JPH0230838Y2 - - Google Patents

Info

Publication number
JPH0230838Y2
JPH0230838Y2 JP1985008996U JP899685U JPH0230838Y2 JP H0230838 Y2 JPH0230838 Y2 JP H0230838Y2 JP 1985008996 U JP1985008996 U JP 1985008996U JP 899685 U JP899685 U JP 899685U JP H0230838 Y2 JPH0230838 Y2 JP H0230838Y2
Authority
JP
Japan
Prior art keywords
bonding
arm
cam
swinging
diameter cam
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1985008996U
Other languages
English (en)
Japanese (ja)
Other versions
JPS61125049U (enExample
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985008996U priority Critical patent/JPH0230838Y2/ja
Publication of JPS61125049U publication Critical patent/JPS61125049U/ja
Application granted granted Critical
Publication of JPH0230838Y2 publication Critical patent/JPH0230838Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped

Landscapes

  • Wire Bonding (AREA)
JP1985008996U 1985-01-25 1985-01-25 Expired JPH0230838Y2 (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985008996U JPH0230838Y2 (enExample) 1985-01-25 1985-01-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985008996U JPH0230838Y2 (enExample) 1985-01-25 1985-01-25

Publications (2)

Publication Number Publication Date
JPS61125049U JPS61125049U (enExample) 1986-08-06
JPH0230838Y2 true JPH0230838Y2 (enExample) 1990-08-20

Family

ID=30488794

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985008996U Expired JPH0230838Y2 (enExample) 1985-01-25 1985-01-25

Country Status (1)

Country Link
JP (1) JPH0230838Y2 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0525239Y2 (enExample) * 1987-02-28 1993-06-25

Also Published As

Publication number Publication date
JPS61125049U (enExample) 1986-08-06

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