JPH0236063B2 - - Google Patents

Info

Publication number
JPH0236063B2
JPH0236063B2 JP57169394A JP16939482A JPH0236063B2 JP H0236063 B2 JPH0236063 B2 JP H0236063B2 JP 57169394 A JP57169394 A JP 57169394A JP 16939482 A JP16939482 A JP 16939482A JP H0236063 B2 JPH0236063 B2 JP H0236063B2
Authority
JP
Japan
Prior art keywords
lid
feed
bonding
lead frame
cover
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP57169394A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5958830A (ja
Inventor
Hiroshi Ushiki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP57169394A priority Critical patent/JPS5958830A/ja
Publication of JPS5958830A publication Critical patent/JPS5958830A/ja
Publication of JPH0236063B2 publication Critical patent/JPH0236063B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)
  • Die Bonding (AREA)
JP57169394A 1982-09-28 1982-09-28 ボンダ−用ワ−ク加熱装置 Granted JPS5958830A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57169394A JPS5958830A (ja) 1982-09-28 1982-09-28 ボンダ−用ワ−ク加熱装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57169394A JPS5958830A (ja) 1982-09-28 1982-09-28 ボンダ−用ワ−ク加熱装置

Publications (2)

Publication Number Publication Date
JPS5958830A JPS5958830A (ja) 1984-04-04
JPH0236063B2 true JPH0236063B2 (enExample) 1990-08-15

Family

ID=15885780

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57169394A Granted JPS5958830A (ja) 1982-09-28 1982-09-28 ボンダ−用ワ−ク加熱装置

Country Status (1)

Country Link
JP (1) JPS5958830A (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4369522B1 (ja) * 2008-10-16 2009-11-25 株式会社新川 基板搬送装置及び基板搬送方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5681945A (en) * 1979-12-07 1981-07-04 Hitachi Ltd Assembling device

Also Published As

Publication number Publication date
JPS5958830A (ja) 1984-04-04

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