JPH02297993A - 膜回路装置の製造方法 - Google Patents

膜回路装置の製造方法

Info

Publication number
JPH02297993A
JPH02297993A JP11369090A JP11369090A JPH02297993A JP H02297993 A JPH02297993 A JP H02297993A JP 11369090 A JP11369090 A JP 11369090A JP 11369090 A JP11369090 A JP 11369090A JP H02297993 A JPH02297993 A JP H02297993A
Authority
JP
Japan
Prior art keywords
film resistor
thick film
crack detection
circuit board
crack
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11369090A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0338757B2 (enrdf_load_stackoverflow
Inventor
Takao Ushikubo
牛窪　隆夫
Noriyoshi Ishikawa
石川　範義
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanken Electric Co Ltd
Original Assignee
Sanken Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanken Electric Co Ltd filed Critical Sanken Electric Co Ltd
Priority to JP11369090A priority Critical patent/JPH02297993A/ja
Publication of JPH02297993A publication Critical patent/JPH02297993A/ja
Publication of JPH0338757B2 publication Critical patent/JPH0338757B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards

Landscapes

  • Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Structure Of Printed Boards (AREA)
JP11369090A 1990-04-27 1990-04-27 膜回路装置の製造方法 Granted JPH02297993A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11369090A JPH02297993A (ja) 1990-04-27 1990-04-27 膜回路装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11369090A JPH02297993A (ja) 1990-04-27 1990-04-27 膜回路装置の製造方法

Publications (2)

Publication Number Publication Date
JPH02297993A true JPH02297993A (ja) 1990-12-10
JPH0338757B2 JPH0338757B2 (enrdf_load_stackoverflow) 1991-06-11

Family

ID=14618718

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11369090A Granted JPH02297993A (ja) 1990-04-27 1990-04-27 膜回路装置の製造方法

Country Status (1)

Country Link
JP (1) JPH02297993A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010065503A3 (en) * 2008-12-01 2010-08-12 University Of Massachusetts Lowell Conductive formulations for use in electrical, electronic and rf applications
US9038483B2 (en) 2009-09-08 2015-05-26 University Of Massachusetts Wireless passive radio-frequency strain and displacement sensors

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010065503A3 (en) * 2008-12-01 2010-08-12 University Of Massachusetts Lowell Conductive formulations for use in electrical, electronic and rf applications
US8999431B2 (en) 2008-12-01 2015-04-07 University Of Massachusetts Lowell Conductive formulations for use in electrical, electronic and RF applications
US9038483B2 (en) 2009-09-08 2015-05-26 University Of Massachusetts Wireless passive radio-frequency strain and displacement sensors

Also Published As

Publication number Publication date
JPH0338757B2 (enrdf_load_stackoverflow) 1991-06-11

Similar Documents

Publication Publication Date Title
EP0374466A1 (en) In-line process monitors for thin film wiring
US20050142697A1 (en) Fabrication method of semiconductor integrated circuit device
JP2008028274A (ja) 半導体装置の製造方法
JPH04199651A (ja) 半導体装置およびその製造方法
JPH02297993A (ja) 膜回路装置の製造方法
US11209460B2 (en) Electrical connection device with a short-circuit wiring pattern that reduces connection wirings
US20030137030A1 (en) Die assembly and method for forming a die on a wafer
US6340604B1 (en) Contactor and semiconductor device inspecting method
JP2657315B2 (ja) プローブカード
JP3093216B2 (ja) 半導体装置及びその検査方法
JP2592524B2 (ja) 半導体装置のエージング方法及びエージング用給電ボード並びにエージング装置
CN103558424A (zh) 提升平整度和绝缘性的探针卡
JP2558825B2 (ja) プローブ装置
JPS618939A (ja) 半導体装置
RU2035131C1 (ru) Зондовая головка
JP2884780B2 (ja) Ｔａｂ型半導体装置
JPH04109649A (ja) ハイブリッドｉｃの品質管理方法
JPS6143441A (ja) 半導体装置のテスト方法
JPS61253847A (ja) 高信頼度を有する半導体装置
JPS631097A (ja) 電子部品搭載基板
CN100470802C (zh) 集成电路
JPH0545398A (ja) 回路基板の試験方法
JPH10270521A (ja) 半導体装置の接続孔の抵抗値モニタパターン及びモニタ方法
JPH02284439A (ja) 半導体装置およびその検査方法
JPS62193137A (ja) 半導体装置の製造方法