JPS59174549A - 金属とガラスの接合方法 - Google Patents
金属とガラスの接合方法Info
- Publication number
- JPS59174549A JPS59174549A JP58045600A JP4560083A JPS59174549A JP S59174549 A JPS59174549 A JP S59174549A JP 58045600 A JP58045600 A JP 58045600A JP 4560083 A JP4560083 A JP 4560083A JP S59174549 A JPS59174549 A JP S59174549A
- Authority
- JP
- Japan
- Prior art keywords
- glass
- amorphous silicon
- film
- metal
- silicon film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011521 glass Substances 0.000 title claims abstract description 36
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 32
- 239000002184 metal Substances 0.000 title claims abstract description 32
- 238000000034 method Methods 0.000 title claims abstract description 19
- 229910021417 amorphous silicon Inorganic materials 0.000 claims abstract description 20
- 239000007769 metal material Substances 0.000 claims abstract 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 3
- 239000000853 adhesive Substances 0.000 abstract description 3
- 230000001070 adhesive effect Effects 0.000 abstract description 3
- 229910052782 aluminium Inorganic materials 0.000 abstract description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract description 3
- 229910052802 copper Inorganic materials 0.000 abstract description 3
- 239000010949 copper Substances 0.000 abstract description 3
- 229910001220 stainless steel Inorganic materials 0.000 abstract description 3
- 239000010935 stainless steel Substances 0.000 abstract description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 6
- 239000010931 gold Substances 0.000 description 6
- 229910052737 gold Inorganic materials 0.000 description 6
- 239000000463 material Substances 0.000 description 3
- 238000005530 etching Methods 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 239000004859 Copal Substances 0.000 description 1
- 241000782205 Guibourtia conjugata Species 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 235000013372 meat Nutrition 0.000 description 1
- -1 metals and glass Chemical compound 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
Landscapes
- Joining Of Glass To Other Materials (AREA)
- Measuring Fluid Pressure (AREA)
- Laminated Bodies (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58045600A JPS59174549A (ja) | 1983-03-18 | 1983-03-18 | 金属とガラスの接合方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58045600A JPS59174549A (ja) | 1983-03-18 | 1983-03-18 | 金属とガラスの接合方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS59174549A true JPS59174549A (ja) | 1984-10-03 |
JPH0250066B2 JPH0250066B2 (enrdf_load_stackoverflow) | 1990-11-01 |
Family
ID=12723841
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP58045600A Granted JPS59174549A (ja) | 1983-03-18 | 1983-03-18 | 金属とガラスの接合方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59174549A (enrdf_load_stackoverflow) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5141148A (en) * | 1990-07-20 | 1992-08-25 | Mitsubishi Denki Kabushiki Kaisha | Method of anodic bonding a semiconductor wafer to an insulator |
WO2003097552A1 (en) * | 2002-04-30 | 2003-11-27 | Agency For Science Technology And Research | A method of wafer/substrate bonding |
JP2006248895A (ja) * | 2003-12-02 | 2006-09-21 | Bondtech Inc | 接合方法及びこの方法により作成されるデバイス並びに接合装置 |
US7927975B2 (en) | 2009-02-04 | 2011-04-19 | Micron Technology, Inc. | Semiconductor material manufacture |
CN110246769A (zh) * | 2019-05-10 | 2019-09-17 | 太原理工大学 | 基于阳离子导电金属与玻璃表面原位金属化共晶键合方法 |
-
1983
- 1983-03-18 JP JP58045600A patent/JPS59174549A/ja active Granted
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5141148A (en) * | 1990-07-20 | 1992-08-25 | Mitsubishi Denki Kabushiki Kaisha | Method of anodic bonding a semiconductor wafer to an insulator |
WO2003097552A1 (en) * | 2002-04-30 | 2003-11-27 | Agency For Science Technology And Research | A method of wafer/substrate bonding |
US7192841B2 (en) | 2002-04-30 | 2007-03-20 | Agency For Science, Technology And Research | Method of wafer/substrate bonding |
JP2006248895A (ja) * | 2003-12-02 | 2006-09-21 | Bondtech Inc | 接合方法及びこの方法により作成されるデバイス並びに接合装置 |
US7927975B2 (en) | 2009-02-04 | 2011-04-19 | Micron Technology, Inc. | Semiconductor material manufacture |
US8389385B2 (en) | 2009-02-04 | 2013-03-05 | Micron Technology, Inc. | Semiconductor material manufacture |
CN110246769A (zh) * | 2019-05-10 | 2019-09-17 | 太原理工大学 | 基于阳离子导电金属与玻璃表面原位金属化共晶键合方法 |
Also Published As
Publication number | Publication date |
---|---|
JPH0250066B2 (enrdf_load_stackoverflow) | 1990-11-01 |
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