JPH0427168Y2 - - Google Patents

Info

Publication number
JPH0427168Y2
JPH0427168Y2 JP1986198922U JP19892286U JPH0427168Y2 JP H0427168 Y2 JPH0427168 Y2 JP H0427168Y2 JP 1986198922 U JP1986198922 U JP 1986198922U JP 19892286 U JP19892286 U JP 19892286U JP H0427168 Y2 JPH0427168 Y2 JP H0427168Y2
Authority
JP
Japan
Prior art keywords
holder
motor
nut member
capillary
shaft
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1986198922U
Other languages
English (en)
Japanese (ja)
Other versions
JPS63106136U (enExample
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986198922U priority Critical patent/JPH0427168Y2/ja
Publication of JPS63106136U publication Critical patent/JPS63106136U/ja
Application granted granted Critical
Publication of JPH0427168Y2 publication Critical patent/JPH0427168Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers

Landscapes

  • Wire Bonding (AREA)
JP1986198922U 1986-12-27 1986-12-27 Expired JPH0427168Y2 (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986198922U JPH0427168Y2 (enExample) 1986-12-27 1986-12-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986198922U JPH0427168Y2 (enExample) 1986-12-27 1986-12-27

Publications (2)

Publication Number Publication Date
JPS63106136U JPS63106136U (enExample) 1988-07-08
JPH0427168Y2 true JPH0427168Y2 (enExample) 1992-06-30

Family

ID=31160066

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986198922U Expired JPH0427168Y2 (enExample) 1986-12-27 1986-12-27

Country Status (1)

Country Link
JP (1) JPH0427168Y2 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2509365Y2 (ja) * 1990-11-30 1996-09-04 関西日本電気株式会社 ワイヤボンディング装置

Also Published As

Publication number Publication date
JPS63106136U (enExample) 1988-07-08

Similar Documents

Publication Publication Date Title
JPH0427168Y2 (enExample)
JPH0427167Y2 (enExample)
JPH081920B2 (ja) ワイヤボンディング装置
JPH1050736A (ja) ダイボンディング装置のボンディングヘッド
US5599159A (en) Pellet conveying device
JPS56103429A (en) Die bonder
JPH0310669Y2 (enExample)
JPS6229897B2 (enExample)
JP3025855B2 (ja) ボンディング装置におけるチップ供給装置
CN224037820U (zh) 一种超声波金丝球焊机的引线键合装置
JP2682701B2 (ja) スクラブ方法及び装置
JP2676446B2 (ja) ワイヤボンディング方法
JPH0230838Y2 (enExample)
JPS637460B2 (enExample)
JPS63240038A (ja) ワイヤボンデイング装置
JPS63136334U (enExample)
JPH0474860B2 (enExample)
CN113695171A (zh) 高速高精度双点胶装置及其双点胶方法
JP2940259B2 (ja) ボンディング方法
JPH0525240Y2 (enExample)
JPH0630863B2 (ja) 吸着ノズルの回り留め装置
JPS63142641A (ja) ア−ム駆動装置
JPH0566014B2 (enExample)
JPS61131537A (ja) ダイボンデイング方法
JPH09321069A (ja) ペレットボンディング方法及び装置