JPS5681945A - Assembling device - Google Patents

Assembling device

Info

Publication number
JPS5681945A
JPS5681945A JP15800679A JP15800679A JPS5681945A JP S5681945 A JPS5681945 A JP S5681945A JP 15800679 A JP15800679 A JP 15800679A JP 15800679 A JP15800679 A JP 15800679A JP S5681945 A JPS5681945 A JP S5681945A
Authority
JP
Japan
Prior art keywords
cover
lead frame
frame
pawl
curtain
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15800679A
Other languages
Japanese (ja)
Other versions
JPS6250976B2 (en
Inventor
Yoshio Ohashi
Tadashi Okubo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP15800679A priority Critical patent/JPS5681945A/en
Publication of JPS5681945A publication Critical patent/JPS5681945A/en
Publication of JPS6250976B2 publication Critical patent/JPS6250976B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Abstract

PURPOSE:To prevent the oxidation of the lead frame and to improve the yield rate of the bonding for the subject device by a method wherein a lead frame feed pin and a fixing pawl are placed inside a cover and a curtain of an N2 air stream is provided. CONSTITUTION:The lead frame 2 is fed at pitch (b) on a heat block 3, a pellet 1 is successively fixed on the frame 2 using a tool 10 and they are connected with each other. A feed pin 7 is provided on the lower surface of a coupling bar 15 and the supporting arm 13 of the coupling bar is extended toward outside through the smallest possible window 16 located on the side of the cover 6. The fixing pawl 9 of the frame is also placed inside the cover 6 and the supporting arm 14 of the pawl is also extended toward outside through a window 17. The curtain of the N2 air stream is formed at the inlets of windows 16 and 17 by blowing the N2 gas downward from the tube 18 provided above the cover 6 and the external air is shut off. With this constitution, the oxidation and discoloration of the lead frame is prevented and the bonding yield rate and the quality of the device can be improved.
JP15800679A 1979-12-07 1979-12-07 Assembling device Granted JPS5681945A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15800679A JPS5681945A (en) 1979-12-07 1979-12-07 Assembling device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15800679A JPS5681945A (en) 1979-12-07 1979-12-07 Assembling device

Publications (2)

Publication Number Publication Date
JPS5681945A true JPS5681945A (en) 1981-07-04
JPS6250976B2 JPS6250976B2 (en) 1987-10-28

Family

ID=15662188

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15800679A Granted JPS5681945A (en) 1979-12-07 1979-12-07 Assembling device

Country Status (1)

Country Link
JP (1) JPS5681945A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5925232A (en) * 1982-07-31 1984-02-09 Shinkawa Ltd Bonding device
JPS5958830A (en) * 1982-09-28 1984-04-04 Shinkawa Ltd Heater for work for bonder
JPS60125734U (en) * 1984-01-31 1985-08-24 関西日本電気株式会社 Ponding equipment
JPS61212029A (en) * 1985-03-18 1986-09-20 San Yakin Kogyo Kk Bonding of semiconductor device
JPH0237733A (en) * 1988-07-27 1990-02-07 Toshiba Corp Wire bonding device
WO2010044287A1 (en) * 2008-10-16 2010-04-22 株式会社新川 Substrate conveying apparatus, and substrate conveying method

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4694381B2 (en) * 2006-02-10 2011-06-08 日本電産トーソク株式会社 Work clamp device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5051261A (en) * 1973-09-07 1975-05-08

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5051261A (en) * 1973-09-07 1975-05-08

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5925232A (en) * 1982-07-31 1984-02-09 Shinkawa Ltd Bonding device
JPH0213816B2 (en) * 1982-07-31 1990-04-05 Shinkawa Kk
JPS5958830A (en) * 1982-09-28 1984-04-04 Shinkawa Ltd Heater for work for bonder
JPH0236063B2 (en) * 1982-09-28 1990-08-15 Shinkawa Kk
JPS60125734U (en) * 1984-01-31 1985-08-24 関西日本電気株式会社 Ponding equipment
JPS61212029A (en) * 1985-03-18 1986-09-20 San Yakin Kogyo Kk Bonding of semiconductor device
JPH0237733A (en) * 1988-07-27 1990-02-07 Toshiba Corp Wire bonding device
WO2010044287A1 (en) * 2008-10-16 2010-04-22 株式会社新川 Substrate conveying apparatus, and substrate conveying method
CN102177574A (en) * 2008-10-16 2011-09-07 株式会社新川 Substrate conveying apparatus, and substrate conveying method

Also Published As

Publication number Publication date
JPS6250976B2 (en) 1987-10-28

Similar Documents

Publication Publication Date Title
JPS5681945A (en) Assembling device
GB1047920A (en) Production of 3-cyano-3,5,5-trimethyl-1-cyclohexanone
ES462575A1 (en) Process for the production of silane
DE3168234D1 (en) A process for making ketose sugars
HU9301951D0 (en) Method for producing 2-chlorine-5-(amino-methyl)-pyridine
GB2088865B (en) Process for producing n-(halomethyl) acylamides by reacting the corresponding methoxymethyl compounds with hydrogen halide
SE7902590L (en) ADDITIONAL FUNDS
US4975050A (en) Workpiece heating and feeding device
JPS57114245A (en) Assembling of semiconductor device
JPH023625Y2 (en)
JPS5323575A (en) Production of semicondu ctor device
JPS55162237A (en) Pellet bonding device
JPS5385774A (en) Heat-treatment apparatus
EP0104955A3 (en) Apparatus for and method of drawing wire
JPS57111036A (en) Die bonder
JPS57173180A (en) Electrode supporting device
JPS5386575A (en) Production of semiconductor device
JPS5325360A (en) Production of semiconductor device
JPS5389660A (en) Production apparatus of semiconductor device
JPS5595388A (en) Semiconductor laser device
JPS55165642A (en) Method of assembling semiconductor device
JPS57113239A (en) Ultrasonic wire bonding apparatus
BE902193A (en) PROCESS FOR PRODUCING SINTERABLE LITHIUM ORTHOSILICATE (LI4SIO4) POWDER AND USE THEREOF.
JPS5329584A (en) Winding frame supporting system
JPS5339057A (en) Production of semiconductor single crystal