JPH0227561Y2 - - Google Patents
Info
- Publication number
- JPH0227561Y2 JPH0227561Y2 JP38784U JP38784U JPH0227561Y2 JP H0227561 Y2 JPH0227561 Y2 JP H0227561Y2 JP 38784 U JP38784 U JP 38784U JP 38784 U JP38784 U JP 38784U JP H0227561 Y2 JPH0227561 Y2 JP H0227561Y2
- Authority
- JP
- Japan
- Prior art keywords
- capacitor
- lead wire
- anode
- anode terminal
- terminal plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000003990 capacitor Substances 0.000 claims description 36
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 14
- 239000007787 solid Substances 0.000 claims description 14
- 230000035882 stress Effects 0.000 description 6
- 229910000679 solder Inorganic materials 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 238000003486 chemical etching Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 230000008602 contraction Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- MOFOBJHOKRNACT-UHFFFAOYSA-N nickel silver Chemical compound [Ni].[Ag] MOFOBJHOKRNACT-UHFFFAOYSA-N 0.000 description 1
- 239000010956 nickel silver Substances 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP38784U JPS60113625U (ja) | 1984-01-06 | 1984-01-06 | 非外装チツプ固体電解コンデンサ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP38784U JPS60113625U (ja) | 1984-01-06 | 1984-01-06 | 非外装チツプ固体電解コンデンサ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60113625U JPS60113625U (ja) | 1985-08-01 |
| JPH0227561Y2 true JPH0227561Y2 (US07754267-20100713-C00017.png) | 1990-07-25 |
Family
ID=30472180
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP38784U Granted JPS60113625U (ja) | 1984-01-06 | 1984-01-06 | 非外装チツプ固体電解コンデンサ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60113625U (US07754267-20100713-C00017.png) |
-
1984
- 1984-01-06 JP JP38784U patent/JPS60113625U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60113625U (ja) | 1985-08-01 |
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