JPH0249384B2 - - Google Patents

Info

Publication number
JPH0249384B2
JPH0249384B2 JP61158755A JP15875586A JPH0249384B2 JP H0249384 B2 JPH0249384 B2 JP H0249384B2 JP 61158755 A JP61158755 A JP 61158755A JP 15875586 A JP15875586 A JP 15875586A JP H0249384 B2 JPH0249384 B2 JP H0249384B2
Authority
JP
Japan
Prior art keywords
target
based alloy
phase
fcc
hcp
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP61158755A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6314864A (ja
Inventor
Kyuzo Nakamura
Yoshifumi Oota
Hiroki Yamada
Michio Ishikawa
Noriaki Tani
Yasushi Higuchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ulvac Inc
Original Assignee
Ulvac Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=15678630&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=JPH0249384(B2) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Ulvac Inc filed Critical Ulvac Inc
Priority to JP61158755A priority Critical patent/JPS6314864A/ja
Priority to DE87109731T priority patent/DE3787679T2/de
Priority to EP87109731A priority patent/EP0252478B1/en
Priority to US07/070,441 priority patent/US4832810A/en
Publication of JPS6314864A publication Critical patent/JPS6314864A/ja
Publication of JPH0249384B2 publication Critical patent/JPH0249384B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/10—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of nickel or cobalt or alloys based thereon

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physical Vapour Deposition (AREA)
JP61158755A 1986-07-08 1986-07-08 Ｃｏ基合金スパツタタ−ゲツトおよびその製造法 Granted JPS6314864A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP61158755A JPS6314864A (ja) 1986-07-08 1986-07-08 Ｃｏ基合金スパツタタ−ゲツトおよびその製造法
DE87109731T DE3787679T2 (de) 1986-07-08 1987-07-06 Target aus Kobalt-Basis für Kathodenzerstäubung und Verfahren zu seiner Herstellung.
EP87109731A EP0252478B1 (en) 1986-07-08 1987-07-06 Co-base alloy sputter target and process of manufacturing thereof
US07/070,441 US4832810A (en) 1986-07-08 1987-07-07 Co-based alloy sputter target and process of manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61158755A JPS6314864A (ja) 1986-07-08 1986-07-08 Ｃｏ基合金スパツタタ−ゲツトおよびその製造法

Publications (2)

Publication Number Publication Date
JPS6314864A JPS6314864A (ja) 1988-01-22
JPH0249384B2 true JPH0249384B2 (enExample) 1990-10-30

Family

ID=15678630

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61158755A Granted JPS6314864A (ja) 1986-07-08 1986-07-08 Ｃｏ基合金スパツタタ−ゲツトおよびその製造法

Country Status (4)

Country Link
US (1) US4832810A (enExample)
EP (1) EP0252478B1 (enExample)
JP (1) JPS6314864A (enExample)
DE (1) DE3787679T2 (enExample)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3819906C1 (enExample) * 1988-06-11 1989-08-03 Degussa Ag, 6000 Frankfurt, De
US5282946A (en) * 1991-08-30 1994-02-01 Mitsubishi Materials Corporation Platinum-cobalt alloy sputtering target and method for manufacturing same
EP0603407B1 (en) * 1992-05-11 1997-11-19 Sumitomo Electric Industries, Ltd Vapor deposition material and production method thereof
EP0659901B1 (de) * 1993-12-20 1998-04-15 LEYBOLD MATERIALS GmbH Target für Magnetron-Kathodenzerstäubungsanlage aus einer Kobalt-Basislegierung
DE19508535A1 (de) * 1995-03-10 1996-09-12 Leybold Materials Gmbh Sputtertarget aus einer Kobalt-Basislegierung mit hohem Magnetfelddurchgriff
JPH09272970A (ja) * 1996-04-05 1997-10-21 Japan Energy Corp 高純度コバルトスパッタリングターゲット及びその製造方法
US6391172B2 (en) 1997-08-26 2002-05-21 The Alta Group, Inc. High purity cobalt sputter target and process of manufacturing the same
US6086725A (en) * 1998-04-02 2000-07-11 Applied Materials, Inc. Target for use in magnetron sputtering of nickel for forming metallization films having consistent uniformity through life
US6190516B1 (en) * 1999-10-06 2001-02-20 Praxair S.T. Technology, Inc. High magnetic flux sputter targets with varied magnetic permeability in selected regions
US6176944B1 (en) * 1999-11-01 2001-01-23 Praxair S.T. Technology, Inc. Method of making low magnetic permeability cobalt sputter targets
US6514358B1 (en) 2000-04-05 2003-02-04 Heraeus, Inc. Stretching of magnetic materials to increase pass-through-flux (PTF)
WO2002002848A2 (en) 2000-06-30 2002-01-10 Honeywell International Inc. Method and apparatus for processing metals, and the metals so produced
US7041204B1 (en) 2000-10-27 2006-05-09 Honeywell International Inc. Physical vapor deposition components and methods of formation
US6472867B1 (en) 2001-02-21 2002-10-29 Applied Materials, Inc. Target for use in magnetron sputtering of nickel for forming metallization films having consistent uniformity through life
US20040129559A1 (en) * 2002-04-12 2004-07-08 Misner Josh W. Diffusion bonded assemblies and fabrication methods
EP1558791A2 (en) * 2002-10-08 2005-08-03 Honeywell International, Inc. Homogenous solid solution alloys for sputter-deposited thin films
JP3964453B2 (ja) * 2004-03-26 2007-08-22 日鉱金属株式会社 Ｃｏ−Ｃｒ−Ｐｔ−Ｂ系合金スパッタリングターゲット
CN101001973B (zh) * 2004-08-10 2010-07-14 日矿金属株式会社 柔性铜衬底用阻挡膜和用于形成阻挡膜的溅射靶
JPWO2007066555A1 (ja) * 2005-12-05 2009-05-14 独立行政法人科学技術振興機構 Ｃｏ基合金及びその製造方法
JP5204460B2 (ja) * 2007-10-24 2013-06-05 三井金属鉱業株式会社 磁気記録膜用スパッタリングターゲットおよびその製造方法
US20100108503A1 (en) * 2008-10-31 2010-05-06 Applied Quantum Technology, Llc Chalcogenide alloy sputter targets for photovoltaic applications and methods of manufacturing the same

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3390443A (en) * 1964-10-20 1968-07-02 Bell Telephone Labor Inc Magnetic material and devices utilizing same
US3356542A (en) * 1967-04-10 1967-12-05 Du Pont Cobalt-nickel base alloys containing chromium and molybdenum
US3494807A (en) * 1968-06-11 1970-02-10 Fansteel Inc Dispersion hardened cobalt alloy sheet and production thereof
CA892488A (en) * 1968-11-15 1972-02-08 W. Kushnir Bud Two-phase cobalt-iron alloys prepared by powder metallurgy
US3695944A (en) * 1970-06-17 1972-10-03 Allegheny Ludlum Ind Inc Iron cobalt vanadium alloy
US3755796A (en) * 1971-06-30 1973-08-28 Ibm Cobalt-platinum group alloys whose anisotrophy is greater than their demagnetizable field for use as cylindrical memory elements
JPS57100627A (en) * 1980-12-12 1982-06-22 Teijin Ltd Manufacture of vertical magnetic recording medium
US4414087A (en) * 1983-01-31 1983-11-08 Meckel Benjamin B Magnetically-assisted sputtering method for producing vertical recording media
JPS61113759A (ja) * 1984-11-09 1986-05-31 Matsushita Electric Ind Co Ltd スパツタリング用タ−ゲツト
JPS61257473A (ja) * 1985-05-08 1986-11-14 Sumitomo Special Metals Co Ltd スパツタリング用タ−ゲツト材

Also Published As

Publication number Publication date
EP0252478B1 (en) 1993-10-06
JPS6314864A (ja) 1988-01-22
DE3787679D1 (de) 1993-11-11
EP0252478A2 (en) 1988-01-13
DE3787679T2 (de) 1994-05-05
US4832810A (en) 1989-05-23
EP0252478A3 (en) 1988-08-24

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