JPS5681945A - Assembling device - Google Patents
Assembling deviceInfo
- Publication number
- JPS5681945A JPS5681945A JP15800679A JP15800679A JPS5681945A JP S5681945 A JPS5681945 A JP S5681945A JP 15800679 A JP15800679 A JP 15800679A JP 15800679 A JP15800679 A JP 15800679A JP S5681945 A JPS5681945 A JP S5681945A
- Authority
- JP
- Japan
- Prior art keywords
- cover
- lead frame
- frame
- pawl
- curtain
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
- Die Bonding (AREA)
Abstract
PURPOSE:To prevent the oxidation of the lead frame and to improve the yield rate of the bonding for the subject device by a method wherein a lead frame feed pin and a fixing pawl are placed inside a cover and a curtain of an N2 air stream is provided. CONSTITUTION:The lead frame 2 is fed at pitch (b) on a heat block 3, a pellet 1 is successively fixed on the frame 2 using a tool 10 and they are connected with each other. A feed pin 7 is provided on the lower surface of a coupling bar 15 and the supporting arm 13 of the coupling bar is extended toward outside through the smallest possible window 16 located on the side of the cover 6. The fixing pawl 9 of the frame is also placed inside the cover 6 and the supporting arm 14 of the pawl is also extended toward outside through a window 17. The curtain of the N2 air stream is formed at the inlets of windows 16 and 17 by blowing the N2 gas downward from the tube 18 provided above the cover 6 and the external air is shut off. With this constitution, the oxidation and discoloration of the lead frame is prevented and the bonding yield rate and the quality of the device can be improved.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15800679A JPS5681945A (en) | 1979-12-07 | 1979-12-07 | Assembling device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15800679A JPS5681945A (en) | 1979-12-07 | 1979-12-07 | Assembling device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5681945A true JPS5681945A (en) | 1981-07-04 |
JPS6250976B2 JPS6250976B2 (en) | 1987-10-28 |
Family
ID=15662188
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15800679A Granted JPS5681945A (en) | 1979-12-07 | 1979-12-07 | Assembling device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5681945A (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5925232A (en) * | 1982-07-31 | 1984-02-09 | Shinkawa Ltd | Bonding device |
JPS5958830A (en) * | 1982-09-28 | 1984-04-04 | Shinkawa Ltd | Heater for work for bonder |
JPS60125734U (en) * | 1984-01-31 | 1985-08-24 | 関西日本電気株式会社 | Ponding equipment |
JPS61212029A (en) * | 1985-03-18 | 1986-09-20 | San Yakin Kogyo Kk | Bonding of semiconductor device |
JPH0237733A (en) * | 1988-07-27 | 1990-02-07 | Toshiba Corp | Wire bonding device |
WO2010044287A1 (en) * | 2008-10-16 | 2010-04-22 | 株式会社新川 | Substrate conveying apparatus, and substrate conveying method |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4694381B2 (en) * | 2006-02-10 | 2011-06-08 | 日本電産トーソク株式会社 | Work clamp device |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5051261A (en) * | 1973-09-07 | 1975-05-08 |
-
1979
- 1979-12-07 JP JP15800679A patent/JPS5681945A/en active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5051261A (en) * | 1973-09-07 | 1975-05-08 |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5925232A (en) * | 1982-07-31 | 1984-02-09 | Shinkawa Ltd | Bonding device |
JPH0213816B2 (en) * | 1982-07-31 | 1990-04-05 | Shinkawa Kk | |
JPS5958830A (en) * | 1982-09-28 | 1984-04-04 | Shinkawa Ltd | Heater for work for bonder |
JPH0236063B2 (en) * | 1982-09-28 | 1990-08-15 | Shinkawa Kk | |
JPS60125734U (en) * | 1984-01-31 | 1985-08-24 | 関西日本電気株式会社 | Ponding equipment |
JPS61212029A (en) * | 1985-03-18 | 1986-09-20 | San Yakin Kogyo Kk | Bonding of semiconductor device |
JPH0237733A (en) * | 1988-07-27 | 1990-02-07 | Toshiba Corp | Wire bonding device |
WO2010044287A1 (en) * | 2008-10-16 | 2010-04-22 | 株式会社新川 | Substrate conveying apparatus, and substrate conveying method |
CN102177574A (en) * | 2008-10-16 | 2011-09-07 | 株式会社新川 | Substrate conveying apparatus, and substrate conveying method |
Also Published As
Publication number | Publication date |
---|---|
JPS6250976B2 (en) | 1987-10-28 |
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