JPH0244323U - - Google Patents
Info
- Publication number
- JPH0244323U JPH0244323U JP12341588U JP12341588U JPH0244323U JP H0244323 U JPH0244323 U JP H0244323U JP 12341588 U JP12341588 U JP 12341588U JP 12341588 U JP12341588 U JP 12341588U JP H0244323 U JPH0244323 U JP H0244323U
- Authority
- JP
- Japan
- Prior art keywords
- discharge tube
- processing apparatus
- plasma processing
- porous
- coated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003989 dielectric material Substances 0.000 claims 1
- 239000011247 coating layer Substances 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
Landscapes
- Chemical Vapour Deposition (AREA)
- ing And Chemical Polishing (AREA)
- Drying Of Semiconductors (AREA)
Description
第１図は本考案の一実施例の圧力保持器の詳細
縦断面図、第２図は第１図の圧力保持器を用いた
マイクロ波プラズマ処理装置の要部縦断面図であ
る。
１……圧力保持器、２……試料台、３……試料
、４……マイクロ波発生器、５……導波管、６…
…排気管、６……排気口、７……真空容器、８…
…ポーラス層、９……コーテイング層、１０……
ガス導入口、１１……ガス流出面。
FIG. 1 is a detailed longitudinal sectional view of a pressure holder according to an embodiment of the present invention, and FIG. 2 is a longitudinal sectional view of a main part of a microwave plasma processing apparatus using the pressure holder of FIG. 1. DESCRIPTION OF SYMBOLS 1... Pressure holder, 2... Sample stage, 3... Sample, 4... Microwave generator, 5... Waveguide, 6...
...Exhaust pipe, 6...Exhaust port, 7...Vacuum container, 8...
...Porous layer, 9...Coating layer, 10...
Gas inlet, 11... gas outlet surface.
Claims (1)
することにより気密性を持たせ、前記ポーラス部
分をガス導入経路としたことを特徴とするプラズ
マ処理装置用放電管。 1. A discharge tube for a plasma processing apparatus, characterized in that the discharge tube is coated with a porous dielectric material from both sides to provide airtightness, and the porous portion is used as a gas introduction path.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12341588U JPH0244323U (en) | 1988-09-22 | 1988-09-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12341588U JPH0244323U (en) | 1988-09-22 | 1988-09-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0244323U true JPH0244323U (en) | 1990-03-27 |
Family
ID=31372248
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12341588U Pending JPH0244323U (en) | 1988-09-22 | 1988-09-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0244323U (en) |
-
1988
- 1988-09-22 JP JP12341588U patent/JPH0244323U/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100219873B1 (en) | Apparatus and method for plasma processing | |
| JPH0244323U (en) | ||
| JPS5710629A (en) | Plasma treatment of hollow body | |
| JPS62129061U (en) | ||
| JPS6237055U (en) | ||
| JPS62126362U (en) | ||
| JPS63100827U (en) | ||
| JPS6426374U (en) | ||
| JPS61168630U (en) | ||
| JPH0323303Y2 (en) | ||
| JPH01125357U (en) | ||
| JPS62101859U (en) | ||
| JPS61136537U (en) | ||
| JPS56166377A (en) | Plasma treating method of hollow body | |
| JPS5995259U (en) | Liquid sample introduction device | |
| JPH069490Y2 (en) | Plasma Wafer Plasma Semiconductor | |
| JPH01154630U (en) | ||
| JPS62107439U (en) | ||
| JPH0295234U (en) | ||
| JPH0267637U (en) | ||
| JPS6245830U (en) | ||
| JPH0283017U (en) | ||
| JPH0171438U (en) | ||
| JPS622245U (en) | ||
| JPS62188138U (en) |