JPH0228256B2 - - Google Patents

Info

Publication number
JPH0228256B2
JPH0228256B2 JP59090876A JP9087684A JPH0228256B2 JP H0228256 B2 JPH0228256 B2 JP H0228256B2 JP 59090876 A JP59090876 A JP 59090876A JP 9087684 A JP9087684 A JP 9087684A JP H0228256 B2 JPH0228256 B2 JP H0228256B2
Authority
JP
Japan
Prior art keywords
die
bonding
wire
bonding stage
bonder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59090876A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60235431A (ja
Inventor
Kuniaki Hamada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kaijo Denki Co Ltd
Original Assignee
Kaijo Denki Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kaijo Denki Co Ltd filed Critical Kaijo Denki Co Ltd
Priority to JP59090876A priority Critical patent/JPS60235431A/ja
Publication of JPS60235431A publication Critical patent/JPS60235431A/ja
Publication of JPH0228256B2 publication Critical patent/JPH0228256B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/0711—

Landscapes

  • Wire Bonding (AREA)
  • Die Bonding (AREA)
JP59090876A 1984-05-09 1984-05-09 半導体組立装置 Granted JPS60235431A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59090876A JPS60235431A (ja) 1984-05-09 1984-05-09 半導体組立装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59090876A JPS60235431A (ja) 1984-05-09 1984-05-09 半導体組立装置

Publications (2)

Publication Number Publication Date
JPS60235431A JPS60235431A (ja) 1985-11-22
JPH0228256B2 true JPH0228256B2 (enExample) 1990-06-22

Family

ID=14010682

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59090876A Granted JPS60235431A (ja) 1984-05-09 1984-05-09 半導体組立装置

Country Status (1)

Country Link
JP (1) JPS60235431A (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6286749B1 (en) 1998-01-23 2001-09-11 Hyundai Electronics Industries Co., Ltd. Apparatus for moving a bonding head of a wire bonder in X, Y and Z axial directions

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54152964A (en) * 1978-05-24 1979-12-01 Hitachi Ltd Automatic assembling machine for semiconductor device

Also Published As

Publication number Publication date
JPS60235431A (ja) 1985-11-22

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