JPH0238587A - レーザ加工とウエットエッチングを併用した加工方法 - Google Patents

レーザ加工とウエットエッチングを併用した加工方法

Info

Publication number
JPH0238587A
JPH0238587A JP63187528A JP18752888A JPH0238587A JP H0238587 A JPH0238587 A JP H0238587A JP 63187528 A JP63187528 A JP 63187528A JP 18752888 A JP18752888 A JP 18752888A JP H0238587 A JPH0238587 A JP H0238587A
Authority
JP
Japan
Prior art keywords
melted
substrate
etching
processing
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP63187528A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0453952B2 (de
Inventor
Noboru Morita
昇 森田
Shuichi Ishida
修一 石田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP63187528A priority Critical patent/JPH0238587A/ja
Publication of JPH0238587A publication Critical patent/JPH0238587A/ja
Publication of JPH0453952B2 publication Critical patent/JPH0453952B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B23K26/354—Working by laser beam, e.g. welding, cutting or boring for surface treatment by melting

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Laser Beam Processing (AREA)
  • ing And Chemical Polishing (AREA)
JP63187528A 1988-07-27 1988-07-27 レーザ加工とウエットエッチングを併用した加工方法 Granted JPH0238587A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63187528A JPH0238587A (ja) 1988-07-27 1988-07-27 レーザ加工とウエットエッチングを併用した加工方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63187528A JPH0238587A (ja) 1988-07-27 1988-07-27 レーザ加工とウエットエッチングを併用した加工方法

Publications (2)

Publication Number Publication Date
JPH0238587A true JPH0238587A (ja) 1990-02-07
JPH0453952B2 JPH0453952B2 (de) 1992-08-28

Family

ID=16207664

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63187528A Granted JPH0238587A (ja) 1988-07-27 1988-07-27 レーザ加工とウエットエッチングを併用した加工方法

Country Status (1)

Country Link
JP (1) JPH0238587A (de)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4110745A1 (de) * 1990-04-04 1991-10-10 Mitsubishi Electric Corp Verfahren zur bearbeitung eines keramischen materials
US5185295A (en) * 1990-05-16 1993-02-09 Kabushiki Kaisha Toshiba Method for dicing semiconductor substrates using a laser scribing and dual etch process
WO1994024705A1 (en) * 1993-04-14 1994-10-27 Hitachi Construction Machinery Co., Ltd. Metal sheet processing method and lead frame processing method, and lead frame and semiconductor device manufacturing method and semiconductor device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62202418A (ja) * 1986-03-03 1987-09-07 凸版印刷株式会社 透明電極基板の製造法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62202418A (ja) * 1986-03-03 1987-09-07 凸版印刷株式会社 透明電極基板の製造法

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4110745A1 (de) * 1990-04-04 1991-10-10 Mitsubishi Electric Corp Verfahren zur bearbeitung eines keramischen materials
US5178725A (en) * 1990-04-04 1993-01-12 Mitsubishi Denki Kabushiki Kaisha Method for working ceramic material
DE4110745C2 (de) * 1990-04-04 1997-01-16 Mitsubishi Electric Corp Verfahren zum Materialabtrag an schwer bearbeitbarem, im wesentlichen aus keramischem Material bestehendem Basismaterial
US5185295A (en) * 1990-05-16 1993-02-09 Kabushiki Kaisha Toshiba Method for dicing semiconductor substrates using a laser scribing and dual etch process
WO1994024705A1 (en) * 1993-04-14 1994-10-27 Hitachi Construction Machinery Co., Ltd. Metal sheet processing method and lead frame processing method, and lead frame and semiconductor device manufacturing method and semiconductor device
US5580466A (en) * 1993-04-14 1996-12-03 Hitachi Construction Machinery Co., Ltd. Metal plate processing method, lead frame processing method, lead frame, semiconductor device manufacturing method, and semiconductor device

Also Published As

Publication number Publication date
JPH0453952B2 (de) 1992-08-28

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