JPH0243358B2 - - Google Patents
Info
- Publication number
- JPH0243358B2 JPH0243358B2 JP59128207A JP12820784A JPH0243358B2 JP H0243358 B2 JPH0243358 B2 JP H0243358B2 JP 59128207 A JP59128207 A JP 59128207A JP 12820784 A JP12820784 A JP 12820784A JP H0243358 B2 JPH0243358 B2 JP H0243358B2
- Authority
- JP
- Japan
- Prior art keywords
- manufacturing
- resin
- adhesive layer
- base material
- plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000463 material Substances 0.000 claims description 51
- 238000004519 manufacturing process Methods 0.000 claims description 35
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 32
- 238000007747 plating Methods 0.000 claims description 25
- 239000012790 adhesive layer Substances 0.000 claims description 22
- 239000004020 conductor Substances 0.000 claims description 22
- 229910052802 copper Inorganic materials 0.000 claims description 16
- 239000010949 copper Substances 0.000 claims description 16
- 239000011347 resin Substances 0.000 claims description 12
- 229920005989 resin Polymers 0.000 claims description 12
- 239000011521 glass Substances 0.000 claims description 9
- 239000010410 layer Substances 0.000 claims description 9
- 238000007772 electroless plating Methods 0.000 claims description 7
- 229920001721 polyimide Polymers 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims description 7
- 239000003822 epoxy resin Substances 0.000 claims description 5
- 239000011810 insulating material Substances 0.000 claims description 5
- 229920000647 polyepoxide Polymers 0.000 claims description 5
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 claims description 4
- 239000011162 core material Substances 0.000 claims description 4
- 239000009719 polyimide resin Substances 0.000 claims description 4
- 238000007788 roughening Methods 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims description 3
- 238000007731 hot pressing Methods 0.000 claims description 3
- 230000001590 oxidative effect Effects 0.000 claims description 3
- 239000005011 phenolic resin Substances 0.000 claims description 2
- 229920001187 thermosetting polymer Polymers 0.000 claims description 2
- 230000009477 glass transition Effects 0.000 claims 1
- 238000000034 method Methods 0.000 description 42
- 238000005530 etching Methods 0.000 description 18
- 239000011889 copper foil Substances 0.000 description 16
- 239000010408 film Substances 0.000 description 13
- 239000000654 additive Substances 0.000 description 9
- 239000004744 fabric Substances 0.000 description 7
- 238000007796 conventional method Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000018109 developmental process Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 229910001873 dinitrogen Inorganic materials 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 230000001771 impaired effect Effects 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000005422 blasting Methods 0.000 description 1
- 239000012050 conventional carrier Substances 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 229960003280 cupric chloride Drugs 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 239000000123 paper Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000012508 resin bead Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 235000011121 sodium hydroxide Nutrition 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- 239000012209 synthetic fiber Substances 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 239000006163 transport media Substances 0.000 description 1
- 238000011282 treatment Methods 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12820784A JPS617695A (ja) | 1984-06-21 | 1984-06-21 | 長尺の可撓性両面プリント配線板の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12820784A JPS617695A (ja) | 1984-06-21 | 1984-06-21 | 長尺の可撓性両面プリント配線板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS617695A JPS617695A (ja) | 1986-01-14 |
| JPH0243358B2 true JPH0243358B2 (zh) | 1990-09-28 |
Family
ID=14979126
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12820784A Granted JPS617695A (ja) | 1984-06-21 | 1984-06-21 | 長尺の可撓性両面プリント配線板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS617695A (zh) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63126297A (ja) * | 1986-11-14 | 1988-05-30 | イビデン株式会社 | 多層プリント配線板並びにそれの製造方法と無電解めっき用絶縁剤 |
| JP3426510B2 (ja) * | 1998-07-27 | 2003-07-14 | ペンタックス株式会社 | 内視鏡用高周波スネア |
| JP2004014550A (ja) * | 2002-06-03 | 2004-01-15 | Fcm Kk | 導電性シート |
| JP4549807B2 (ja) * | 2004-10-27 | 2010-09-22 | シャープ株式会社 | 多層プリント配線板の製造方法、多層プリント配線板及び電子装置 |
| JP5108255B2 (ja) * | 2006-05-23 | 2012-12-26 | パナソニック株式会社 | プリント配線板の製造方法 |
| JP2020181852A (ja) * | 2019-04-23 | 2020-11-05 | イビデン株式会社 | コイル基板の製造方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5144745A (zh) * | 1974-08-07 | 1976-04-16 | Etsuchi Torooru Jon |
-
1984
- 1984-06-21 JP JP12820784A patent/JPS617695A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5144745A (zh) * | 1974-08-07 | 1976-04-16 | Etsuchi Torooru Jon |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS617695A (ja) | 1986-01-14 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |