JPH0239099B2 - - Google Patents

Info

Publication number
JPH0239099B2
JPH0239099B2 JP63192863A JP19286388A JPH0239099B2 JP H0239099 B2 JPH0239099 B2 JP H0239099B2 JP 63192863 A JP63192863 A JP 63192863A JP 19286388 A JP19286388 A JP 19286388A JP H0239099 B2 JPH0239099 B2 JP H0239099B2
Authority
JP
Japan
Prior art keywords
wafer
diameter
fixing pin
fixing
slide arm
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP63192863A
Other languages
English (en)
Japanese (ja)
Other versions
JPH01173736A (ja
Inventor
Soshu Ri
Hokyu Kyo
Katsunori Boku
Keishun Yu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KANKOKU DENKI TSUSHIN KOSHA
KANKOKU DENSHI TSUSHIN KENKYUSHO
Original Assignee
KANKOKU DENKI TSUSHIN KOSHA
KANKOKU DENSHI TSUSHIN KENKYUSHO
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KANKOKU DENKI TSUSHIN KOSHA, KANKOKU DENSHI TSUSHIN KENKYUSHO filed Critical KANKOKU DENKI TSUSHIN KOSHA
Publication of JPH01173736A publication Critical patent/JPH01173736A/ja
Publication of JPH0239099B2 publication Critical patent/JPH0239099B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Program-controlled manipulators
    • B25J9/02—Program-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
    • B25J9/04—Program-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
    • B25J9/041—Cylindrical coordinate type
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP63192863A 1987-12-18 1988-08-03 異径ウエハー移送装置 Granted JPH01173736A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR87-14516 1987-12-18
KR1019870014516A KR900006017B1 (ko) 1987-12-18 1987-12-18 가변직경형 웨이퍼운송장치

Publications (2)

Publication Number Publication Date
JPH01173736A JPH01173736A (ja) 1989-07-10
JPH0239099B2 true JPH0239099B2 (https=) 1990-09-04

Family

ID=19267089

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63192863A Granted JPH01173736A (ja) 1987-12-18 1988-08-03 異径ウエハー移送装置

Country Status (3)

Country Link
US (1) US4971512A (https=)
JP (1) JPH01173736A (https=)
KR (1) KR900006017B1 (https=)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0627768U (ja) * 1992-09-17 1994-04-12 セイコー精機株式会社 搬送装置
KR0152324B1 (ko) * 1994-12-06 1998-12-01 양승택 웨이퍼 측면파지 이송 반도체 제조장치
GB9425349D0 (en) * 1994-12-15 1995-02-15 Oxford Plasma Technology Ltd Substrate loading apparatus
US5700046A (en) * 1995-09-13 1997-12-23 Silicon Valley Group, Inc. Wafer gripper
JPH09213769A (ja) * 1996-01-31 1997-08-15 Komatsu Electron Metals Co Ltd 半導体ウェハの搬送装置
CH697146A5 (de) * 1996-10-09 2008-05-15 Tec Sem Ag Greifvorrichtung zur Handhabung von Wafern.
US20030051974A1 (en) * 1997-05-05 2003-03-20 Semitool, Inc. Automated semiconductor processing system
US6053983A (en) * 1997-05-08 2000-04-25 Tokyo Electron, Ltd. Wafer for carrying semiconductor wafers and method detecting wafers on carrier
TW401582B (en) * 1997-05-15 2000-08-11 Tokyo Electorn Limtied Apparatus for and method of transferring substrates
US5951770A (en) * 1997-06-04 1999-09-14 Applied Materials, Inc. Carousel wafer transfer system
US6575737B1 (en) 1997-06-04 2003-06-10 Applied Materials, Inc. Method and apparatus for improved substrate handling
US6468353B1 (en) * 1997-06-04 2002-10-22 Applied Materials, Inc. Method and apparatus for improved substrate handling
US6077026A (en) * 1998-03-30 2000-06-20 Progressive System Technologies, Inc. Programmable substrate support for a substrate positioning system
US6109677A (en) * 1998-05-28 2000-08-29 Sez North America, Inc. Apparatus for handling and transporting plate like substrates
US6167322A (en) 1998-07-10 2000-12-26 Holbrooks; Orville Ray Intelligent wafer handling system and method
WO2000066480A2 (en) * 1999-05-04 2000-11-09 Ade Corporation Edge gripping end effector wafer handling apparatus
JP4402811B2 (ja) * 2000-05-26 2010-01-20 東京エレクトロン株式会社 被処理体の搬送システムおよび被処理体の位置ずれ量の検出方法
EP1217647B1 (en) * 2000-12-21 2006-03-08 Oxford Instruments Plasma Technology Limited Substrate loading apparatus
US6415843B1 (en) 2001-01-10 2002-07-09 Anadigics, Inc. Spatula for separation of thinned wafer from mounting carrier
US7294317B2 (en) * 2001-02-08 2007-11-13 Sd Lizenzverwertungsgesellschaft Mbh & Co. Exothermic reaction system
JP3548153B2 (ja) 2001-11-28 2004-07-28 株式会社東芝 帳票キャリアシート
US7104578B2 (en) * 2002-03-15 2006-09-12 Asm International N.V. Two level end effector
US7181132B2 (en) 2003-08-20 2007-02-20 Asm International N.V. Method and system for loading substrate supports into a substrate holder
US8702142B2 (en) * 2011-01-05 2014-04-22 Electro Scientific Industries, Inc. Apparatus and method for handling a substrate
CN108297121B (zh) * 2018-02-09 2020-08-14 佛山市顺德区瑞良塑料制品有限公司 一种包装盒输送机械手
TW202306064A (zh) * 2021-06-28 2023-02-01 荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 基材處理設備
JP7766657B2 (ja) * 2023-09-21 2025-11-10 株式会社Ｓｃｒｅｅｎホールディングス 基板搬送装置および基板処理装置ならびに基板処理システム

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5790956A (en) * 1980-11-28 1982-06-05 Hitachi Ltd Gripper for wafer
US4410209A (en) * 1982-03-11 1983-10-18 Trapani Silvio P Wafer-handling tool
WO1984003196A1 (en) * 1983-02-14 1984-08-16 Brooks Ass Articulated arm transfer device
US4820930A (en) * 1984-06-20 1989-04-11 Canon Kabushiki Kaisha Photomask positioning device
US4639028A (en) * 1984-11-13 1987-01-27 Economic Development Corporation High temperature and acid resistant wafer pick up device
US4813732A (en) * 1985-03-07 1989-03-21 Epsilon Technology, Inc. Apparatus and method for automated wafer handling
US4789294A (en) * 1985-08-30 1988-12-06 Canon Kabushiki Kaisha Wafer handling apparatus and method
US4808059A (en) * 1986-07-15 1989-02-28 Peak Systems, Inc. Apparatus and method for transferring workpieces

Also Published As

Publication number Publication date
KR890011043A (ko) 1989-08-12
US4971512A (en) 1990-11-20
JPH01173736A (ja) 1989-07-10
KR900006017B1 (ko) 1990-08-20

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