JPH0231795Y2 - - Google Patents

Info

Publication number
JPH0231795Y2
JPH0231795Y2 JP1985029007U JP2900785U JPH0231795Y2 JP H0231795 Y2 JPH0231795 Y2 JP H0231795Y2 JP 1985029007 U JP1985029007 U JP 1985029007U JP 2900785 U JP2900785 U JP 2900785U JP H0231795 Y2 JPH0231795 Y2 JP H0231795Y2
Authority
JP
Japan
Prior art keywords
circuit wiring
wiring pattern
flexible
insulating coating
conductive foil
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1985029007U
Other languages
English (en)
Japanese (ja)
Other versions
JPS61144675U (en:Method
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985029007U priority Critical patent/JPH0231795Y2/ja
Publication of JPS61144675U publication Critical patent/JPS61144675U/ja
Application granted granted Critical
Publication of JPH0231795Y2 publication Critical patent/JPH0231795Y2/ja
Expired legal-status Critical Current

Links

JP1985029007U 1985-02-28 1985-02-28 Expired JPH0231795Y2 (en:Method)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985029007U JPH0231795Y2 (en:Method) 1985-02-28 1985-02-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985029007U JPH0231795Y2 (en:Method) 1985-02-28 1985-02-28

Publications (2)

Publication Number Publication Date
JPS61144675U JPS61144675U (en:Method) 1986-09-06
JPH0231795Y2 true JPH0231795Y2 (en:Method) 1990-08-28

Family

ID=30527423

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985029007U Expired JPH0231795Y2 (en:Method) 1985-02-28 1985-02-28

Country Status (1)

Country Link
JP (1) JPH0231795Y2 (en:Method)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015166588A1 (ja) * 2014-05-02 2015-11-05 株式会社メイコー 部品内蔵リジッドフレックス基板

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200638811A (en) * 2004-09-21 2006-11-01 Ibiden Co Ltd Flexible printed wiring board
JP2009302342A (ja) * 2008-06-13 2009-12-24 Denso Corp 多層基板及びその設計方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5649176U (en:Method) * 1979-09-22 1981-05-01
JPS5654607U (en:Method) * 1979-10-01 1981-05-13

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015166588A1 (ja) * 2014-05-02 2015-11-05 株式会社メイコー 部品内蔵リジッドフレックス基板

Also Published As

Publication number Publication date
JPS61144675U (en:Method) 1986-09-06

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