JPH0240746B2 - - Google Patents

Info

Publication number
JPH0240746B2
JPH0240746B2 JP61138293A JP13829386A JPH0240746B2 JP H0240746 B2 JPH0240746 B2 JP H0240746B2 JP 61138293 A JP61138293 A JP 61138293A JP 13829386 A JP13829386 A JP 13829386A JP H0240746 B2 JPH0240746 B2 JP H0240746B2
Authority
JP
Japan
Prior art keywords
plating
plating liquid
liquid
wafer
flow
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP61138293A
Other languages
English (en)
Japanese (ja)
Other versions
JPS62297493A (ja
Inventor
Junichi Tezuka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Original Assignee
NipponDenso Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NipponDenso Co Ltd filed Critical NipponDenso Co Ltd
Priority to JP13829386A priority Critical patent/JPS62297493A/ja
Publication of JPS62297493A publication Critical patent/JPS62297493A/ja
Publication of JPH0240746B2 publication Critical patent/JPH0240746B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Electroplating Methods And Accessories (AREA)
  • Electrodes Of Semiconductors (AREA)
JP13829386A 1986-06-16 1986-06-16 半導体ウェハー用メッキ装置 Granted JPS62297493A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13829386A JPS62297493A (ja) 1986-06-16 1986-06-16 半導体ウェハー用メッキ装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13829386A JPS62297493A (ja) 1986-06-16 1986-06-16 半導体ウェハー用メッキ装置

Publications (2)

Publication Number Publication Date
JPS62297493A JPS62297493A (ja) 1987-12-24
JPH0240746B2 true JPH0240746B2 (enEXAMPLES) 1990-09-13

Family

ID=15218499

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13829386A Granted JPS62297493A (ja) 1986-06-16 1986-06-16 半導体ウェハー用メッキ装置

Country Status (1)

Country Link
JP (1) JPS62297493A (enEXAMPLES)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5236874A (en) * 1991-03-08 1993-08-17 Motorola, Inc. Method for forming a material layer in a semiconductor device using liquid phase deposition
JP3438387B2 (ja) * 1995-03-16 2003-08-18 株式会社デンソー めっき装置およびめっき方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4418151A (en) * 1981-03-30 1983-11-29 Rohm And Haas Company Assay process with non-boiling denaturation

Also Published As

Publication number Publication date
JPS62297493A (ja) 1987-12-24

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Legal Events

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LAPS Cancellation because of no payment of annual fees