JPH0233787B2 - - Google Patents

Info

Publication number
JPH0233787B2
JPH0233787B2 JP58136627A JP13662783A JPH0233787B2 JP H0233787 B2 JPH0233787 B2 JP H0233787B2 JP 58136627 A JP58136627 A JP 58136627A JP 13662783 A JP13662783 A JP 13662783A JP H0233787 B2 JPH0233787 B2 JP H0233787B2
Authority
JP
Japan
Prior art keywords
power supply
circuit
phase
electrodes
sputtering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58136627A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6029467A (ja
Inventor
Masao Tanaka
Fumihiko Sato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Anelva Corp
Original Assignee
Anelva Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Anelva Corp filed Critical Anelva Corp
Priority to JP58136627A priority Critical patent/JPS6029467A/ja
Publication of JPS6029467A publication Critical patent/JPS6029467A/ja
Publication of JPH0233787B2 publication Critical patent/JPH0233787B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
JP58136627A 1983-07-26 1983-07-26 スパッタリング装置用電力供給装置 Granted JPS6029467A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58136627A JPS6029467A (ja) 1983-07-26 1983-07-26 スパッタリング装置用電力供給装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58136627A JPS6029467A (ja) 1983-07-26 1983-07-26 スパッタリング装置用電力供給装置

Publications (2)

Publication Number Publication Date
JPS6029467A JPS6029467A (ja) 1985-02-14
JPH0233787B2 true JPH0233787B2 (enExample) 1990-07-30

Family

ID=15179722

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58136627A Granted JPS6029467A (ja) 1983-07-26 1983-07-26 スパッタリング装置用電力供給装置

Country Status (1)

Country Link
JP (1) JPS6029467A (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61207573A (ja) * 1985-03-09 1986-09-13 Matsufumi Takatani 多成分系電力スパツタリング法
JP2678745B2 (ja) * 1985-04-11 1997-11-17 日本高周波 株式会社 定位相差多数負荷供給高周波電源装置
JPH02258976A (ja) * 1988-09-26 1990-10-19 Tokuda Seisakusho Ltd スパッタ装置
JPH02156080A (ja) * 1988-12-09 1990-06-15 Tokuda Seisakusho Ltd スパッタ装置
JP2901634B2 (ja) * 1989-03-20 1999-06-07 株式会社日立製作所 高周波バイアススパッタリング装置及びその方法
JPH0747820B2 (ja) * 1989-09-22 1995-05-24 株式会社日立製作所 成膜装置
WO2001075187A1 (en) * 2000-04-04 2001-10-11 Advanced Energy Industries, Inc. System for driving multiple magnetrons with multiple phase ac
JP4436350B2 (ja) * 2006-09-14 2010-03-24 株式会社アルバック 薄膜形成方法及び薄膜形成装置
JP6004921B2 (ja) * 2012-11-28 2016-10-12 株式会社アルバック スパッタリング装置、薄膜製造方法
JP2014159614A (ja) * 2013-02-19 2014-09-04 Ulvac Japan Ltd スパッタリング装置及びスパッタリング方法

Also Published As

Publication number Publication date
JPS6029467A (ja) 1985-02-14

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