JPH0247108B2 - - Google Patents

Info

Publication number
JPH0247108B2
JPH0247108B2 JP59129761A JP12976184A JPH0247108B2 JP H0247108 B2 JPH0247108 B2 JP H0247108B2 JP 59129761 A JP59129761 A JP 59129761A JP 12976184 A JP12976184 A JP 12976184A JP H0247108 B2 JPH0247108 B2 JP H0247108B2
Authority
JP
Japan
Prior art keywords
bending
rolls
semiconductor device
roll
lead terminal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59129761A
Other languages
English (en)
Japanese (ja)
Other versions
JPS618962A (ja
Inventor
Kaoru Ishihara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP59129761A priority Critical patent/JPS618962A/ja
Publication of JPS618962A publication Critical patent/JPS618962A/ja
Publication of JPH0247108B2 publication Critical patent/JPH0247108B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W70/048—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0092—Treatment of the terminal leads as a separate operation

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP59129761A 1984-06-23 1984-06-23 半導体装置のリ−ド端子折曲げ装置 Granted JPS618962A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59129761A JPS618962A (ja) 1984-06-23 1984-06-23 半導体装置のリ−ド端子折曲げ装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59129761A JPS618962A (ja) 1984-06-23 1984-06-23 半導体装置のリ−ド端子折曲げ装置

Publications (2)

Publication Number Publication Date
JPS618962A JPS618962A (ja) 1986-01-16
JPH0247108B2 true JPH0247108B2 (enExample) 1990-10-18

Family

ID=15017542

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59129761A Granted JPS618962A (ja) 1984-06-23 1984-06-23 半導体装置のリ−ド端子折曲げ装置

Country Status (1)

Country Link
JP (1) JPS618962A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0731204U (ja) * 1993-11-02 1995-06-13 株式会社トキメック 内面加工用旋削工具

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0810741B2 (ja) * 1987-05-07 1996-01-31 山口日本電気株式会社 半導体装置の製造方法
JP2633386B2 (ja) * 1990-11-14 1997-07-23 松下電子工業株式会社 半導体装置の製造方法および半導体装置の製造装置
CN103706730B (zh) * 2013-12-20 2015-08-12 河北汉光重工有限责任公司 一种集成块引脚成型工具

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0731204U (ja) * 1993-11-02 1995-06-13 株式会社トキメック 内面加工用旋削工具

Also Published As

Publication number Publication date
JPS618962A (ja) 1986-01-16

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