JPS6029467A - スパッタリング装置用電力供給装置 - Google Patents

スパッタリング装置用電力供給装置

Info

Publication number
JPS6029467A
JPS6029467A JP58136627A JP13662783A JPS6029467A JP S6029467 A JPS6029467 A JP S6029467A JP 58136627 A JP58136627 A JP 58136627A JP 13662783 A JP13662783 A JP 13662783A JP S6029467 A JPS6029467 A JP S6029467A
Authority
JP
Japan
Prior art keywords
power supply
phase
circuit
electrodes
sputtering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58136627A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0233787B2 (enExample
Inventor
Masao Tanaka
田中　誠夫
Fumihiko Sato
文彦 佐藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Anelva Corp
Original Assignee
Canon Anelva Corp
Anelva Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Anelva Corp, Anelva Corp filed Critical Canon Anelva Corp
Priority to JP58136627A priority Critical patent/JPS6029467A/ja
Publication of JPS6029467A publication Critical patent/JPS6029467A/ja
Publication of JPH0233787B2 publication Critical patent/JPH0233787B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
JP58136627A 1983-07-26 1983-07-26 スパッタリング装置用電力供給装置 Granted JPS6029467A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58136627A JPS6029467A (ja) 1983-07-26 1983-07-26 スパッタリング装置用電力供給装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58136627A JPS6029467A (ja) 1983-07-26 1983-07-26 スパッタリング装置用電力供給装置

Publications (2)

Publication Number Publication Date
JPS6029467A true JPS6029467A (ja) 1985-02-14
JPH0233787B2 JPH0233787B2 (enExample) 1990-07-30

Family

ID=15179722

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58136627A Granted JPS6029467A (ja) 1983-07-26 1983-07-26 スパッタリング装置用電力供給装置

Country Status (1)

Country Link
JP (1) JPS6029467A (enExample)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61207573A (ja) * 1985-03-09 1986-09-13 Matsufumi Takatani 多成分系電力スパツタリング法
JPS61235916A (ja) * 1985-04-11 1986-10-21 Nippon Koshuha Kk 定位相差多数負荷供給高周波電源装置
JPH02156080A (ja) * 1988-12-09 1990-06-15 Tokuda Seisakusho Ltd スパッタ装置
JPH02247380A (ja) * 1989-03-20 1990-10-03 Hitachi Ltd 高周波バイアススパッタリング装置及びその方法
JPH02258976A (ja) * 1988-09-26 1990-10-19 Tokuda Seisakusho Ltd スパッタ装置
US5116482A (en) * 1989-09-22 1992-05-26 Hitachi, Ltd. Film forming system using high frequency power and power supply unit for the same
WO2001075187A1 (en) * 2000-04-04 2001-10-11 Advanced Energy Industries, Inc. System for driving multiple magnetrons with multiple phase ac
WO2008032570A1 (en) * 2006-09-14 2008-03-20 Ulvac, Inc. Thin film forming method and thin film forming apparatus
JP2014105368A (ja) * 2012-11-28 2014-06-09 Ulvac Japan Ltd スパッタリング装置、薄膜製造方法
JP2014159614A (ja) * 2013-02-19 2014-09-04 Ulvac Japan Ltd スパッタリング装置及びスパッタリング方法

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61207573A (ja) * 1985-03-09 1986-09-13 Matsufumi Takatani 多成分系電力スパツタリング法
JPS61235916A (ja) * 1985-04-11 1986-10-21 Nippon Koshuha Kk 定位相差多数負荷供給高周波電源装置
JPH02258976A (ja) * 1988-09-26 1990-10-19 Tokuda Seisakusho Ltd スパッタ装置
JPH02156080A (ja) * 1988-12-09 1990-06-15 Tokuda Seisakusho Ltd スパッタ装置
JPH02247380A (ja) * 1989-03-20 1990-10-03 Hitachi Ltd 高周波バイアススパッタリング装置及びその方法
US5116482A (en) * 1989-09-22 1992-05-26 Hitachi, Ltd. Film forming system using high frequency power and power supply unit for the same
WO2001075187A1 (en) * 2000-04-04 2001-10-11 Advanced Energy Industries, Inc. System for driving multiple magnetrons with multiple phase ac
WO2008032570A1 (en) * 2006-09-14 2008-03-20 Ulvac, Inc. Thin film forming method and thin film forming apparatus
JP2014105368A (ja) * 2012-11-28 2014-06-09 Ulvac Japan Ltd スパッタリング装置、薄膜製造方法
JP2014159614A (ja) * 2013-02-19 2014-09-04 Ulvac Japan Ltd スパッタリング装置及びスパッタリング方法

Also Published As

Publication number Publication date
JPH0233787B2 (enExample) 1990-07-30

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