JPH0248192B2 - - Google Patents

Info

Publication number
JPH0248192B2
JPH0248192B2 JP61140284A JP14028486A JPH0248192B2 JP H0248192 B2 JPH0248192 B2 JP H0248192B2 JP 61140284 A JP61140284 A JP 61140284A JP 14028486 A JP14028486 A JP 14028486A JP H0248192 B2 JPH0248192 B2 JP H0248192B2
Authority
JP
Japan
Prior art keywords
epoxy resin
adhesive
curing
epoxy
composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP61140284A
Other languages
English (en)
Japanese (ja)
Other versions
JPS62297377A (ja
Inventor
Tadashi Ashida
Koichi Handa
Takeo Kobayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Zeon Corp
Nissan Motor Co Ltd
Original Assignee
Nissan Motor Co Ltd
Nippon Zeon Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nissan Motor Co Ltd, Nippon Zeon Co Ltd filed Critical Nissan Motor Co Ltd
Priority to JP61140284A priority Critical patent/JPS62297377A/ja
Priority to DE19873720443 priority patent/DE3720443A1/de
Publication of JPS62297377A publication Critical patent/JPS62297377A/ja
Publication of JPH0248192B2 publication Critical patent/JPH0248192B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/04—Macromolecular compounds according to groups C08L7/00 - C08L49/00, or C08L55/00 - C08L57/00; Derivatives thereof

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
JP61140284A 1986-06-18 1986-06-18 エポキシ樹脂系接着性組成物 Granted JPS62297377A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP61140284A JPS62297377A (ja) 1986-06-18 1986-06-18 エポキシ樹脂系接着性組成物
DE19873720443 DE3720443A1 (de) 1986-06-18 1987-06-19 Klebemasse vom heissfixierungstyp auf der basis eines epoxidharzes

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61140284A JPS62297377A (ja) 1986-06-18 1986-06-18 エポキシ樹脂系接着性組成物

Publications (2)

Publication Number Publication Date
JPS62297377A JPS62297377A (ja) 1987-12-24
JPH0248192B2 true JPH0248192B2 (enrdf_load_stackoverflow) 1990-10-24

Family

ID=15265198

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61140284A Granted JPS62297377A (ja) 1986-06-18 1986-06-18 エポキシ樹脂系接着性組成物

Country Status (2)

Country Link
JP (1) JPS62297377A (enrdf_load_stackoverflow)
DE (1) DE3720443A1 (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100511759B1 (ko) 1999-06-18 2005-08-31 히다치 가세고교 가부시끼가이샤 접착제, 접착부재, 접착부재를 구비한 반도체탑재용배선기판 및 이것을 사용한 반도체장치
JP2009099825A (ja) * 2007-10-18 2009-05-07 Hitachi Chem Co Ltd 半導体装置接着剤用アクリル系樹脂及びアクリル系樹脂組成物

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3201497A (en) * 1961-09-28 1965-08-17 Du Pont Adhesives comprising epoxy-hydroxy polyether resin and epoxy-containing copolymer
GB1138959A (en) * 1965-04-15 1969-01-01 Celanese Coating Company Production of films and shaped articles from epoxide resin compositions
DE2226399A1 (de) * 1972-05-31 1973-12-13 Goldschmidt Ag Th Klebmittel auf epoxidharzbasis

Also Published As

Publication number Publication date
DE3720443C2 (enrdf_load_stackoverflow) 1991-10-02
DE3720443A1 (de) 1987-12-23
JPS62297377A (ja) 1987-12-24

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Legal Events

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