JPH0231795Y2 - - Google Patents
Info
- Publication number
- JPH0231795Y2 JPH0231795Y2 JP1985029007U JP2900785U JPH0231795Y2 JP H0231795 Y2 JPH0231795 Y2 JP H0231795Y2 JP 1985029007 U JP1985029007 U JP 1985029007U JP 2900785 U JP2900785 U JP 2900785U JP H0231795 Y2 JPH0231795 Y2 JP H0231795Y2
- Authority
- JP
- Japan
- Prior art keywords
- circuit wiring
- wiring pattern
- flexible
- insulating coating
- conductive foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000011247 coating layer Substances 0.000 claims description 14
- 239000011888 foil Substances 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 8
- 238000005530 etching Methods 0.000 claims description 4
- 238000000151 deposition Methods 0.000 claims description 2
- 238000005452 bending Methods 0.000 description 21
- 239000012790 adhesive layer Substances 0.000 description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985029007U JPH0231795Y2 (US07943777-20110517-C00090.png) | 1985-02-28 | 1985-02-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985029007U JPH0231795Y2 (US07943777-20110517-C00090.png) | 1985-02-28 | 1985-02-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61144675U JPS61144675U (US07943777-20110517-C00090.png) | 1986-09-06 |
| JPH0231795Y2 true JPH0231795Y2 (US07943777-20110517-C00090.png) | 1990-08-28 |
Family
ID=30527423
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985029007U Expired JPH0231795Y2 (US07943777-20110517-C00090.png) | 1985-02-28 | 1985-02-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0231795Y2 (US07943777-20110517-C00090.png) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015166588A1 (ja) * | 2014-05-02 | 2015-11-05 | 株式会社メイコー | 部品内蔵リジッドフレックス基板 |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7312401B2 (en) * | 2004-09-21 | 2007-12-25 | Ibiden Co., Ltd. | Flexible printed wiring board |
| JP2009302342A (ja) * | 2008-06-13 | 2009-12-24 | Denso Corp | 多層基板及びその設計方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5654607U (US07943777-20110517-C00090.png) * | 1979-10-01 | 1981-05-13 | ||
| JPS5649176B2 (US07943777-20110517-C00090.png) * | 1978-04-24 | 1981-11-20 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5649176U (US07943777-20110517-C00090.png) * | 1979-09-22 | 1981-05-01 |
-
1985
- 1985-02-28 JP JP1985029007U patent/JPH0231795Y2/ja not_active Expired
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5649176B2 (US07943777-20110517-C00090.png) * | 1978-04-24 | 1981-11-20 | ||
| JPS5654607U (US07943777-20110517-C00090.png) * | 1979-10-01 | 1981-05-13 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015166588A1 (ja) * | 2014-05-02 | 2015-11-05 | 株式会社メイコー | 部品内蔵リジッドフレックス基板 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61144675U (US07943777-20110517-C00090.png) | 1986-09-06 |
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