 claims 1
- 239000000463 material Substances 0.000 description 4
- 150000002739 metals Chemical class 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 239000004859 Copal Substances 0.000 description 1
- 241000782205 Guibourtia conjugata Species 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- -1 metal and glass Chemical compound 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
Landscapes
- Joining Of Glass To Other Materials (AREA)
- Measuring Fluid Pressure (AREA)
- Laminated Bodies (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58045600A JPS59174549A (ja) | 1983-03-18 | 1983-03-18 | 金属とガラスの接合方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58045600A JPS59174549A (ja) | 1983-03-18 | 1983-03-18 | 金属とガラスの接合方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59174549A JPS59174549A (ja) | 1984-10-03 |
| JPH0250066B2 true JPH0250066B2 (enrdf_load_stackoverflow) | 1990-11-01 |
Family
ID=12723841
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58045600A Granted JPS59174549A (ja) | 1983-03-18 | 1983-03-18 | 金属とガラスの接合方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59174549A (enrdf_load_stackoverflow) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2527834B2 (ja) * | 1990-07-20 | 1996-08-28 | 三菱電機株式会社 | 陽極接合法 |
| AU2002307578A1 (en) * | 2002-04-30 | 2003-12-02 | Agency For Science Technology And Research | A method of wafer/substrate bonding |
| JP4695014B2 (ja) * | 2003-12-02 | 2011-06-08 | ボンドテック株式会社 | 接合方法及びこの方法により作成されるデバイス並びに接合装置 |
| US7927975B2 (en) | 2009-02-04 | 2011-04-19 | Micron Technology, Inc. | Semiconductor material manufacture |
| CN110246769B (zh) * | 2019-05-10 | 2020-09-11 | 太原理工大学 | 基于阳离子导电金属与玻璃表面原位金属化共晶键合方法 |
-
1983
- 1983-03-18 JP JP58045600A patent/JPS59174549A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59174549A (ja) | 1984-10-03 |
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