JPH0249017B2 - - Google Patents
Info
- Publication number
- JPH0249017B2 JPH0249017B2 JP56201242A JP20124281A JPH0249017B2 JP H0249017 B2 JPH0249017 B2 JP H0249017B2 JP 56201242 A JP56201242 A JP 56201242A JP 20124281 A JP20124281 A JP 20124281A JP H0249017 B2 JPH0249017 B2 JP H0249017B2
- Authority
- JP
- Japan
- Prior art keywords
- etching
- layer
- recess
- substrate
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/76224—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using trench refilling with dielectric materials
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Local Oxidation Of Silicon (AREA)
- Drying Of Semiconductors (AREA)
- Element Separation (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20124281A JPS58102539A (ja) | 1981-12-14 | 1981-12-14 | 半導体装置の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20124281A JPS58102539A (ja) | 1981-12-14 | 1981-12-14 | 半導体装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58102539A JPS58102539A (ja) | 1983-06-18 |
| JPH0249017B2 true JPH0249017B2 (en, 2012) | 1990-10-26 |
Family
ID=16437691
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20124281A Granted JPS58102539A (ja) | 1981-12-14 | 1981-12-14 | 半導体装置の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58102539A (en, 2012) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0770517B2 (ja) * | 1986-02-07 | 1995-07-31 | 日本電信電話株式会社 | エツチングによる平坦化膜の形成方法 |
| JP2001326273A (ja) | 2000-05-16 | 2001-11-22 | Denso Corp | 半導体装置の製造方法 |
| JP7070392B2 (ja) * | 2018-12-25 | 2022-05-18 | 株式会社デンソー | 半導体装置の製造方法 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5664453A (en) * | 1979-10-31 | 1981-06-01 | Chiyou Lsi Gijutsu Kenkyu Kumiai | Manufacture of semiconductor device |
-
1981
- 1981-12-14 JP JP20124281A patent/JPS58102539A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58102539A (ja) | 1983-06-18 |
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