KR890011043A - 가변직경형 웨이퍼운송장치 - Google Patents

가변직경형 웨이퍼운송장치 Download PDF

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Publication number
KR890011043A
KR890011043A KR870014516A KR870014516A KR890011043A KR 890011043 A KR890011043 A KR 890011043A KR 870014516 A KR870014516 A KR 870014516A KR 870014516 A KR870014516 A KR 870014516A KR 890011043 A KR890011043 A KR 890011043A
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KR
South Korea
Prior art keywords
wafer
variable diameter
arm
arm slide
transport apparatus
Prior art date
Application number
KR870014516A
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English (en)
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KR900006017B1 (ko
Inventor
이상수
강봉수
박승교
유형준
Original Assignee
경상현
재단법인 한국전자통신연구소
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 경상현, 재단법인 한국전자통신연구소 filed Critical 경상현
Priority to KR1019870014516A priority Critical patent/KR900006017B1/ko
Priority to JP63192863A priority patent/JPH01173736A/ja
Priority to US07/285,596 priority patent/US4971512A/en
Publication of KR890011043A publication Critical patent/KR890011043A/ko
Application granted granted Critical
Publication of KR900006017B1 publication Critical patent/KR900006017B1/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/02—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
    • B25J9/04—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
    • B25J9/041—Cylindrical coordinate type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer

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  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

내용 없음

Description

가변직경형 웨이퍼운송장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명 가변직경형 웨이퍼운송장치의 전체단면도.
제2도는 본 발명 가변직경형 웨이퍼운송장치의 기계팔지지대로서,
(a)는 기계팔지지대가 가이드샤프트에 설치된 상태를 보인 단면도.
(b)는 (a)의 측면도.
(c)는 기계팔지지대가 가이드샤프트에 스테인레스선 단자가 설치된 상태를 보인 단면도.
제3도는 본 발명 가변직경웨이퍼 운송장치의 기계팔지지대로서,
(a)는 기계팔지지대의 평면도.
(b)는 (a)의 측면도.
(c)는 기계팔지지대의 볼 리테이너의 일부단면도.
제4도는 본 발명 가변직경형 웨이퍼지지대로서,
(a)는 세종류의 판스프링과 웨이퍼고정핀이 설치된 상태를 보인 웨이퍼지지대의 평면도.
(b)는 (a)의 측면도.
(c)는 일곱종류의 판스프링과 웨이퍼고정핀이 설치된 상태를 보인 웨이퍼지지대의 평면도.
(d)는 (c)의 측면도.
제5도는 본 발명 가변직경 웨이퍼 위치고정장치로서,
(a)는 가변직경웨이퍼 위치고정장치의 일부 평면도.
(b)는 정압스프링이 설치되는 상태를 보인 일부발췌 정면도.
(c)는 (a)의 일부 측단면도.
* 도면의 주요부분에 대한 부호의 설명
1 : 운송장치의 장치대 11 : 가이드샤프트
111 : 스테인레스선 112 : 롤러브라켓
113 : 롤러 114 : 풀리
115 : 풀리축 116 : 풀리베아링
117 : 베아링덮게 118 : 기어
12 : 턴테이블 121, 122 : 베아링
123, 127 : 베아링커버 124 : 타이밍벨트
125 : 타이밍벨트풀리 126 : 턴테이블축
128 : 베아링하우징 13 : 암스테핑모터
131 : 피니언기어 14 : 턴테이블 스테핑모터
141 : 스테핑모터하우징 142 : 타이밍 벨트 풀리
20 : 기계팔지지대 21 : 직선운동베아링
22 : 선단자 23 : 선장력조절나사
24 : 선단자고정장치 30 : 기계팔
31 : 암 슬라이드 32 : 충격흡수판
33 : 암 슬라이드 볼 34 : 볼 리테이너
35 : 기계팔 고정브라켓 36 : 암 슬라이드압력조절나사
40 : 가변직경형 웨이퍼지지대 41, 411, 412 : 웨이퍼 고정핀
42 : 판스프링 43 : 웨이퍼 평형핀
44, 441-446 : 웨이퍼 고정핀 45, 451-455 : 판스프링
50 : 웨이퍼위치 고정장치 51 : 스프링지지판
52 : 암 슬라이드정지핀 53 : 정압스프링
54 : 스프링 리테이너 55 : 베아링
56 : 베아링힌지

Claims (8)

  1. 턴테이블(12)에 부착된 직선운동의 기계팔(30)을 이용한 웨이퍼운송장치에 있어서 기계팔(30)의 전단에는 판스프링(45)(451-455)에 부착된 웨이퍼고정핀(44)(441-446)을 설치하고 그 후단에 암 슬라이드(31) 정압스프링(53), 충격흡수판(32) 및 암 슬라이드정지핀(52)을 설치하여 운송기구의 수정없이 각기 다른 직경의 웨이퍼의 중심을 일치시키면서 이송시킬 수 있게한 것을 특징으로 하는 가변직경형 웨이퍼운송장치.
  2. 제1항에 있어서 상기 판스프링(45)(451-455)에 부착된 웨이퍼고정핀(44)(441-446)에 의하여 서로 다른 직경의 웨이퍼중심을 일치시킬 수 있게 한 것을 특징으로 하는 가변직경형 웨이퍼운송장치.
  3. 제1항에 있어서 기계팔(30)의 전단에 고정핀(41)(411)을 설치하고 그 후면에 판스프링(42)에 고정핀(412)을 설치하여 서로 다른 직경의 웨이퍼 중심을 일치시킬 수 있게한 것을 특징으로 하는 가변직경형 웨이퍼운송장치.
  4. 제1항에 있어서 판스프링(45)(451-455)에 설치된 웨이퍼고정핀(44)(441-446)의 높이 위치를 달리하여 서로다른 직경의 웨이퍼중심을 일치시키도록한 것을 특징으로 하는 가변직경형 웨이퍼운송장치.
  5. 제1항에 있어서 암 슬라이드(31)의 후단에 정합스프링(53)을 설치하여 서로다른 직경의 웨이퍼중심을 일치시키도록한 것을 특징으로 하는 가변직경형 웨이퍼운송장치.
  6. 제1항에 있어서 암 슬라이드(31)에 충격흡수판(32)을 설치하여 기계팔(30)의 전후진시 웨이퍼의 충격을 방지할 수 있도록한 것을 특징으로 하는 가변직경형 웨이퍼운송장치.
  7. 제1항에 있어서, 기계판(30)과 암 슬라이드(31) 사이에 볼 리테이너(34)와 암 슬라이드볼(33)을 설치하여 암 슬라이드(31)의 직선운동을 원활하게할 수 있도록한 것을 특징으로 하는 가변직경형 웨이퍼운송장치.
  8. 제1항에 있어서 암 슬라이드(31)의 후단에 암 슬라이드정지핀(52)을 설치하여 기계팔(30)은 직선운동을 계속하고 암 슬라이드(31)는 정지시켜 웨이퍼를 놓아주게한 것을 특징으로 하는 가변직경형 웨이퍼운송장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019870014516A 1987-12-18 1987-12-18 가변직경형 웨이퍼운송장치 KR900006017B1 (ko)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1019870014516A KR900006017B1 (ko) 1987-12-18 1987-12-18 가변직경형 웨이퍼운송장치
JP63192863A JPH01173736A (ja) 1987-12-18 1988-08-03 異径ウエハー移送装置
US07/285,596 US4971512A (en) 1987-12-18 1988-12-16 Transport device for wafers of variable diameter

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019870014516A KR900006017B1 (ko) 1987-12-18 1987-12-18 가변직경형 웨이퍼운송장치

Publications (2)

Publication Number Publication Date
KR890011043A true KR890011043A (ko) 1989-08-12
KR900006017B1 KR900006017B1 (ko) 1990-08-20

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Family Applications (1)

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KR1019870014516A KR900006017B1 (ko) 1987-12-18 1987-12-18 가변직경형 웨이퍼운송장치

Country Status (3)

Country Link
US (1) US4971512A (ko)
JP (1) JPH01173736A (ko)
KR (1) KR900006017B1 (ko)

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JP4097404B2 (ja) * 1999-05-04 2008-06-11 エーディーイー コーポレーション エッジグリッピングエンドエフェクタウエーハハンドリング装置
JP4402811B2 (ja) * 2000-05-26 2010-01-20 東京エレクトロン株式会社 被処理体の搬送システムおよび被処理体の位置ずれ量の検出方法
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Also Published As

Publication number Publication date
JPH01173736A (ja) 1989-07-10
KR900006017B1 (ko) 1990-08-20
JPH0239099B2 (ko) 1990-09-04
US4971512A (en) 1990-11-20

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