JPH0243354B2 - - Google Patents

Info

Publication number
JPH0243354B2
JPH0243354B2 JP61193007A JP19300786A JPH0243354B2 JP H0243354 B2 JPH0243354 B2 JP H0243354B2 JP 61193007 A JP61193007 A JP 61193007A JP 19300786 A JP19300786 A JP 19300786A JP H0243354 B2 JPH0243354 B2 JP H0243354B2
Authority
JP
Japan
Prior art keywords
solder paste
printed circuit
circuit board
work station
container
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP61193007A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6286893A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS6286893A publication Critical patent/JPS6286893A/ja
Publication of JPH0243354B2 publication Critical patent/JPH0243354B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H05K3/1233—Methods or means for supplying the conductive material and for forcing it through the screen or stencil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0134—Drum, e.g. rotary drum or dispenser with a plurality of openings

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Screen Printers (AREA)
JP61193007A 1985-10-10 1986-08-20 連続はんだペ−スト印刷装置 Granted JPS6286893A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/786,225 US4604966A (en) 1985-10-10 1985-10-10 Continuous solder paste dispenser
US786225 1991-10-31

Publications (2)

Publication Number Publication Date
JPS6286893A JPS6286893A (ja) 1987-04-21
JPH0243354B2 true JPH0243354B2 (enExample) 1990-09-28

Family

ID=25137961

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61193007A Granted JPS6286893A (ja) 1985-10-10 1986-08-20 連続はんだペ−スト印刷装置

Country Status (4)

Country Link
US (1) US4604966A (enExample)
EP (1) EP0218860B1 (enExample)
JP (1) JPS6286893A (enExample)
DE (1) DE3685187D1 (enExample)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4919970A (en) * 1986-09-15 1990-04-24 International Business Machines Corporation Solder deposition control
EP0359867A1 (de) * 1988-09-23 1990-03-28 Siemens Aktiengesellschaft Verfahren zum Herstellen von elektrischen Flachbaugruppen
US5272980A (en) * 1990-08-31 1993-12-28 Dai Nippon Printing Co. Ltd. Alignment method for transfer and alignment device
GB2259661A (en) * 1991-09-18 1993-03-24 Ibm Depositing solder on printed circuit boards
NL9200494A (nl) * 1992-03-17 1993-10-18 Stork X Cel Bv Inrichting voor substraat transport door drukinrichting en zeefdrukmachine.
US5436028A (en) * 1992-07-27 1995-07-25 Motorola, Inc. Method and apparatus for selectively applying solder paste to multiple types of printed circuit boards
US5254362A (en) * 1992-10-23 1993-10-19 Motorola, Inc. Method and apparatus for deposition of solder paste on a printed wiring board
US5342484A (en) * 1993-03-16 1994-08-30 Philip Morris Incorporated Method and apparatus for making banded smoking article wrappers
US5938106A (en) * 1996-08-01 1999-08-17 International Business Machines Corporation Method and apparatus for applying solder and forming solder balls on a substrate
FR2754474B1 (fr) * 1996-10-15 1999-04-30 Novatec Dispositif pour le depot d'un produit visqueux ou pateux sur un substrat a travers les ouvertures d'un pochoir
FR2765813B1 (fr) * 1997-07-11 1999-08-20 Novatec Racle d'application de produits presentant un degre de viscosite important et des caracteristiques de thixotropie sur un substrat pouvant presenter des variations de hauteur, a travers un pochoir, applique au dit substrat
US6138562A (en) * 1998-01-20 2000-10-31 Hertz; Allen D. Vibrational energy waves for assist in the print release process for screen printing
US6142357A (en) * 1998-10-15 2000-11-07 Mcms, Inc. Molded selective solder pallet
US6158338A (en) * 1998-12-22 2000-12-12 Dek Printing Machines Limited Cassette for holding and dispensing a viscous material for use in an apparatus for depositing the viscous material on a substrate
WO2001035703A1 (en) * 1999-11-08 2001-05-17 Speedline Technologies, Inc. Improvements in solder printers
US20020155254A1 (en) * 2001-04-20 2002-10-24 Mcquate William M. Apparatus and method for placing particles in a pattern onto a substrate
EP1598502A3 (en) * 2004-01-08 2007-05-30 D'Hondt, Albert Tile coating apparatus for flooring
US7291226B2 (en) * 2004-09-30 2007-11-06 Lexmark International, Inc. Progressive stencil printing
JP4973686B2 (ja) * 2009-04-17 2012-07-11 パナソニック株式会社 電子部品実装装置および電子部品実装方法
US9426901B2 (en) 2011-10-12 2016-08-23 General Electric Company Patterning method for component boards
WO2015103033A1 (en) * 2013-12-31 2015-07-09 Johnson & Johnson Consumer Companies, Inc. Process for forming a shaped film product
WO2015103030A1 (en) * 2013-12-31 2015-07-09 Johnson & Johnson Consumer Companies, Inc. Process for forming a multi layered shaped film
DE102016219557B4 (de) * 2016-10-07 2019-05-29 Continental Automotive Gmbh Verfahren zum Drucken von Verbindungsmaterialien auf Kontaktflächen auf einem Schaltungsträger
CN110614196A (zh) * 2019-09-25 2019-12-27 安徽信息工程学院 用于pcb板生产的点胶机
CN119049816B (zh) * 2024-08-12 2025-05-27 宿迁奥地迈半导体科技有限公司 一种改进的塑封贴片热压敏电阻器

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2363137A (en) * 1941-06-30 1944-11-21 Howard H Metcalf Method and apparatus for printing
US2928340A (en) * 1957-03-21 1960-03-15 Stein Textile printing machine
US3155034A (en) * 1961-11-01 1964-11-03 Rineglas Inc Silk screen printing press
CH400980A (de) * 1963-03-04 1965-10-31 Schul Josef Schablonendruck-Maschine für Textilbahnen mit endlosem Transportband und Rakelvorrichtung
DE1964182B2 (de) * 1969-12-22 1974-03-21 Mitter & Co, 4815 Schloss Holte Rakelvorrichtung zur Auftragung flüssiger oder pastöser Medien auf Warenbahnen od. dgl., insbesondere für Filmdruckmaschinen
FR2156960A5 (enExample) * 1971-10-12 1973-06-01 Dubuit Louis
DE2300289C2 (de) * 1973-01-04 1985-01-10 Mitter & Co, 4815 Schloss Holte Vorrichtung zum Auftragen flüssiger oder pastöser Farbe für Siebdruckmaschinen
DE2415120A1 (de) * 1974-03-28 1975-10-02 Siemens Ag Verfahren zur herstellung von halbleiterchips tragenden chiptraegern
JPS5116471A (ja) * 1974-07-30 1976-02-09 Tokyo Shibaura Electric Co Handapeesutoinsatsuhoho
US4103615A (en) * 1976-01-14 1978-08-01 Sir James Farmer Norton & Co., Limited Vertical rotary screen printing machine and ink supply therefore
DE7621287U1 (de) * 1976-07-06 1976-10-28 Grundig E.M.V. Elektro-Mechanische Versuchsanstalt Max Grundig, 8510 Fuerth Vorrichtung zum automatischen verloeten von bauteilen auf gedruckten schaltungsplatten
US4102266A (en) * 1977-03-18 1978-07-25 James A. Black Squeegee, ink scoop and flood blade assembly
US4210077A (en) * 1978-01-18 1980-07-01 Svecia Silkcreen Maskiner Ab Printing machine
US4478882A (en) * 1982-06-03 1984-10-23 Italtel Societa Italiana Telecomunicazioni S.P.A. Method for conductively interconnecting circuit components on opposite surfaces of a dielectric layer

Also Published As

Publication number Publication date
JPS6286893A (ja) 1987-04-21
DE3685187D1 (de) 1992-06-11
EP0218860A2 (en) 1987-04-22
US4604966A (en) 1986-08-12
EP0218860B1 (en) 1992-05-06
EP0218860A3 (en) 1989-01-25

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