JPH0213816B2 - - Google Patents

Info

Publication number
JPH0213816B2
JPH0213816B2 JP57132971A JP13297182A JPH0213816B2 JP H0213816 B2 JPH0213816 B2 JP H0213816B2 JP 57132971 A JP57132971 A JP 57132971A JP 13297182 A JP13297182 A JP 13297182A JP H0213816 B2 JPH0213816 B2 JP H0213816B2
Authority
JP
Japan
Prior art keywords
bonding
cover
wire bonding
lead frame
wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP57132971A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5925232A (ja
Inventor
Hiroshi Ushiki
Tomio Kobayashi
Koichi Orita
Motoaki Kadosawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP57132971A priority Critical patent/JPS5925232A/ja
Publication of JPS5925232A publication Critical patent/JPS5925232A/ja
Publication of JPH0213816B2 publication Critical patent/JPH0213816B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/0711—
    • H10W72/073—
    • H10W72/07337—
    • H10W90/756—

Landscapes

  • Wire Bonding (AREA)
  • Die Bonding (AREA)
JP57132971A 1982-07-31 1982-07-31 ワイヤボンディング装置 Granted JPS5925232A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57132971A JPS5925232A (ja) 1982-07-31 1982-07-31 ワイヤボンディング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57132971A JPS5925232A (ja) 1982-07-31 1982-07-31 ワイヤボンディング装置

Publications (2)

Publication Number Publication Date
JPS5925232A JPS5925232A (ja) 1984-02-09
JPH0213816B2 true JPH0213816B2 (enExample) 1990-04-05

Family

ID=15093772

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57132971A Granted JPS5925232A (ja) 1982-07-31 1982-07-31 ワイヤボンディング装置

Country Status (1)

Country Link
JP (1) JPS5925232A (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63314837A (ja) * 1987-06-18 1988-12-22 Mitsubishi Electric Corp 半導体製造装置
JP2624762B2 (ja) * 1988-03-31 1997-06-25 株式会社東芝 ワイヤボンディング装置
US6818543B2 (en) 2001-08-01 2004-11-16 Lilogix, Inc. Process and apparatus for mounting semiconductor components to substrates and parts therefor
US7578423B1 (en) 2008-06-06 2009-08-25 Asm Technology Singapore Pte Ltd. Assembly for reducing oxidation of semiconductor devices

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5681945A (en) * 1979-12-07 1981-07-04 Hitachi Ltd Assembling device
JPS56161340U (enExample) * 1980-04-28 1981-12-01

Also Published As

Publication number Publication date
JPS5925232A (ja) 1984-02-09

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